公开(公告)号：US20100000653A1

公开(公告)日：2010-01-07

申请号：US12440408

申请日：2007-09-24

Applicant: Thorsten Krawinkel ,  Christian Ring ,  Sevil Ece

Inventor： Thorsten Krawinkel ,  Christian Ring ,  Sevil Ece

IPC: B32B37/02 ,  C08L77/00 ,  C08K5/12 ,  C08K3/32

CPC classification number: H05K3/386 ,  C09J7/10 ,  C09J2463/00 ,  C09J2477/00 ,  H05K1/0393 ,  Y10T156/10

Abstract: Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.

Abstract translation: 特别是用于制造和进一步加工电子部件和导体轨道的热固性胶带，其中至少具有a）具有末端氨基和/或酸基的聚酰胺的粘合剂，b）环氧树脂，c）如果需要，增塑剂 ，聚酰胺在至少150℃的温度下与环氧树脂反应，a）至b）的重量比例在50:50至99:1之间。