摘要:
Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.
摘要:
A disk-shaped object of synthetic thermoplastic material has contact surfaces on opposite sides that possess a rough texture. In a method for production of the disk-shaped object, synthetic material is injected under pressure in a plasticized state into a cooled molding tool and removed therefrom after a cooling phase, the molding tool having correspondingly rough molding surfaces to form the rough contact surfaces of the object.
摘要:
A thermoadhesive tape particularly but not exclusively intended for the manufacture of stitch-free items, like for example garments and clothing accessories, comprises weft and warp and at least one filament of thermoadhesive fibre woven with the weft and warp.
摘要:
There are provided an adhesive sheet, exhibiting a specific peel strength and shear peel strength and being composed of a base material (A) comprising a fully aromatic polyimide film having a glass transition temperature of 200° C. or above and a thermal adhesive layer (C) comprising a fully aromatic polyamide having a glass transition temperature of 200-500° C., as well as a laminate composed of the sheet and a process for its production. Also provided is a method of release after treatment of the laminate composed of the adhesive sheet, to obtain a laminate having the target to-be-treated layer.
摘要:
A disk-shaped object of synthetic thermoplastic material has contact surfaces on opposite sides that possess a rough texture. In a method for production of the disk-shaped object, synthetic material is injected under pressure in a plasticized state into a cooled molding tool and removed therefrom after a cooling phase, the molding tool having correspondingly rough molding surfaces to form the rough contact surfaces of the object.
摘要:
An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300° C., a water absorption of 3% by weight or less and a squeeze length of 2 mm or less, (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent; a lead frame with adhesive film; and a semiconductor device wherein the lead frame with adhesive film is bonded to a semiconductor element.
摘要:
Prelaminate pressure-sensitive adhesive (PSA) constructions comprise, a first substrate, a coating or release material on a surface of the first substrate, a PSA layer disposed on the coating of release material, and a detackified layer (DL) disposed on a surface of the PSA layer to form a continuous film covering the PSA layer. In first and second embodiments of the construction the DL is activatable to form a tacky layer on top of the PSA layer for lamination with a second substrate. In a third embodiment, the DL includes constituents that when activated migrate into the PSA layer to expose the PSA layer tacky surface for lamination with a second substrate. The prelaminate PSA constructions are completely nonblocking to a minimum 24 hour blocking temperature of about 50null C. at pressure of about 40 kilopascals, thereby allowing such prelaminate PSA construction to be collected, stored, and or transported before being laminated without adhesive interference occurring between continuous layers. The DL in each embodiment is activatable in less than five seconds to provide a tacky layer having a sufficient open tack time to permit lamination at less than about 100null C.
摘要:
A laminate construction for splicing textile materials together comprising a first layer of heat activated adhesive having a melting point T1 and a second layer of heat activated material having a melting point T2. A support layer is located between the first layer and the second layer, and the support layer has a melting point T3 which is higher than T1 and T2
摘要:
Provided is an adhesive composition, an adhesive product, and a method of preparing an adhesive composition. The adhesive composition including lysine, oxaloacetic acid, and water, wherein the lysine and the oxaloacetic acid are present in the form of an aqueous salt solution and do not form precipitates in the aqueous solution.