公开(公告)号：US20190028799A1

公开(公告)日：2019-01-24

申请号：US15823881

申请日：2017-11-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangha PARK ,  Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: H04R1/24 ,  H04R17/02 ,  H04R29/00

CPC classification number: H04R1/245 ,  G06F17/14 ,  H04R1/28 ,  H04R1/2807 ,  H04R3/005 ,  H04R7/08 ,  H04R9/18 ,  H04R11/14 ,  H04R17/025 ,  H04R17/10 ,  H04R29/006 ,  H04R2201/003 ,  H04R2440/03

Abstract: A signal processing method of an audio sensing device is provided. The audio sensing device includes a plurality of resonators, at least some of the plurality of resonators having different frequency bands. The method includes setting a plurality of time frames corresponding to the plurality of resonators, and calculating a sound feature for each of the plurality of time frames, the sound feature being calculated based on an audio signal detected by each of the plurality of the resonators, wherein the plurality of time frames are set independently for each of the frequency bands, and at least some of the plurality of time frames are set to have different time intervals.

公开(公告)号：US20180097506A1

公开(公告)日：2018-04-05

申请号：US15643778

申请日：2017-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE

IPC: H03H9/54 ,  H03H9/13

CPC classification number: H03H9/54 ,  G01H11/08 ,  H03H9/13 ,  H03H9/24 ,  H04R17/02 ,  H04R17/10 ,  H04R25/00 ,  H04R2499/13 ,  H04R2499/15

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US20240121524A1

公开(公告)日：2024-04-11

申请号：US18210456

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Byonggwon SONG ,  Jangwoo YOU ,  Jaekwan KIM ,  Jinmyoung KIM ,  Wontaek SEO ,  Yongseop YOON ,  Byungkyu LEE

IPC: H04N25/21 ,  G01K7/36

CPC classification number: H04N25/21 ,  G01K7/36

Abstract: A thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.

公开(公告)号：US20230152411A1

公开(公告)日：2023-05-18

申请号：US17731742

申请日：2022-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Choongho RHEE

IPC: G01S3/801 ,  H03H9/13 ,  G01S3/803

CPC classification number: G01S3/801 ,  G01S3/803 ,  H03H9/132

Abstract: A directional acoustic sensor includes: a support including a first support portion and a second support portion that are separated from each other and face each other; a plurality of first resonators extending in a length direction thereof from the first support portion of the support; and a plurality of second resonators extending in the length direction thereof from the second support portion of the support and facing the plurality of first resonators, wherein each first resonator of the plurality of first resonators has a first end, wherein each second resonator of the plurality of second resonators has a second end, and wherein, in a first resonator arrangement of a region where the plurality of first resonators and the plurality of second resonators face each other, the first ends of the plurality of first resonators and the second ends of the plurality of second resonators form an intersecting structure.

公开(公告)号：US20220173210A1

公开(公告)日：2022-06-02

申请号：US17671040

申请日：2022-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokki HONG ,  Cheheung KIM ,  Sungchan KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: H01L49/02

Abstract: A capacitor structure includes at least one first layer and at least one second layer that are alternately stacked. The at least one first layer includes first electrodes and second electrodes alternately arranged in a first direction, and the at least one second layer includes third electrodes and fourth electrodes alternately arranged in a second direction intersecting the first direction, the third electrodes and the fourth electrodes being electrically connected to the first electrodes and the second electrodes. Each of the first electrodes and the second electrodes includes a base portion and branch portions protruding from the base portion, and the third electrodes and the fourth electrodes are arranged side by side to correspond to the branch portions.

公开(公告)号：US20220158074A1

公开(公告)日：2022-05-19

申请号：US17224254

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Sungchan KANG ,  Yongseop YOON

IPC: H01L41/113 ,  H01L41/332 ,  G01L1/16

Abstract: An etching method for forming a vertical structure is provided. The etching method may include: positioning a mask on a substrate, wherein the mask includes an opening pattern and a compensation pattern, and the compensation pattern is disposed at a corner of two adjacent sides of the opening pattern and includes a concave compensation pattern that is indented from one of the two adjacent sides; and forming the vertical structure on the substrate through the opening pattern of the mask by a dry etching process.

公开(公告)号：US20210126615A1

公开(公告)日：2021-04-29

申请号：US16880231

申请日：2020-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop YOON ,  Sungchan KANG ,  Cheheung KIM ,  Choongho RHEE

IPC: H03H9/24 ,  H03H9/02

Abstract: A micromechanical resonator includes a support beam having a fixed end, and a free end configured to vibrate. The micromechanical resonator includes a lumped mass disposed on the free end. A height of the lumped mass is greater than a width of the lumped mass.

公开(公告)号：US20200212885A1

公开(公告)日：2020-07-02

申请号：US16599275

申请日：2019-10-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Choongho RHEE ,  Yongseop YOON ,  Hyeokki HONG

IPC: H03H9/56

Abstract: Provided are a resonator, a method of manufacturing the resonator, and a strain sensor and a sensor array including the resonator. The resonator is provided to extend in a lengthwise direction from a support. The resonator includes a single crystal material and is provided to extend in a crystal orientation that satisfies at least one from among a Young's modulus and a Poisson's ratio, from among crystal orientations of the single crystal material.

公开(公告)号：US20190072635A1

公开(公告)日：2019-03-07

申请号：US15908116

申请日：2018-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: G01S3/808 ,  G10K11/178 ,  G10K11/36

CPC classification number: G01S3/8086 ,  G01S3/805 ,  G10K11/1781 ,  G10K11/36

Abstract: Provided is a sound direction detection sensor capable of detecting a direction from which sound is coming by using a multi-resonator array. The disclosed sound direction detection sensor includes two resonator arrays, each including a plurality of resonators having different resonance frequencies. The two resonator arrays have different directivities. Each resonator array serves as an audio sensor, and the sound direction detection sensor detects a direction from which sound is incident, regardless of a distance between audio sensors.