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公开(公告)号：US09465476B1
公开(公告)日：2016-10-11
申请号：US14498933
申请日：2014-09-26
Applicant: Apple Inc.
Inventor： Shayan Malek , Warren Z. Jones , Dhaval N. Shah
CPC classification number: G06F3/0416 , G06F1/1626 , G06F1/1643 , G06F1/1656 , G06F1/1658 , G06F1/169 , G06F3/0202 , G06F2203/04105
Abstract: An electronic device with seamless protective cover glass is disclosed. In the described embodiments, the cover glass is coupled to the housing such that the cover glass or portions of the cover glass move with respect to the housing. This movement can be used as an interface for receiving user inputs that can be used to provide control signals to the electronic device.
Abstract translation: 公开了一种具有无缝保护罩玻璃的电子设备。 在所描述的实施例中，盖玻璃联接到壳体，使得盖玻璃或盖玻璃的部分相对于壳体移动。 该移动可用作用于接收可用于向电子设备提供控制信号的用户输入的接口。
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公开(公告)号：US09225115B2
公开(公告)日：2015-12-29
申请号：US13913337
申请日：2013-06-07
Applicant: Apple Inc.
Inventor： Shayan Malek , Astoush Y. Shukla , Michael B. Wittenberg
CPC classification number: H01R13/639 , H01R12/7047 , H01R12/79 , H01R43/26 , H05K3/365 , H05K2201/09063 , H05K2203/167 , Y10T29/49126
Abstract: Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled.
Abstract translation: 消耗最少电路板面积的板对板连接器组装简单，并提供了正确连接的明确指示。 一个示例可能消耗最小的面积，因为仅需要保留键和板和连接器中的插槽。 连接器可以容易组装，因为其可以像堆叠部件一样简单，向下推动和转动保持键。 此外，钥匙和整流罩上的第一线和第一线可以在组装之后对准，以提供连接器已被正确组装的清楚指示。
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公开(公告)号：US08993899B2
公开(公告)日：2015-03-31
申请号：US14248150
申请日：2014-04-08
Applicant: Apple Inc.
Inventor： Shayan Malek , Benjamin J. Pope , Daniel W. Jarvis , Tang Yew Tan , Richard H. Dinh , Robert J. Steinfeld , Ramachandran Chundru
CPC classification number: H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。
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公开(公告)号：US08952272B2
公开(公告)日：2015-02-10
申请号：US13631236
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Shayan Malek , Scott A. Myers , Michael B. Wittenberg
IPC: H05K9/00
CPC classification number: H05K9/0032
Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.
Abstract translation: 模制屏蔽件的一个实施例可以包括符合并接收电气部件的空腔，适合和接收金属框架的狭缝以及耦合到模制屏蔽件的顶侧和侧面的金属层。 在一个实施例中，模制的屏蔽可以由硅形成，并且可以包括用于增强导电性的材料。 模制的屏蔽件可以耦合到金属框架，金属框架又可以耦合到地面，所得到的结构用于减少电气排放。 模制的屏蔽件可以通过传导将热量从电气部件传送出去。
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公开(公告)号：US20140331741A1
公开(公告)日：2014-11-13
申请号：US13892748
申请日：2013-05-13
Applicant: APPLE INC.
Inventor： Dhaval N. Shah , Shayan Malek , Vivek Katiyar
IPC: G01N3/30
CPC classification number: G01N3/30 , G01L1/2262 , G01L1/2287 , G01M5/0033 , G01M99/00 , G01N3/303 , G01N2033/0078 , G01P15/0891 , G06F1/1633 , H04M1/0277 , H04M1/185 , H04M2250/12
Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.
Abstract translation: 电子设备可以包含安装在诸如印刷电路板的一个或多个基板上的电气部件。 在跌落事件期间，印刷电路板和部件可能受到应力。 应变计可以由嵌入印刷电路板的电介质层中的金属迹线形成。 应变计可用于在板上的各个位置进行应力测量。 应答数据可以响应于来自加速度计的数据而被收集，表示该设备已被丢弃。 响应于确定设备已经撞击到外部表面，可以停止压力数据收集。 可以使用加速度计数据，应变计输出或其他传感器数据检测冲击。 应力数据可以由电子设备或外部设备分析。
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Patent Agency Ranking
公开(公告)号：US08794775B2
公开(公告)日：2014-08-05
申请号：US13628773
申请日：2012-09-27
Applicant: Apple Inc.
Inventor： Lee E. Hooton , Michael B. Wittenberg , Shayan Malek
IPC: G03B15/03
CPC classification number: G03B15/02 , G03B2215/0567
Abstract: An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures.
Abstract translation: 电子设备可以设置有诸如包含发光二极管的照相机光源的电子部件。 在操作期间，发光二极管可能产生热量。 导热弹性体结构可具有诸如与相机光源或其他电子部件的外表面相配合以散发来自电子部件的热量的侧壁的特征。 诸如支架的金属结构可用于将弹性体结构和电子部件朝向用于电子装置的壳体的壁挤压。 支撑结构可以插入在壳体的壁和弹性体结构之间。 支撑结构可以具有与壳体壁中的开口对准的开口。 插入结构可以被容纳在支撑结构内的开口内。 电子部件可以与插入结构和支撑结构中的开口对准。
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37.发明申请Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits 有权用于耦合印刷电路的电磁干扰屏蔽和应变消除结构公开(公告)号：US20140177180A1
公开(公告)日：2014-06-26
申请号：US13726509
申请日：2012-12-24
Applicant: APPLE INC.
Inventor： Shayan Malek , Michael B. Wittenberg , Sawyer I. Cohen , Ashutosh Y. Shukla
CPC classification number: H05K1/0219 , H01R12/79 , H01R13/6595 , H05K3/363 , H05K3/368 , H05K7/142 , H05K9/0022 , H05K2201/0311 , H05K2201/0314 , H05K2201/09063 , H05K2201/10189 , H05K2201/10409 , Y10T29/49126
Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.
Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。
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公开(公告)号：US20140113475A1
公开(公告)日：2014-04-24
申请号：US13913337
申请日：2013-06-07
Applicant: Apple Inc.
Inventor： Shayan Malek , Ashutoshl Y. Shukla , Michael B. Wittenberg
IPC: H01R13/639 , H05K3/36 , H01R43/26
CPC classification number: H01R13/639 , H01R12/7047 , H01R12/79 , H01R43/26 , H05K3/365 , H05K2201/09063 , H05K2203/167 , Y10T29/49126
Abstract: Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled.
Abstract translation: 消耗最少电路板面积的板对板连接器组装简单，并提供了正确连接的明确指示。 一个示例可能消耗最小的面积，因为仅需要保留键和板和连接器中的插槽。 连接器可以容易组装，因为其可以像堆叠部件一样简单，向下推动和转动保持键。 此外，钥匙和整流罩上的第一线和第一线可以在组装之后对准，以提供连接器已被正确组装的清楚指示。
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公开(公告)号：US20140092532A1
公开(公告)日：2014-04-03
申请号：US13632096
申请日：2012-09-30
Applicant: APPLE INC.
Inventor： Jared M. Kole , Michael Benjamin Wittenberg , Shayan Malek
CPC classification number: G06F1/1637 , G06F1/1626 , H04M1/0249 , Y10T29/49826
Abstract: Systems and methods for securing components of an electronic device are provided. In some embodiments, the electronic device may include a housing having an opening, a cover resting on a portion of the electronic device in a first cover position within the opening, and a lock component configured to move within the housing from a first lock position to a second lock position for securing the cover in the first cover position.
Abstract translation: 提供了用于固定电子设备的组件的系统和方法。 在一些实施例中，电子设备可以包括具有开口的壳体，位于开口内的第一盖位置中的盖在电子设备的一部分上的盖，以及锁定构件，其构造成在壳体内从第一锁定位置移动到 第二锁定位置，用于将盖固定在第一盖位置。
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公开(公告)号：US09974180B2
公开(公告)日：2018-05-15
申请号：US14801686
申请日：2015-07-16
Applicant: Apple Inc.
Inventor： Shayan Malek , David A. Pakula , Gregory N. Stephens , Sawyer I. Cohen , Scott A. Myers , Tyler B. Cater , Eric W. Bates
CPC classification number: H05K1/181 , G06F1/1658 , H05K2201/10151 , H05K2201/10219 , H05K2201/10598 , Y02P70/611
Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.
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