公开(公告)号：US11102567B2

公开(公告)日：2021-08-24

申请号：US16362399

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Michael E. Leclerc ,  Brett W. Degner ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniel R. Bloom ,  Daniele de Iuliis ,  Christopher J. Stringer ,  Sung-Ho Tan ,  Markus Diebel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20210029436A1

公开(公告)日：2021-01-28

申请号：US17071819

申请日：2020-10-15

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de luliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US10813236B1

公开(公告)日：2020-10-20

申请号：US16692570

申请日：2019-11-22

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  Danny L. McBroom ,  Houtan R. Farahani ,  Michael D. McBroom ,  Bart K. Andre ,  Sabrina K. Paseman

IPC: H05K5/03 ,  H05K5/02 ,  G06F1/20 ,  G06F1/18 ,  H05K5/04 ,  H05K7/20

Abstract: A housing for an electronic device can include an enclosure at least partially defining an internal volume. The enclosure can include a bottom panel. The housing can also include a tubular frame that includes a first pair of tubular support members extending from the bottom panel and a second pair of tubular support members extending from the bottom panel. The housing can also include a first tubular top frame member disposed outside the internal volume and connected to an end of each of the first pair of tubular support members through an opening defined by the enclosure, and a second tubular top frame member disposed outside the internal volume and connected to an end of each of the second pair of tubular support members through an opening defined by the enclosure.

公开(公告)号：US09831600B1

公开(公告)日：2017-11-28

申请号：US15275216

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Michael E. Leclerc ,  David H. Narajowski ,  Brett W. Degner

IPC: H01R13/62 ,  H01R13/629 ,  H01R13/15

CPC classification number: H01R13/6205 ,  H01R13/2421 ,  H01R2201/06

Abstract: Variable-force contacts that may provide a large and stable contact force in a mated state, may provide a large difference in contact force between the mated and an unmated state, and may reduce stray flux in an unmated state. Examples may replace physical springs with magnetic force for improved reliability. These examples may position the magnets to reduce stray flux in an unmated state.

公开(公告)号：US09608506B2

公开(公告)日：2017-03-28

申请号：US15046194

申请日：2016-02-17

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Bradley J. Hamel ,  David H. Narajowski ,  Jonah A. Harley ,  Michael E. Leclerc ,  Patrick Kessler ,  Samuel Bruce Weiss ,  Storrs T. Hoen

IPC: H02K41/035 ,  H02K7/08 ,  G08B6/00 ,  H04M19/04 ,  H02K33/02

CPC classification number: H02K33/00 ,  G08B6/00 ,  H02K7/08 ,  H02K33/02 ,  H02K35/00 ,  H02K35/02 ,  H02K41/0356 ,  H04M19/047

Abstract: Embodiments described herein may take the form of an electromagnetic actuator that produces a haptic output during operation. Generally, an electromagnetic coil is wrapped around a central magnet array. A shaft passes through the central magnet array, such that the central array may move along the shaft when the proper force is applied. When a current passes through the electromagnetic coil, the coil generates a magnetic field. The coil is stationary with respect to a housing of the actuator, while the central magnet array may move along the shaft within the housing. Thus, excitation of the coil exerts a force on the central magnet array, which moves in response to that force. The direction of the current through the coil determines the direction of the magnetic field and thus the motion of the central magnet array.

公开(公告)号：US12207069B2

公开(公告)日：2025-01-21

申请号：US18094596

申请日：2023-01-09

Applicant: APPLE INC.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  William K. Smith ,  Christopher J. Stringer ,  Daniele De luliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R5/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20240345635A1

公开(公告)日：2024-10-17

申请号：US18757145

申请日：2024-06-27

Applicant: APPLE INC.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: G06F1/18 ,  G06F1/20 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/40 ,  H05K1/02 ,  H05K5/03 ,  H05K7/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (V/O) interface board, an interconnect board, and a power supply unit (PSU).

公开(公告)号：US12055984B2

公开(公告)日：2024-08-06

申请号：US17444269

申请日：2021-08-02

Applicant: Apple Inc.

Inventor： Michael E. Leclerc ,  Brett W. Degner ,  Ian P. Shaeffer

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20

CPC classification number: G06F1/1684 ,  G06F1/181 ,  G06F1/203

Abstract: A computing device can include an enclosure that defines an internal volume and an external surface. An input component can be positioned at the external surface. A processing unit and a memory can be communicatively coupled and disposed within the internal volume. A singular input/output port can be positioned at an orifice defined by the enclosure. The singular input/output port can be communicatively coupled to the processing unit and the memory. The singular input/output port can be configured to receive data and power and configured to output data from the processing unit. The computing device can include an air-moving apparatus to move air along an airflow pathway. The enclosure can include a thermally conductive base.

公开(公告)号：US11971759B2

公开(公告)日：2024-04-30

申请号：US17659999

申请日：2022-04-20

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Eric R. Prather ,  Michael E. Leclerc

IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20 ,  H05K5/02 ,  H05K5/03 ,  H05K5/04

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F1/182 ,  G06F1/188 ,  G06F1/206 ,  H05K5/0221 ,  H05K5/023 ,  H05K5/03 ,  H05K7/20136 ,  G06F2200/201 ,  H05K5/0213 ,  H05K5/0247 ,  H05K5/04 ,  H05K7/20145 ,  H05K7/20172

Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

公开(公告)号：US11665869B2

公开(公告)日：2023-05-30

申请号：US17398941

申请日：2021-08-10

Applicant: Apple Inc.

Inventor： Michael E. Leclerc ,  Kevin J. Ryan ,  Brett W. Degner

IPC: H05K7/20 ,  H04R1/02 ,  H05K5/02 ,  G06F1/20 ,  H04R5/02

CPC classification number: H05K7/20972 ,  G06F1/206 ,  H04R1/028 ,  H05K5/0213 ,  H04R5/02 ,  H04R2499/15

Abstract: This application relates to display devices and the layout/architecture of various internal components to enhance thermal energy management. A display device described herein may include one or more fan assemblies that drive ambient air into the display device to cool heat-generating components of the display device, and also to drive the ambient air, once heated through convectively cooling the heat-generating components, out of the display device. Further, the location of the heat-generating components is such that the heat-generating components upstream relative to the one or more fan assemblies. In this manner, the ambient air can pass over or through the heat-generating components prior to reaching the one or more fan assemblies. Additionally, heat-generating components, such as a backlit device and a power supply unit, are positioned relatively close to vent inlets in the display device. As a result, these heat-generating devices are immediately cooled with the ambient air.