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    Method for manufacturing light emitting diode package
    31.
    发明授权
    Method for manufacturing light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US08822277B2

    公开(公告)日：2014-09-02

    申请号：US13903976

    申请日：2013-05-28

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Hou-Te Lin ,  Lung-Hsin Chen

    IPC: H01L21/00

    CPC classification number: H01L33/64 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; providing a substrate and combining the substrate and the engaging frame together to make through holes of the substrate located at lateral sides of the first and second inserting parts respectively, insulating parts of the substrate received in the slots of the engaging frame, and cavities of the substrate receiving the first and second inserting parts; providing LED diodes, and connecting each LED diode electrically to the first and second electrodes; and cutting along the first and second inserting parts to make sides of the first and second inserting parts exposed to ambient air.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括引线框架的接合框架，具有第一和第二电极的电极结构，并且在电极结构之间限定狭缝，每个第一电极包括第一插入部分和每个第二电极， 插入部分 提供基板并将基板和接合框架组合在一起，以分别在位于第一和第二插入部分的侧面处的基板的通孔，分别容纳在接合框架的槽中的基板的绝缘部分和 接收第一和第二插入部件的基板; 提供LED二极管，并将每个LED二极管电连接到第一和第二电极; 并且沿着第一和第二插入部分切割以使第一和第二插入部分的侧面暴露于环境空气。

    Light emitting diode package and method for manufacturing the same
    32.
    发明授权
    Light emitting diode package and method for manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08791493B2

    公开(公告)日：2014-07-29

    申请号：US13955276

    申请日：2013-07-31

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Che-Hsang Huang ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng ,  Yu-Liang Huang

    IPC: H01L33/00

    CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

    Abstract translation: 示例性的发光二极管（LED）封装包括电绝缘基板，嵌入绝缘基板中的电极结构以及分别与电极结构的电极电连接的多个LED芯片。 电极结构包括位于第一和第二电极之间的第一电极，第二电极和第三电极。 第一，第二和第三电极的顶表面露出绝缘衬底的顶表面以支撑LED芯片。 第一和第二电极的底表面露出基板的底表面以与印刷电路板的焊盘连接。 第三电极的底面容纳在基板中。

    Optical lens and backlight module incorporating the same
    36.
    发明授权
    Optical lens and backlight module incorporating the same 有权
    光学透镜和包含其的背光模组

    公开(公告)号：US09465205B2

    公开(公告)日：2016-10-11

    申请号：US14445486

    申请日：2014-07-29

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: F21V5/04 ,  F21V13/14 ,  G02B19/00 ,  F21V7/00 ,  F21V9/16

    CPC classification number: G02B19/0061 ,  F21V5/046 ,  F21V7/0091 ,  F21V9/30 ,  G02B19/0028

    Abstract: An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.

    Abstract translation: 光学透镜包括位于其底部的第一光学表面，位于其顶部并与第一光学表面相对布置的第三光学表面，以及在第一光学表面和第三光学表面之间延伸的第二光学表面。 第三光学表面向下朝向第一光学表面凹陷。 来自LED光源的光通过第一光学表面进入光学透镜，大部分入射光通过第二光学表面直接从光学透镜折射出来，并且进入第三光学表面的入射光的一部分 首先由第三光学表面通过全内反射朝向第二光学表面反射，然后通过第二光学表面折射出光学透镜。 还提供了包括光学透镜的背光模块。

    Lead frame and light emitting diode package having the same
    39.
    发明授权
    Lead frame and light emitting diode package having the same 有权
    引线框架和发光二极管封装具有相同的功能

    公开(公告)号：US09184358B2

    公开(公告)日：2015-11-10

    申请号：US14059463

    申请日：2013-10-22

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Yau-Tzu Jang ,  Yu-Liang Huang ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Hsing-Fen Lo ,  Chao-Hsiung Chang ,  Che-Hsang Huang ,  Yu-Lun Hsieh

    IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60

    CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137

    Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

    Abstract translation: 示例性引线框架包括衬底和接合电极，第一连接电极和嵌入在衬底中的第二连接电极。 接合电极的顶表面包括与第一接合表面间隔开的第一接合表面和第二接合表面。 第一连接电极的顶表面包括与第一连接表面间隔开的第一连接表面和第二连接表面。 接合电极的顶表面，第一连接电极和第二连接电极从基板露出，以支撑并与发光芯片电连接。 发光芯片可以安装在引线框架上并联或串联电连接; 因此，发光芯片可以通过各种方式连接。

    Light emitting diode package with oxidation-resistant metal coating layer
    40.
    发明授权
    Light emitting diode package with oxidation-resistant metal coating layer 有权
    具有抗氧化金属涂层的发光二极管封装

    公开(公告)号：US09048394B2

    公开(公告)日：2015-06-02

    申请号：US14077218

    申请日：2013-11-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

    CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers.

    Abstract translation: 示例性的发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极以及安装在衬底顶表面上的LED管芯。 衬底还包括底面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在第一和第二电极中的每一个的顶面上形成抗氧化金属涂层。 LED管芯通过两个耐氧化金属涂层电连接到第一和第二电极。

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