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公开(公告)号：US20220140485A1
公开(公告)日：2022-05-05
申请号：US17578034
申请日：2022-01-18
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US11317502B2
公开(公告)日：2022-04-26
申请号：US16874794
申请日：2020-05-15
Applicant: Raytheon Company
Inventor： Thomas V. Sikina , John P. Haven , James E. Benedict , William J. Clark , Channing P. Favreau , Erika Klek , Mikhail Pevzner , Donald G. Hersey , Gregory G. Beninati , Thomas J. Tellinghuisen
Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
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公开(公告)号：US11289814B2
公开(公告)日：2022-03-29
申请号：US16180822
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US20210360772A1
公开(公告)日：2021-11-18
申请号：US16874794
申请日：2020-05-15
Applicant: Raytheon Company
Inventor： Thomas V. Sikina , John P. Haven , James E. Benedict , William J. Clark , Channing P. Favreau , Erika Klek , Mikhail Pevzner , Donald G. Hersey , Gregory G. Beninati , Thomas J. Tellinghuisen
Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
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公开(公告)号：US11107610B2
公开(公告)日：2021-08-31
申请号：US16901429
申请日：2020-06-15
Applicant: Raytheon Company , University of Massachusetts
Inventor： Erika C. Klek , Mary K. Herndon , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Kevin M. Wilder , Oshadha K. Ranasingha , Alkim Akyurtlu
IPC: H01C7/00 , H01B3/10 , H01C17/065
Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.
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Patent Agency Ranking
公开(公告)号：US20210051805A1
公开(公告)日：2021-02-18
申请号：US16541789
申请日：2019-08-15
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Thomas V. Sikina , Kevin Wilder , Matthew Souza , Aaron Michael Torberg
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：US10826147B2
公开(公告)日：2020-11-03
申请号：US16183169
申请日：2018-11-07
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , John P. Haven , James E. Benedict
IPC: H01P3/00 , H01P3/08 , H05K1/02 , H01P11/00 , H05K1/11 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/28
Abstract: Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.
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公开(公告)号：US20190269007A1
公开(公告)日：2019-08-29
申请号：US16287240
申请日：2019-02-27
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：US12021306B2
公开(公告)日：2024-06-25
申请号：US17511153
申请日：2021-10-26
Applicant: Raytheon Company
Inventor： Thomas V. Sikina , John P. Haven , James E. Benedict , Jonathan E. Nufio-Molina , Andrew R. Southworth
IPC: H01Q21/00 , B33Y10/00 , B33Y80/00 , H01P1/04 , H01P5/02 , H01Q1/42 , H01Q1/44 , H01Q1/52 , H01Q13/10 , H01Q13/18 , H01Q17/00 , H05K1/02 , H05K3/40
CPC classification number: H01Q21/0087 , H01P1/047 , H01P5/028 , H01Q1/42 , H01Q1/44 , H01Q1/523 , H01Q1/526 , H01Q13/10 , H01Q13/106 , H01Q13/18 , H01Q17/001 , H01Q17/008 , H01Q21/0075 , H05K1/0219 , H05K3/4038 , B33Y10/00 , B33Y80/00
Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.
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公开(公告)号：US11653484B2
公开(公告)日：2023-05-16
申请号：US16678211
申请日：2019-11-08
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Wade A. Schwanda
CPC classification number: H05K13/0409 , H05K3/38 , H05K3/465 , H05K3/4638 , H05K3/4679 , H05K13/0413 , B25J18/00 , B29C64/379 , B32B2457/08 , H05K3/0008 , H05K2203/167
Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
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