Abstract:
A particular device includes a resistance-based memory device, a tag random-access memory (RAM), and a bit recovery (BR) memory. The resistance-based memory device is configured to store a data value and error-correcting code (ECC) data associated with the data value. The tag RAM is configured to store information that maps memory addresses of a main memory to wordlines of a cache memory, where the cache memory includes the resistance-based memory device. The BR memory is configured to store additional error correction data associated with the data value, where the BR memory corresponds to a volatile memory device.
Abstract:
A circuit includes a first one-time programmable (OTP) element and a second OTP element. The circuit also includes error detection circuitry coupled to receive a first representation of data from the first OTP element. The circuit further includes output circuitry responsive to an output of the error detection circuitry to output an OTP read result based on the first representation of the data or based on a second representation of the data from the second OTP element.
Abstract:
A memory device is provided including a cell array and a volatile storage device. The cell array may include a plurality of word lines, a plurality of bit lines, wherein a selection of a word line and bit line defines a memory cell address, and a non-volatile reserved word line for storing configuration information for the cell array. The volatile storage device is coupled to the cell array. The configuration information from the non-volatile reserved word line is copied to the volatile storage device upon power-up or initialization of the memory device.
Abstract:
Magneto-resistive random access memory (MRAM) employing an integrated physically unclonable function (PUF) memory. The MRAM includes an MRAM array comprising an MRAM data array of data MRAM bit cells and an MRAM PUF array comprising PUF MRAM bit cells to form an integrated MRAM PUF array in the MRAM array. A resistance sensed from the PUF MRAM bit cells is compared to a reference resistance between the reference MRAM bit cells in the accessed MRAM bit cell row circuit in response to a read operation to cancel or mitigate the effect of process variations on MRAM bit cell resistance. The difference in sensed resistance and reference resistance is used to generate a random PUF output. By integrating the MRAM PUF array into an MRAM array containing an MRAM data array, access circuitry can be shared to control access to the MRAM data array and MRAM PUF, thus saving memory area.
Abstract:
Offset-cancellation sensing circuit (OCSC)-based Non-volatile (NV) memory circuits are disclosed. An OCSC-based NV memory circuit includes a latch circuit configured to latch a memory state from an input signal. The OCSC-based NV memory circuit also includes a sensing circuit that includes NV memory devices configured to store the latched memory state in the latch circuit for restoring the memory state in the latch circuit when recovering from a reduced power level in an idle mode. To avoid the need to increase transistor size in the sensing circuit to mitigate restoration degradation, the sensing circuit is also configured to cancel an offset voltage of a differential amplifier in the sensing circuit. In other exemplary aspects, the NV memory devices are included in the sensing circuit and coupled to the differential transistors as NMOS transistors in the differential amplifier, eliminating contribution of offset voltage from other differential PMOS transistors not included.
Abstract:
Aspects for adjusting resistive memory write driver strength based on write error rate (WER) are disclosed. In one aspect, a write driver strength control circuit is provided to adjust a write current provided to a resistive memory based on a WER of the resistive memory. The write driver strength control circuit includes a tracking circuit configured to determine the WER of the resistive memory based on write operations performed on resistive memory elements. The write driver strength control circuit includes a write current calculator circuit configured to compare the WER to a target WER that represents the desired yield performance level of the resistive memory. A write current adjust circuit in the write driver strength control circuit is configured to adjust the write current based on this comparison. The write driver strength control circuit adjusts the write current to perform write operations while reducing write errors associated with breakdown voltage.
Abstract:
A method includes, at a resistive memory device, determining an average effective reference resistance level based on a first effective reference resistance and a second effective reference resistance. The first effective reference resistance is based on a first set of reference cells of the resistive memory device and the second effective reference resistance is based on a second set of reference cells of the resistive memory device. The method includes trimming a reference resistance at least partially based on the average effective reference resistance level. Trimming the reference resistance includes, in response to determining that the first effective reference resistance is not substantially equal to the average effective reference resistance level, modifying one or more states of one or more magnetic tunnel junction devices associated with the first effective reference resistance.
Abstract:
Aspects of adjusting resistive memory write driver strength based on a mimic resistive memory write operation are disclosed. In one aspect, a write driver adjustment circuit is provided to adjust a write current provided by a write driver to a resistive memory for write operations. The write driver adjustment circuit includes a mimic write driver configured to provide a mimic write current that mimics the write current provided to the resistive memory. The mimic write current is applied to a mimic resistive memory that contains mimic resistive memory elements that mimic a resistance distribution of the resistive memory. When the mimic write current is applied, a mimic voltage is generated across the mimic resistive memory elements. The write driver adjustment circuit is configured to adjust the write current based on the mimic voltage so that the write current is sufficient for write operations, but low enough to reduce breakdown.
Abstract:
A device includes a redundant region of a magnetoresistive random access memory (MRAM) array that includes first memory cells. The device includes a data region of the MRAM array that includes second memory cells. The device includes a fail address region of the MRAM array, a first row of the fail address region including validity data, wherein the validity data includes multiple validity indicators, a last row indicator, or both.
Abstract:
Methods and apparatus for generating a reference for use with a magnetic tunnel junction are provided. In an example, provided is a magnetoresistive read only memory including a magnetic tunnel junction (MTJ) storage element, a sense amplifier having a first input coupled to the MTJ storage element, and a reference resistance device coupled to a second input of the sense amplifier. The reference resistance device includes a plurality of groups of at least two reference MTJ devices. Each reference MTJ device in a respective group is coupled in parallel with each other reference MTJ device in the respective group. Each group is coupled in series with the other groups. This arrangement advantageously mitigates read disturbances and reference level variations, while saving power, reducing reference resistance device area, and increasing read speed.