公开(公告)号：US10141316B2

公开(公告)日：2018-11-27

申请号：US15275827

申请日：2016-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Seok Lee ,  Jeong Seop Shim ,  Mi Na Lee ,  Augustin Jinwoo Hong ,  Je Min Park ,  Hye Jin Seong ,  Seung Min Oh ,  Do Yeong Lee ,  Ji Seung Lee ,  Jin Seong Lee

IPC: H01L27/108

Abstract: A semiconductor device includes a substrate including spaced-apart active regions, and device isolating regions isolating the active regions from each other, and a pillar array pattern including a plurality of pillar patterns overlapping the active regions, the plurality of pillar patterns being spaced apart from each other at an equal distance in a first direction and in a second direction intersecting the first direction, wherein the plurality of pillar patterns include first pillar patterns and second pillar patterns disposed alternatingly in the first direction and in the second direction, a shape of a horizontal cross section of the first pillar patterns being different from a shape of a horizontal cross section of the second pillar patterns.

公开(公告)号：US20180158669A1

公开(公告)日：2018-06-07

申请号：US15886372

申请日：2018-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan Sic Yoon ,  Ki Seok Lee ,  Dong Oh Kim ,  Yong Jae Kim

IPC: H01L21/027 ,  H01L21/02 ,  G03F1/38

CPC classification number: H01L21/027 ,  G03F1/38 ,  H01L21/02107 ,  H01L21/02697 ,  H01L27/0207 ,  H01L27/10888

Abstract: Methods for manufacturing a semiconductor device include forming a gate line extending in a first direction in a substrate, and an impurity region on a side surface of the gate line, forming an insulating film pattern on the substrate, the insulating film pattern extending in the first direction and comprising a first through-hole that is configured to expose the impurity region, forming a barrier metal layer on the first through-hole, forming a conductive line contact that fills the first through-hole and that is electrically connected to the impurity region, fowling a first mask pattern on the conductive line contact and the insulating film pattern, the first mask pattern extending in a second direction that is different from the first direction and the first mask pattern comprising a first opening, and removing corners of the barrier metal layer by partially etching the barrier metal layer.