公开(公告)号：US11706946B2

公开(公告)日：2023-07-18

申请号：US17191276

申请日：2021-03-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Ji-Young Oh ,  Himchan Oh ,  Chul Woong Joo ,  Seung Youl Kang ,  Chan Woo Park ,  Seongdeok Ahn ,  Jae-Eun Pi ,  Chi-Sun Hwang

IPC: H01L21/00 ,  H10K50/844 ,  H10K77/10 ,  H10K85/30 ,  H10K85/60 ,  H10K50/15 ,  H10K50/16

CPC classification number: H10K50/844 ,  H10K77/111 ,  H10K85/324 ,  H10K85/615 ,  H10K85/654 ,  H10K85/6565 ,  H10K85/6572 ,  H10K50/15 ,  H10K50/16

Abstract: Provided is a stretchable display device. The stretchable display device includes a substrate and a base pattern on the substrate, wherein the base pattern comprises a first portion, a second portion, and a connection portion configured to connect the first portion to the second portion. The stretchable display device includes a lower electrode on the first portion of the base pattern; an upper electrode on the lower electrode, a light emitting structure between the lower electrode and the upper electrode, and a protective layer configured to cover top and side surfaces of the upper electrode, side surfaces of the light emitting structure, a side surface of the lower electrode, and a portion of a side surface of the base pattern. The upper electrode extends to a top surface of the connection portion and a top surface of the second portion of the base pattern, and the first portion and the second portion of the base pattern extend in a first direction parallel to a top surface of the substrate. The first portion and the second portion are parallel to the top surface of the substrate and are spaced apart from each other in a second direction crossing the first direction. The connection portion extends in the second direction. A level of the lowermost surface of the protective layer is disposed between a bottom surface of the lower electrode and a bottom surface of the base pattern.

公开(公告)号：US10026844B2

公开(公告)日：2018-07-17

申请号：US15461567

申请日：2017-03-17

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kyoung Ik Cho ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Seok Lee ,  Sang Chul Lim ,  Soon-Won Jung ,  Hye Yong Chu

IPC: H01L29/10 ,  H01L29/786 ,  H01L29/66 ,  H01L27/12 ,  H01L21/3105 ,  H01L21/311

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

公开(公告)号：US09865559B2

公开(公告)日：2018-01-09

申请号：US15220145

申请日：2016-07-26

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Chan Woo Park ,  Jae Bon Koo ,  Bock Soon Na ,  Rae-Man Park ,  Ji-Young Oh ,  Sang Seok Lee ,  Soon-Won Jung

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/43 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/6835 ,  H01L2224/24137 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.

公开(公告)号：US09807886B2

公开(公告)日：2017-10-31

申请号：US13772288

申请日：2013-02-20

Applicant: Electronics and Telecommunications Research Institute

Inventor： Chan Woo Park ,  Jae Bon Koo ,  Sang Chul Lim ,  Ji-Young Oh ,  Soon-Won Jung

IPC: H05K3/34 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K3/10 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/284

Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.

公开(公告)号：US09634120B2

公开(公告)日：2017-04-25

申请号：US14610410

申请日：2015-01-30

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kyoung Ik Cho ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Seok Lee ,  Sang Chul Lim ,  Soon-Won Jung ,  Hye Yong Chu

IPC: H01L29/10 ,  H01L29/66 ,  H01L29/786 ,  H01L27/12 ,  H01L21/3105

CPC classification number: H01L29/78603 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31144 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/66742

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

公开(公告)号：US08912094B2

公开(公告)日：2014-12-16

申请号：US13846437

申请日：2013-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： Jae Bon Koo ,  Chan Woo Park ,  Soon-Won Jung ,  Sang Chul Lim ,  Ji-Young Oh ,  Bock Soon Na ,  Hye Yong Chu

IPC: H01L21/44 ,  H01L21/768

CPC classification number: H01L29/78603 ,  H01L27/1218 ,  H01L27/1262

Abstract: Provided is a method for manufacturing a stretchable thin film transistor. The method for manufacturing a stretchable thin film transistor includes forming a mold substrate, forming a stretchable insulator on the mold substrate, forming a flat substrate on the stretchable insulator, removing the mold substrate, forming discontinuous and corrugated wires on the stretchable insulator, forming a thin film transistor connected between the wires, and removing the flat substrate.

Abstract translation: 提供一种制造可拉伸薄膜晶体管的方法。 制造可伸缩薄膜晶体管的方法包括：在模具基板上形成模具基板，形成可拉伸绝缘体，在可伸缩绝缘体上形成平坦的基板，去除模具基板，在可拉伸的绝缘体上形成不连续的和波纹的导线， 连接在电线之间的薄膜晶体管，以及去除平坦的基板。