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公开(公告)号：US07365007B2
公开(公告)日：2008-04-29
申请号：US10882468
申请日：2004-06-30
申请人： Jiun Hann Sir
发明人： Jiun Hann Sir
IPC分类号： H01L21/4763
CPC分类号： H01L21/76844 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2924/15311 , H05K3/424 , H05K2201/0329 , H05K2201/09563 , H05K2201/096 , H05K2203/0796 , H01L2924/00014
摘要： Embodiments include an interconnect or trace of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a via formed on the dielectric layer and to the contact surface. The via sidewalls and perimeter are layered with a manganese oxide (MnO2) layer which is layered over with a conductive polymer material. An interconnect material is formed in the via and in a trench above the perimeter of the via such that the interconnect material is on the conductive polymer material and contacts the contact surface. An additional dielectric layer may be formed over the interconnect material and an additional via may be formed therethrough so that an additional structure having a MnO2 layer, conductive polymer material, and interconnect material can be formed in the additional via and to the interconnect material.
摘要翻译： 实施例包括具有接触表面的导电材料的互连或迹线，以及覆盖接触表面的电介质层与形成在电介质层和接触表面上的通孔。 通孔侧壁和周边用与导电聚合物材料层叠的氧化锰（MnO 2 N 2）层层叠。 互连材料形成在通孔的上部和通孔周边的沟槽中，使得互连材料在导电聚合物材料上并与接触表面接触。 可以在互连材料上形成另外的介电层，并且可以通过其形成另外的通孔，使得可以在另外的附加结构中形成具有MnO 2层，导电聚合物材料和互连材料的附加结构 通孔和互连材料。
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公开(公告)号：US07186923B2
公开(公告)日：2007-03-06
申请号：US10728423
申请日：2003-12-05
IPC分类号： H05K1/09
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conductive carbon having a mean particle size not greater than about 1 micron and a water-dispersible organic binding agent. The conductive carbon coating formed on the nonconductive surfaces has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 一种印刷电路板，包括由非导电材料分隔的导电层，并且具有形成有导电碳涂层的通孔或其它非导电表面。 导电碳涂层包括平均粒度不大于约1微米的导电碳和水分散性有机粘合剂。 形成在非导电表面上的导电碳涂层具有低电阻，并且足够坚固以电镀并暴露于熔融焊料，而不产生空隙或失去粘合力。
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公开(公告)号：US20040084321A1
公开(公告)日：2004-05-06
申请号：US10728423
申请日：2003-12-05
IPC分类号： C25D005/02
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive surface and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon coatings are disclosed. A conditioning agent is applied to the non-conductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns, combined with an organic binding agent, is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface and dried. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion, yet is easily removable from copper surfaces of the substrate by microetching.
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公开(公告)号：US20030022945A1
公开(公告)日：2003-01-30
申请号：US09915444
申请日：2001-07-26
IPC分类号： B01F003/08
CPC分类号： C09D11/324 , C01P2006/12 , C01P2006/40 , C09C1/56 , C09D11/037 , H05K3/424
摘要： A method for preventing a carbon dispersion from increasing in viscosity during use is described. The dispersion comprises graphite particles or carbon black particles or a combination of both dispersed in a fluid. The method involves lowering the susceptibility of the carbon dispersion to an increase in viscosity or ionic strength by lowering its pH or reducing its exposure to reactive components in the ambient atmospheric gas. The pH can be lowered by at least partially removing ammonia from the dispersion, or by adding a material that reduces the pH of the dispersion. The stability of the dispersion can also be improved by isolating the dispersion from reactive atmospheric gas. The stabilized aqueous carbon dispersion can have a viscosity of less than about 20 cps and a conductivity of less than about 3 mS.
摘要翻译： 描述了在使用期间防止碳分散体粘度增加的方法。 分散体包括石墨颗粒或炭黑颗粒或两者分散在流体中的组合。 该方法包括通过降低其pH或降低其暴露于周围大气气体中的反应性组分来降低碳分散体对粘度或离子强度的增加的敏感性。 可以通过至少部分地从分散体中除去氨，或通过添加降低分散体的pH的材料来降低pH。 分散体的稳定性也可以通过将分散体与活性气体气体隔离来提高。 稳定的含水碳分散体可以具有小于约20cps的粘度和小于约3mS的电导率。
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公开(公告)号：US5725807A
公开(公告)日：1998-03-10
申请号：US486331
申请日：1995-06-07
CPC分类号： H05K3/424 , C25D5/44 , C25D5/54 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 公开了一种将导电碳涂层施加到非导电层，导电碳组合物和具有通过这些碳组合物处理的通孔或其它表面的印刷线路板的方法。 提供了包括由非导电层分开的至少第一和第二导电金属层的板或其他基板。 板具有延伸穿过至少一个金属层进入非导电层的凹部。 凹槽具有期望导电的非导电表面。 分散体中的碳具有不大于约50微米的平均粒度。 该方法通过将碳分散体施加到凹陷的非导电表面上以形成基本连续的导电碳涂层来进行。 任选地，涂层然后固定，留下碳沉积物作为基本连续的导电层。 公开了化学和物理固定步骤。 所得到的涂层具有低的电阻，并且足够坚固地被电镀并暴露于熔融焊料中，而不产生空隙或失去粘合力。
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26.发明授权
公开(公告)号：US5725640A
公开(公告)日：1998-03-10
申请号：US645743
申请日：1996-05-14
IPC分类号： C25D5/34 , C23C18/04 , C23C18/16 , C23C26/00 , C25D5/54 , C25D5/56 , C25D7/00 , H01L21/288 , H05K3/10 , H05K3/22 , H05K3/24 , H05K3/38 , H05K3/42 , C23C22/05 , C23C22/08
摘要： The disclosure relates to treating a self accelerating and replenishing immersion composition on a substrate with a neutralizing and reducing composition comprising an acid and a salt of an inorganic or organic amine, and then electrolytically coating the treated surface with a metal. The salts in one embodiment comprise salts of hydroxylamine or hydrazine and the acid comprises a mineral acid.
摘要翻译： 本公开涉及用包含酸和无机或有机胺的盐的中和和还原组合物在衬底上处理自加速和补充浸渍组合物，然后用金属电解涂覆处理的表面。 一个实施方案中的盐包括羟胺或肼的盐，酸包括无机酸。
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公开(公告)号：US5690805A
公开(公告)日：1997-11-25
申请号：US471871
申请日：1995-06-07
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 公开了一种将导电碳涂层施加到非导电层，导电碳组合物和具有通过这些碳组合物处理的通孔或其它表面的印刷线路板的方法。 提供了包括由非导电层分开的至少第一和第二导电金属层的板或其他基板。 板具有延伸穿过至少一个金属层进入非导电层的凹部。 凹槽具有期望导电的非导电表面。 分散体中的碳具有不大于约50微米的平均粒度。 该方法通过将碳分散体施加到凹陷的非导电表面上以形成基本连续的导电碳涂层来进行。 任选地，涂层然后固定，留下碳沉积物作为基本连续的导电层。 公开了化学和物理固定步骤。 所得到的涂层具有低的电阻，并且足够坚固地被电镀并暴露于熔融焊料中，而不产生空隙或失去粘合力。
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公开(公告)号：US5528000A
公开(公告)日：1996-06-18
申请号：US395685
申请日：1995-02-28
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
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29.发明授权Composition and process for preparing a non-conductive substrate for electroplating 失效用于制备用于电镀的非导电基底的组合物和方法
公开(公告)号：US5389270A
公开(公告)日：1995-02-14
申请号：US062943
申请日：1993-05-17
IPC分类号： C25D5/54 , H05K3/42 , C10M125/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.
摘要翻译： 本发明涉及用于制备用于电镀的非导电基底的改进的组合物和方法。 该组合物包含0.1至20重量％的平均粒度在0.05至50微米范围内的石墨; 0.01至10重量％的用于结合石墨颗粒的水溶性或可分散结合剂; 有效量的用于分散结合的石墨颗粒的阴离子分散剂; pH在4-14范围内; 和水分散介质。 任选地，组合物可以含有一定量的有效润湿通孔的表面活性剂。 所得到的石墨分散体能够在电镀之前均匀地涂覆在双面或多层电路板中的通孔。 在电镀之前用公开的石墨分散体处理的通孔在电镀后没有可见的空隙。
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30.发明授权Through-hole plate printed circuit board with resist and process for manufacturing same 失效通孔板印刷电路板与抗蚀剂及其制造方法相同
公开(公告)号：US5373629A
公开(公告)日：1994-12-20
申请号：US836261
申请日：1992-02-28
申请人： Jurgen Hupe , Walter Kronenberg
发明人： Jurgen Hupe , Walter Kronenberg
IPC分类号： C08G61/10 , C08G61/12 , C25D5/56 , C25D7/00 , H05K3/10 , H05K3/40 , H05K3/42 , H05K3/46 , H01K3/10 , B32B3/10
CPC分类号： H05K3/424 , C08G61/123 , H05K3/4038 , H05K2201/0329 , H05K2203/0796 , H05K2203/107 , H05K2203/122 , H05K2203/1415 , H05K3/108 , H05K3/427 , Y10T29/49144 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/31
摘要： A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric form is electrically conductive,d) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed,whereupon, if desired or required, any residual solution is removed by rinsing, and the through-holes and the circuit pattern image are metallized in one step by galvanic or, preferably, electroless metallization.
摘要翻译： PCT No.PCT / EP90 / 01326 Sec。 一九九二年二月二十八日 102（e）日期1992年2月28日PCT 1990年8月11日PCT PCT。 公开号WO91 / 03920 日本1991年3月21日。描述了一种用于制造基于聚合物基材的通孔电镀单层或多层印刷电路板的工艺，或者在任选地在两侧设置有至少一个光致抗蚀剂层的陶瓷材料 在没有涂覆有导电金属层的那些表面上也用金属层进行电镀或无电镀来暴露导电电路图案，其特征在于：a）所述基板的表面，在钻孔后和随后的机械表面 - 处理，与合适的光致抗蚀剂层合，暴露于光并显影，使得电路图案图像被曝光，b）基板的表面在具有氧化活性的溶液中预处理，c）在通过 将底物引入含有至少一种杂环单体的溶液中，更具体地说是吡咯，噻吩，呋喃或d 以聚合形式导电，d）然后将基底转移到酸性溶液中，由此形成导电聚合物层，然后如果需要或需要，通过冲洗除去任何残留的溶液， 并且通过电流或优选地，无电金属化在一个步骤中对通孔和电路图案图像进行金属化。
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