公开(公告)号：US10381300B2

公开(公告)日：2019-08-13

申请号：US15362548

申请日：2016-11-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Chieh Kao ,  Chang-Lin Yeh ,  Yi Chen ,  Sung-Hung Chiang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/02 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538

Abstract: A semiconductor device package includes a substrate, a package body, a via and an interconnect. The substrate includes a surface and a pad on the first surface. The package body covers at least a portion of the surface of the substrate. The via is disposed in the package body and includes a conductive layer and a first intermediate layer. The conductive layer is electrically connected with the pad. The first intermediate layer is adjacent to the conductive layer. The interconnect is disposed on the first intermediate layer.

公开(公告)号：US10074622B2

公开(公告)日：2018-09-11

申请号：US15425723

申请日：2017-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao ,  Chih-Yi Huang ,  Fu-Chen Chu

IPC: H01L23/49 ,  H01L43/02 ,  H01L23/66 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L43/02 ,  H01L2223/6605 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.

公开(公告)号：US20180226314A1

公开(公告)日：2018-08-09

申请号：US15884313

申请日：2018-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01L23/00

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.