公开(公告)号：US06744228B1

公开(公告)日：2004-06-01

申请号：US09613833

申请日：2000-07-11

申请人： Steven P. Cahill ,  Bradley L. Hunter

发明人： Steven P. Cahill ,  Bradley L. Hunter

IPC分类号： H01L2168

CPC分类号： H02K41/031 ,  H02K7/08 ,  H02K7/14 ,  H02K16/00 ,  H02K2201/18

摘要： A high-speed precision positioning apparatus has a stage supported by a platen. The stage is driven by a plurality of drive motors that are co-planar with the stage and arranged symmetrically around the stage. The drive motors apply drive forces directly to the stage without any mechanical contact to the stage. The drive forces impart planar motion to the stage in at least three degrees of freedom of motion. In the remaining three degrees of freedom the motion is constrained by a plurality of fluid bearings that operate between the stage and the platen. The drive motors are configured as magnets, attached to the stage, moving in a gap formed in-between top and bottom stationary coils. Integral force cancellation is implemented by a force cancellation system that applies cancellation forces to the stage. The cancellation forces, which are co-planar with a center of gravity of the stage and any components that move with the stage, cancel forces generated by planar motion of the stage. Interferometric encoders are used as position detectors.

摘要翻译： 高速精密定位装置具有由压板支撑的台架。 舞台由与舞台共面并且围绕舞台对称地布置的多个驱动电动机驱动。 驱动电机将驱动力直接施加到载物台上，而不会与载物台接触。 驱动力以至少三个自由度赋予平台运动。 在剩余的三个自由度中，运动由在台架和压板之间操作的多个流体轴承约束。 驱动电动机被配置为附接到平台的磁体，在形成在顶部和底部固定线圈之间的间隙中移动。 积分力消除由力消除系统实现，该系统将抵消力施加到舞台。 与舞台的重心和与舞台一起移动的任何组件共平行的消除力消除了舞台的平面运动产生的力。 干涉测量编码器用作位置检测器。

公开(公告)号：US06739208B2

公开(公告)日：2004-05-25

申请号：US09932930

申请日：2001-08-21

申请人： Takanori Hyakudomi

发明人： Takanori Hyakudomi

IPC分类号： H01L2168

CPC分类号： H01L21/68742 ,  H01L21/682 ,  H01L21/6875

摘要： In the present invention, a main chuck comprises a table for performing the delivery of a wafer W to and from a pincette and a plurality of lift pins for allowing the wafer W to rise from the surface of the table. At least one lift pin positioned on the side of the pincette is made longer and positioned higher than the other lift pins so as to permit the wafer W to be supported above the table in an inclined manner.

摘要翻译： 在本发明中，主卡盘包括用于执行将晶片W输送到和从卡钳传送的工作台和用于允许晶片W从工作台的表面上升的多个提升销。 至少一个提升销定位在小巧的卡扣上，使其比另一个提升销更高，并定位成高于允许晶片W以倾斜的方式被支撑在工作台上方。

公开(公告)号：US06722840B2

公开(公告)日：2004-04-20

申请号：US10141405

申请日：2002-05-08

申请人： Kazuhiro Fujisawa ,  Yoshifumi Katayama ,  Yasushi Sato

发明人： Kazuhiro Fujisawa ,  Yoshifumi Katayama ,  Yasushi Sato

IPC分类号： H01L2168

CPC分类号： H01L21/67778 ,  Y10S414/141

摘要： A wafer ring supplying and returning apparatus including a magazine that accommodates wafer rings, a jig holder that holds the wafer rings, a drier that causes contraction of the wafer sheets on used wafer rings, and a wafer chucking member that chucks and conveys the wafer rings, and the apparatus further including buffer sections having two (upper and lower) wafer supporting grooves that support wafer rings and a wafer pushing member disposed on or below the wafer chucking member so as to push the wafer rings. The wafer chucking member is disposed so as to face one of the wafer supporting grooves of the buffer sections, and the wafer pushing member is disposed so as to face another one of the wafer supporting grooves.

摘要翻译： 一种晶片环供给和返回装置，包括容纳晶圆环的盒，夹持晶片环的夹具夹持器，使晶片片在所使用的晶片环上收缩的干燥器和夹持并输送晶片环的晶片夹持构件 并且该装置还包括具有支撑晶片环的两个（上，下）晶片支撑槽和设置在晶片夹紧构件上或下方的晶片推动构件以便推动晶片环的缓冲区。 晶片夹持构件配置成面对缓冲区的一个晶片支撑槽，并且晶片推动构件设置成面对另一个晶片支撑槽。

公开(公告)号：US06693790B2

公开(公告)日：2004-02-17

申请号：US10121557

申请日：2002-04-12

申请人： Teruyuki Matsuki ,  Motohide Sugihara ,  Kanichi Kadotani

发明人： Teruyuki Matsuki ,  Motohide Sugihara ,  Kanichi Kadotani

IPC分类号： H01L2168

CPC分类号： H01L21/67017

摘要： Insulative viscous fluid or gel material having low hardness is used for at least a first electricity insulating layer as an insulating layer of a static electricity chuck. Since a holding surface of the first electricity insulating layer is deformed in accordance with a back surface shape of a wafer, a substantially entire surface of the holding surface comes into intimate contact with the wafer uniformly. An exposing surface of the electricity insulating layer may be coated with a second electricity insulating layer having corrosion resistance. With this structure, adhesion between the back surface of the wafer and the static electricity chuck apparatus is enhanced, which reduces the contact thermal resistance, and it is possible to obtain a static electricity chuck apparatus which is capable of controlling temperature of a surface of the wafer with high precision and has high plasma resistance and durability.

摘要翻译： 作为静电卡盘的绝缘层的至少第一电绝缘层使用具有低硬度的绝缘粘性流体或凝胶材料。 由于第一电绝缘层的保持表面根据晶片的背面形状而变形，所以保持表面的大致整个表面均匀地与晶片紧密接触。 电绝缘层的暴露表面可以涂覆有具有耐腐蚀性的第二电绝缘层。 利用这种结构，提高了晶片的背面与静电卡盘装置之间的粘附性，这降低了接触热阻，并且可以获得能够控制表面的温度的静电卡盘装置 晶圆精度高，等离子电阻和耐久性好。

公开(公告)号：US06664549B2

公开(公告)日：2003-12-16

申请号：US10182389

申请日：2002-07-29

申请人： Seiichiro Kobayashi ,  Koichi Koyanagi ,  Teruo Honda ,  Hideo Saeki ,  Masaharu Motohashi

发明人： Seiichiro Kobayashi ,  Koichi Koyanagi ,  Teruo Honda ,  Hideo Saeki ,  Masaharu Motohashi

IPC分类号： H01L2168

CPC分类号： H01L21/6835 ,  B25B11/005 ,  G03F7/707 ,  H01L21/6838

摘要： In a wafer chuck for flatly vacuum-chucking a semiconductor wafer (11) supported by support pins (15) such that a pressure in a suction chamber (13) surrounded by an external wall (12), the upper surface of the external wall (12) is formed to be lower than the upper surfaces of the support pins, and the upper surface of the external wall (12) does not pressure the semiconductor wafer (11), a distance (L1) between the external wall (12) and closest support pins (15a) is up to 1.8 mm, and an alignment pitch. (L2) of the support pins (15) aligned inside the closest support pins (15a) to the external wall (12) is not more than 1.5 times of the distance (L1) between the external wall (12) and the closest support pins (15a).

摘要翻译： 在用于平坦地真空夹持由支撑销（15）支撑的半导体晶片（11）的晶片卡盘中，使得由外壁（12）包围的吸入室（13）中的压力，外壁的上表面 12）形成为比支撑销的上表面低，外壁（12）的上表面不对半导体晶片（11）施加压力，外壁（12）和 最靠近的支撑销（15a）高达1.8mm，并且具有对准间距。 排列在最靠近的支撑销（15a）内的支撑销（15）的外壁（12）的外径（L2）不大于外壁（12）和最靠近的支承销之间的距离（L1）的1.5倍 （15a）。

公开(公告)号：US06634847B1

公开(公告)日：2003-10-21

申请号：US09437745

申请日：1999-11-10

申请人： Seung Soo Yeom

发明人： Seung Soo Yeom

IPC分类号： H01L2168

CPC分类号： H05K13/022 ,  Y10S414/138

摘要： A method and apparatus for picking up module ICs from customer trays utilizes a rotating table. In the apparatus and method, the customer tray is placed on the rotating table, and the rotating table is inclined a predetermined amount. The inclination of the rotating table causes the customer tray, and the module ICs held in the tray, to also be inclined. A grasping apparatus is then used to pick up the module ICs from the customer tray. The pick up apparatus may also be configured to incline the same amount as the rotating table. Once the module ICs have been picked up from the customer tray, they can be delivered to an unloading station, or to a module IC carrier.

摘要翻译： 用于从客户托盘拾取模块IC的方法和装置利用旋转台。 在该装置和方法中，顾客托盘放置在旋转台上，并且旋转台倾斜预定量。 旋转台的倾斜度使客户托盘和托盘中的模块IC也倾斜。 然后使用抓握装置从顾客托盘拾起模块IC。 拾取装置也可以被配置为倾斜与旋转台相同的量。 一旦从客户托盘中取出模块IC，就可以将它们运送到卸载站或模块IC载体。

公开(公告)号：US06589386B1

公开(公告)日：2003-07-08

申请号：US09601993

申请日：2000-08-11

申请人： Norio Maeda ,  Masao Oono ,  Hiroshi Aihara

发明人： Norio Maeda ,  Masao Oono ,  Hiroshi Aihara

IPC分类号： H01L2168

CPC分类号： H01L21/67057

摘要： A device for processing a substrate comprises a processing vessel (1), an outer vessel (2) for surrounding the processing vessel (1) which outer vessel (2) can be sealed, a first supporting member (4) for bringing the substrate (3) into and out from the processing vessel (1) which first supporting member (4) supports the substrate (3) in a standing manner, and a second supporting member (5) for transferring the substrate (3) between the first supporting member (4) which second supporting member (5) is movable up and down within the processing vessel (1). The device processes the entire surface of the substrate (3) uniformly and prevents varying in processing from occurrence.

摘要翻译： 一种用于处理衬底的装置包括处理容器（1），用于包围可容纳外容器（2）的处理容器（1）的外容器（2），用于将衬底（2）的第一支撑构件（4） 3）从第一支撑构件（4）以立式方式支撑基板（3）的处理容器（1）和用于在第一支撑构件（3）之间传送基板（3）的第二支撑构件 （4）所述第二支撑构件（5）能够在处理容器（1）内上下移动。 该装置均匀地处理基板（3）的整个表面，并防止处理中发生变化。

公开(公告)号：US06566770B1

公开(公告)日：2003-05-20

申请号：US09593694

申请日：2000-06-15

申请人： Gen Nakamura

发明人： Gen Nakamura

IPC分类号： H01L2168

CPC分类号： H01H3/022 ,  H01H13/64 ,  H01L21/67276 ,  Y10T307/786

摘要： A semiconductor manufacturing apparatus operable with supply of an electric power from a main electric power source wherein, in response to actuation of an emergency-off switch, the main electric power source is disconnected and, before the disconnection, braking control is made to a member being driven, by use of an electric power from the main electric power source.

摘要翻译： 一种半导体制造装置，其可以从主电源供给电力，其中响应于紧急关闭开关的致动，主电源被断开，并且在断开之前对成员进行制动控制 通过使用来自主电源的电力被驱动。

公开(公告)号：US06561798B2

公开(公告)日：2003-05-13

申请号：US09875277

申请日：2001-06-06

申请人： Vladimir Ivanovich Kuznetsov ,  Bartholomeus Hans L. Lindeboom ,  Ronald Bast ,  Christianus Gerardus M. de Ridder

发明人： Vladimir Ivanovich Kuznetsov ,  Bartholomeus Hans L. Lindeboom ,  Ronald Bast ,  Christianus Gerardus M. de Ridder

IPC分类号： H01L2168

CPC分类号： H01L21/67103 ,  H01L21/681 ,  Y10S414/136

摘要： An apparatus for thermally processing a wafer at an elevated temperature, in which a processing position is bounded at least on one side by a housing part which, in use, is at an elevated temperature, the apparatus being provided with measuring means for determining the position of a wafer in the processing position before and/or during processing, the measuring means being provided with at least one signal processor and at least one signal conductor, the or each signal processor being located at a distance from the processing position in an area of lower temperature, the signal conductor extending through the housing part being at an elevated temperature and extending from a measuring point in or near the processing position to the signal processor for transmitting to the signal processor contactlessly obtained measuring signals, the at least one signal conductor, at least the part extending through the housing part being at an elevated temperature, being heat resistant.

公开(公告)号：US06260282B1

公开(公告)日：2001-07-17

申请号：US09049801

申请日：1998-03-27

申请人： Bausan Yuan ,  Susumu Makinouchi ,  Hideyaki Hashimoto

发明人： Bausan Yuan ,  Susumu Makinouchi ,  Hideyaki Hashimoto

IPC分类号： H01L2168

CPC分类号： G03F7/70358 ,  G03F7/70725

摘要： A positioning system used, by way of example, for lithography, uses the position of the wafer stage as the trajectory command for the reticle fine stage control circuit. The reticle fine stage position is combined with the position of the wafer stage to generate a synchronous error. The reticle fine stage control circuit uses a Jacobian differential transformation to convert the synchronous error into an positional error for the center of gravity of the reticle fine stage. Thus, any inaccuracies due to measurement errors caused by rotation of reticle fine stage are avoided. A controller filter circuit uses the positional error for the center of gravity to calculate the force on the center of gravity that will minimize the synchronous error. The controller filter circuit includes saturation limited integration behavior that minimizes the settling time. A feedforward loop also generates a feedforward force, which reduces settling time, and is combined with the force signal from the controller filter. A force coordinate transformation circuit receives the summed forces and calculates the forces to be generated by the actuators connected to reticle fine stage that will drive reticle fine stage to the desired position to reduce the synchronous error.

摘要翻译： 作为示例，用于光刻的定位系统使用晶片台的位置作为标线片精细级控制电路的轨迹指令。 标线片精细位置与晶片台的位置相结合以产生同步误差。 光栅精细级控制电路使用雅可比差分变换将同步误差转换为光罩精细级的重心的位置误差。 因此，避免了由于光罩精细台的旋转引起的测量误差导致的任何不准确。 控制器滤波器电路使用重心的位置误差来计算重心的力，这将使同步误差最小化。 控制器滤波器电路包括使稳定时间最小化的饱和有限积分行为。 前馈回路还产生一个前馈力，这减少了建立时间，并与来自控制器滤波器的力信号相结合。 力坐标变换电路接收累加力并计算由连接到标线片精细台的致动器产生的力，该致动器能将光栅精细级驱动到所需位置以减小同步误差。