公开(公告)号：US20230335421A1

公开(公告)日：2023-10-19

申请号：US17908288

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  G01N21/95 ,  B23K26/03 ,  B23K26/53

CPC classification number: H01L21/67253 ,  G01N21/9501 ,  B23K26/032 ,  B23K26/53 ,  H01L21/67092 ,  B23K2103/56

Abstract: An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.

公开(公告)号：US20220331907A1

公开(公告)日：2022-10-20

申请号：US17641519

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/067 ,  H01L21/67 ,  H01L21/268

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.

公开(公告)号：US20220331902A1

公开(公告)日：2022-10-20

申请号：US17641545

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Yasunori IGASAKI

IPC: B23K26/067 ,  B23K26/06

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in the X direction.

公开(公告)号：US20200180075A1

公开(公告)日：2020-06-11

申请号：US16614882

申请日：2018-05-17

Applicant: Kyoritsu Chemical & Co., Ltd. ,  HAMAMATSU PHOTONICS K.K.

Inventor： Mikiharu KUCHIKI ,  Hidefumi KINDA ,  Daisuke KURITA ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Yuta KONDOH ,  Naoki UCHIYAMA

IPC: B23K26/16 ,  B23K26/40 ,  B23K26/53 ,  H01L21/50 ,  H01L21/67 ,  H01L21/78

Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.

公开(公告)号：US20190304839A1

公开(公告)日：2019-10-03

申请号：US16388209

申请日：2019-04-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Yuta KONDOH

IPC: H01L21/78 ,  B23K26/046 ,  B23K26/53 ,  H01L21/268 ,  H01L21/683 ,  H01L23/544 ,  H01L21/304 ,  H01L21/02

Abstract: Laser light is converged at an object including a semiconductor substrate formed with a plurality of functional devices on a front surface, from a back surface of the semiconductor substrate, and while a distance between the front surface and a first converging point of the laser light is maintained at a first distance, whereby a first modified region is formed along the line. The laser light is converged at the object from the back surface, and while a distance between the front surface and a second converging point is maintained at a second distance, and while the second converging point is offset with respect to a position at which the first converging point is converged, whereby a second modified region is formed along the line. A predetermined portion including the back surface and at least the second modified region is removed.

公开(公告)号：US20180294189A1

公开(公告)日：2018-10-11

申请号：US15763605

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Yuta KONDOH

IPC: H01L21/78 ,  B23K26/00 ,  B23K26/53 ,  B23K26/046 ,  H01L23/544 ,  H01L21/268 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/78 ,  B23K26/046 ,  B23K26/53 ,  B23K2103/56 ,  H01L21/268 ,  H01L21/304 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68336 ,  H01L2221/68386 ,  H01L2223/5446

Abstract: Laser light is converged at an object including a semiconductor substrate formed with a plurality of functional devices on a front surface, from a back surface of the semiconductor substrate, and while a distance between the front surface and a first converging point of the laser light is maintained at a first distance, whereby a first modified region is formed along the line. The laser light is converged at the object from the back surface, and while a distance between the front surface and a second converging point is maintained at a second distance, and while the second converging point is offset with respect to a position at which the first converging point is converged, whereby a second modified region is formed along the line. A predetermined portion including the back surface and at least the second modified region is removed.