公开(公告)号：US20120175757A1

公开(公告)日：2012-07-12

申请号：US13347898

申请日：2012-01-11

Applicant: Takashi Katsuki

Inventor： Takashi Katsuki

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L24/92 ,  F02P3/0453 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48755 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/922 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.

Abstract translation: 根据本发明的方面的半导体装置的制造方法可以包括以下步骤：在引线框架的上表面的预定区域上涂覆焊料，将芯片安装在焊料上并用焊盘熔化焊料，以将芯片接合到 引线框架。 该方法还可以包括使用接合线布线，将引线框倒置，将引线框倒置在加热托架上，涂层焊料熔点低于焊料熔点，并将电子部件安装在焊料上; 并用加热支架熔化焊料，用于将电子部件接合到引线框架。 与焊料的接合可以在高环境温度下进行。 半导体装置的方面可以有助于在引导框架的两个表面上安装半导体装置和电子部件，以分离形成布线电路，而无需通过复杂的制造步骤。

公开(公告)号：US07859522B2

公开(公告)日：2010-12-28

申请号：US11204056

申请日：2005-08-16

Applicant: Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

Inventor： Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano ,  Takashi Katsuki

IPC: G06F3/043

CPC classification number: G06F3/0436

Abstract: A touch panel device includes an excitation transducer for exciting a surface acoustic wave upon application of a burst wave and a reception transducer for receiving the surface acoustic wave and converting the same into a reception signal that are arranged at a peripheral portion of a detection area so that a position of an object touching the detection area is detected in accordance with a change in the reception signal. A control method for eliminating noises in the touch panel device includes the steps of detecting a differential between a reception signal due to a burst wave and another reception signal due to another burst wave, deciding that there is a noise if the detected differential exceeds a preset threshold value, and performing a control operation so that the detection of an object based on the reception signal is not performed in accordance with the decision.

Abstract translation: 一种触摸面板装置包括用于在施加突发波时激发表面声波的激励换能器和用于接收表面声波并将其转换为布置在检测区域的周边部分的接收信号的接收换能器，因此 根据接收信号的变化来检测接触检测区域的物体的位置。 用于消除触摸面板装置中的噪声的控制方法包括以下步骤：检测由于突发波引起的接收信号与由于另一个突发波形引起的另一个接收信号之间的差异，如果检测到的差分超过预设值，则确定存在噪声 阈值，并且执行控制操作，使得根据该决定不执行基于接收信号的对象的检测。

公开(公告)号：US20090156083A1

公开(公告)日：2009-06-18

申请号：US12278697

申请日：2006-02-08

Applicant: Fumihiko Nakazawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Satoshi Sato ,  Satoshi Sasaki ,  Tamotsu Watanabe ,  Kunizo Ogoshi ,  Michiko Endo

Inventor： Fumihiko Nakazawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Satoshi Sato ,  Satoshi Sasaki ,  Tamotsu Watanabe ,  Kunizo Ogoshi ,  Michiko Endo

IPC: H01J9/24

CPC classification number: G06F3/0436 ,  G06F3/0412

Abstract: First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. After the step of forming the first electrodes, piezoelectric elements functioning a SAW touch sensor is formed on a second major surface of the transparent substrate. Furthermore, after the step of forming the piezoelectric elements, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed.Since the first electrodes are formed in the form of stripes, the piezoelectric elements can be prevented from being damaged by an etching solution used at this time. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.

Abstract translation: 部分地配置发光元件的第一电极在透明衬底的第一主表面上以条纹的形式被图案化。 在形成第一电极的步骤之后，在透明基板的第二主表面上形成用作SAW触摸传感器的压电元件。 此外，在形成压电元件的步骤之后，依次执行在预先图案化的第一电极上形成发光元件的形成步骤的发光元件。 由于第一电极形成为条状，因此可以防止压电元件被此时使用的蚀刻溶液损坏。 在形成压电元件之后，由于执行形成发光元件的步骤，可以通过在压电元件的形成中受热来防止发光元件的损坏。

公开(公告)号：US07423636B2

公开(公告)日：2008-09-09

申请号：US11017860

申请日：2004-12-22

Applicant: Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

Inventor： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

IPC: G09G5/00

CPC classification number: G06F3/0436

Abstract: Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.

公开(公告)号：US20070035016A1

公开(公告)日：2007-02-15

申请号：US11500427

申请日：2006-08-08

Applicant: Takayuki Yamaji ,  Hiroshi Ishikawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano

Inventor： Takayuki Yamaji ,  Hiroshi Ishikawa ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa ,  Satoshi Sano

IPC: H01L23/34

CPC classification number: G01C19/5719 ,  B81B2201/0242 ,  B81B2201/042 ,  B81B2207/097 ,  B81C1/00301 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A semiconductor device includes a chip having a base semiconductor layer, an insulation layer provided on the base semiconductor layer, and an upper semiconductor layer provided on the insulation layer; a mounting substrate on which the chip is mounted at the base semiconductor layer; and a connecting portion that electrically couples first terminals provided on the mounting substrate and a surface or second terminals provided thereon of the base semiconductor layer.

Abstract translation: 半导体器件包括具有基底半导体层的芯片，设置在基底半导体层上的绝缘层和设置在绝缘层上的上半导体层; 安装基板，芯片安装在基板半导体层上; 以及连接部，其电连接设置在安装基板上的第一端子和设置在该基底半导体层上的表面或第二端子。

公开(公告)号：US06768484B2

公开(公告)日：2004-07-27

申请号：US10055375

申请日：2002-01-25

Applicant: Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

Inventor： Satoshi Sano ,  Takashi Katsuki ,  Yuji Takahashi ,  Fumihiko Nakazawa

IPC: G09G500

CPC classification number: G06F3/0436

Abstract: In a touch panel device for detecting a position touched by an object by sensing an attenuation or break of surface acoustic waves, in which IDTs for exciting or receiving surface acoustic waves comprising comb-like electrode fingers aligned along confronting bus electrodes are placed on a peripheral area of a substrate, drawing electrodes connected to the bus electrode positioned closer to the center of the substrate and led out to the peripheral area side of the substrate are provided. Each of the IDT regions segmented by the drawing electrodes is constituted by repetition, and the drawing electrodes are disposed so that impedance in each IDT region becomes equal.

Abstract translation: 在用于通过感测表面声波的衰减或断裂来检测由物体触摸的位置的触摸面板装置中，其中用于激励或接收包括梳梳状电极指的表面声波的IDT在对面的总线电极上排列在周边 提供连接到位于更靠近基板的中心并被引出到基板的周边区域的总线电极的引出电极的拉伸电极。 由绘图电极分割的每个IDT区域由重复构成，并且布置电极被布置成使得每个IDT区域中的阻抗变得相等。

公开(公告)号：US6021003A

公开(公告)日：2000-02-01

申请号：US151028

申请日：1998-09-10

Applicant: Takashi Katsuki ,  Ippei Sawaki ,  Michio Miura ,  Satoshi Ueda ,  Fumitaka Abe

Inventor： Takashi Katsuki ,  Ippei Sawaki ,  Michio Miura ,  Satoshi Ueda ,  Fumitaka Abe

IPC: H04N1/04 ,  G02B3/00 ,  G02B3/06 ,  G02B5/18 ,  G02B27/18 ,  G02B27/10

CPC classification number: G02B3/0043 ,  G02B3/005 ,  G02B3/06 ,  G02B5/1876

Abstract: An optical device including an optical imaging system for forming a real image of an object on a light-receiving surface, the optical imaging system including first and second cylindrical lenses and first and second intermediate lenses, each of the intermediate lenses being composed of a plurality of lens elements arrayed in a line, the first and second cylindrical lenses being opposed to each other so that generatrices thereof are parallel to each other, the first and second intermediate lenses being arranged between the first and second cylindrical lenses in a direction of the generatrices so that a light beam emanated from the object is condensed onto the light-receiving surface through the first cylindrical lens, the first intermediate lens, the second intermediate lens and the second cylindrical lens, wherein each of the lens elements is formed of a one-dimensional binary lens having a light-condensing property only in the direction of the generatrices, whereby a real image by the first and second cylindrical lenses and an erect image by the first and second intermediate lenses are formed perpendicular to each other on the light-receiving surface.

Abstract translation: 一种光学装置，包括用于在光接收表面上形成物体的实像的光学成像系统，所述光学成像系统包括第一和第二柱面透镜以及第一和第二中间透镜，每个中间透镜由多个 排列成一行的透镜元件，第一和第二柱面透镜彼此相对，使得它们的母体彼此平行，第一和第二中间透镜沿着母线的方向布置在第一和第二柱面透镜之间 使得从物体发出的光束通过第一柱面透镜，第一中间透镜，第二中间透镜和第二柱面透镜被聚光到受光面上，其中每个透镜元件由单向透镜形成， 具有仅在母线方向上具有聚光特性的二维二元透镜，由此通过图像的真实图像 第一和第二柱面透镜以及第一和第二中间透镜的直立图像在光接收表面上彼此垂直地形成。

公开(公告)号：US09372202B2

公开(公告)日：2016-06-21

申请号：US13618643

申请日：2012-09-14

Applicant: Hiroaki Inoue ,  Takashi Katsuki ,  Fumihiko Nakazawa

Inventor： Hiroaki Inoue ,  Takashi Katsuki ,  Fumihiko Nakazawa

IPC: H05K7/00 ,  G01P15/125 ,  B81C1/00 ,  G01C19/5719 ,  G01P1/02 ,  G01P15/08 ,  H01L21/768 ,  H01L23/48

CPC classification number: G01P15/125 ,  B81C1/00301 ,  G01C19/5719 ,  G01P1/023 ,  G01P15/0802 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.

Abstract translation: 一个实施例的包装装置包括装置层部分，以及第一和第二包装部件。 装置层部是形成有可动部和端子部的可动微型装置的部分。 第一包装部件连接到器件层部分，并且包括设置在与端子部分相对应的位置处的布线区域和延伸穿过布线区域的导电插塞。 第二包装部件与第一包装部件相对的装置层部分的一侧连接。

公开(公告)号：US08800141B2

公开(公告)日：2014-08-12

申请号：US13037762

申请日：2011-03-01

Applicant: Takashi Katsuki ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Osamu Toyoda ,  Satoshi Ueda

Inventor： Takashi Katsuki ,  Takeaki Shimanouchi ,  Masahiko Imai ,  Osamu Toyoda ,  Satoshi Ueda

IPC: H01G7/00

CPC classification number: H01G7/00 ,  H01H57/00 ,  H01R9/00

Abstract: There is provided a method for fabricating a device, preferably for a micro electro electro mechanical system. The method includes forming a first electrode on a substrate, where the first electrode has a first sloped end at least at one end thereof; forming a sacrificial layer on the first electrode, where the sacrificial layer has a first sloped edge, the first sloped edge and the first sloped end are overlapped each other so that a thickness of the first sloped edge decreases as a thickness of the first sloped end increases; forming a first spacer on the first electrode, where the first spacer has contact with the first sloped edge; forming a beam electrode on the sacrificial layer and the first spacer; and removing the sacrificial layer after the forming the beam electrode.

Abstract translation: 提供了一种制造器件的方法，优选用于微机电系统。 该方法包括在基底上形成第一电极，其中第一电极至少在其一端具有第一倾斜端; 在所述第一电极上形成牺牲层，其中所述牺牲层具有第一倾斜边缘，所述第一倾斜边缘和所述第一倾斜端部彼此重叠，使得所述第一倾斜边缘的厚度随着所述第一倾斜端部的厚度而减小 增加 在所述第一电极上形成第一间隔物，其中所述第一间隔件与所述第一倾斜边缘接触; 在所述牺牲层和所述第一间隔物上形成束电极; 并且在形成束电极之后去除牺牲层。

公开(公告)号：US08618715B2

公开(公告)日：2013-12-31

申请号：US13018696

申请日：2011-02-01

Applicant: Takeaki Shimanouchi ,  Masahiko Imai ,  Takashi Katsuki ,  Osamu Toyoda ,  Satoshi Ueda

Inventor： Takeaki Shimanouchi ,  Masahiko Imai ,  Takashi Katsuki ,  Osamu Toyoda ,  Satoshi Ueda

IPC: H02N1/00 ,  G09G3/34

CPC classification number: B81C1/00698 ,  B81B2201/0221 ,  H01G5/18

Abstract: A driving method for driving an electrostatic actuator including a fixed electrode and a movable electrode opposing each other with a dielectric layer interposed therebetween, includes applying a first voltage, between the fixed electrode and the movable electrode, to bring the movable electrode into contact with the dielectric layer, and applying a second voltage, between the fixed electrode and the movable electrode, after application of the first voltage is stopped and before the movable electrode moves away from the dielectric layer. Here, the second voltage has a polarity opposite to a polarity of the first voltage and an absolute value smaller than an absolute value of the first voltage.

Abstract translation: 一种用于驱动静电致动器的驱动方法，所述静电致动器包括固定电极和可动电极，所述固定电极和可动电极之间具有介电层彼此相对，包括在所述固定电极和所述可动电极之间施加第一电压以使所述可动电极与所述可动电极接触 并且在施加第一电压之后并且在可移动电极远离电介质层之前，在固定电极和可动电极之间施加第二电压。 这里，第二电压具有与第一电压的极性相反的极性和小于第一电压的绝对值的绝对值。