公开(公告)号：US11721620B2

公开(公告)日：2023-08-08

申请号：US17218356

申请日：2021-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam Kang ,  Youngchan Ko ,  Jeongseok Kim ,  Bongju Cho

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A fan-out type semiconductor package includes: a frame including a cavity and a middle redistribution layer (RDL) structure at least partially surrounding the cavity; a semiconductor chip in the cavity; a lower RDL structure on the frame and electrically connected with the semiconductor chip and the middle RDL structure; an upper RDL structure on the frame and electrically connected with the middle RDL structure; an upper shielding pattern in the upper RDL structure to shield the semiconductor chip from electromagnetic interference (EMI); a lower shielding pattern in the lower RDL structure to shield the semiconductor chip from the EMI; and a side shielding pattern in the middle RDL structure to shield the semiconductor chip from the EMI. The upper shielding pattern and the lower shielding pattern have a thickness of no less than about 5 μm, and the side shielding pattern has a width of no less than about 5 μm.

公开(公告)号：US20230144454A1

公开(公告)日：2023-05-11

申请号：US18151517

申请日：2023-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myungsam Kang ,  Youngchan Ko ,  Jeongseok Kim ,  Bongju Cho

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L24/20 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2224/215 ,  H01L2225/1035

Abstract: A semiconductor package includes a first redistribution structure having a first surface in which a first pad and a second pad are embedded and including a first redistribution layer thereon, and a vertical connection structure including a land layer and a pillar layer. The land layer is embedded in the first surface of the first redistribution structure, and a width of an upper surface of the land layer is narrower than a width of a lower surface of the pillar layer.

公开(公告)号：US20210375757A1

公开(公告)日：2021-12-02

申请号：US17403233

申请日：2021-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongju Cho ,  Myungsam Kang ,  Yonggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

公开(公告)号：US11121079B2

公开(公告)日：2021-09-14

申请号：US16588269

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongju Cho ,  Myungsam Kang ,  Younggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

公开(公告)号：US20200161237A1

公开(公告)日：2020-05-21

申请号：US16588269

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Bongju Cho ,  Myungsam Kang ,  Younggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L23/528

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.