公开(公告)号：US10735039B1

公开(公告)日：2020-08-04

申请号：US16593239

申请日：2019-10-04

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Mike Sapozhnikov ,  David Nozadze ,  Amendra Koul ,  Upendranadh Reddy Kareti

IPC: H04B1/12 ,  H04L25/03 ,  H04B1/04

Abstract: In one embodiment, a transmission system includes a transmitter, a receiver, and a filter operable at one of the transmitter and the receiver to remove channel impairments. The filter is operable according to a sum of a Gaussian function and a reciprocal of cosine function, wherein the Gaussian and reciprocal of cosine functions comprise tunable parameters to account for skew and channel asymmetry.

公开(公告)号：US20240345180A1

公开(公告)日：2024-10-17

申请号：US18422854

申请日：2024-01-25

Applicant: Cisco Technology, Inc.

Inventor： David Nozadze ,  Mike Sapozhnikov ,  Upen Reddy Kareti ,  Amendra Koul ,  Joel Richard Goergen

IPC: G01R31/58 ,  G01R23/02

CPC classification number: G01R31/58 ,  G01R23/02

Abstract: Presented herein is a method comprising: determining skew values of cables, each skew value indicating a time of signal propagation along a respective cable at a respective signal frequency value, and the skew values being frequency dependent and varying at signal frequency values; determining skew behavior property values for each cable based on the skew values; determining a performance metric value for each skew behavior property value; determining a relationship between the skew values and the signal frequency values at each performance metric value based on the performance metric value for each skew behavior property value; and coupling a first electronic component and a second electronic component to one another using a new cable based on the relationship between the skew values and the signal frequency values at each performance metric value.

公开(公告)号：US20230397343A1

公开(公告)日：2023-12-07

申请号：US17942711

申请日：2022-09-12

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Upen Reddy Kareti

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4697 ,  H05K3/0047

Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.

公开(公告)号：US20230269873A1

公开(公告)日：2023-08-24

申请号：US18305489

申请日：2023-04-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

CPC classification number: H05K1/09 ,  H05K3/4644 ,  H05K2203/1545 ,  H05K2201/0323 ,  H05K2201/0338

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US11425821B2

公开(公告)日：2022-08-23

申请号：US16547639

申请日：2019-08-22

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  Mike Sapozhnikov ,  David Nozadze ,  Joel Goergen

IPC: H05K3/00 ,  H05K1/18 ,  H05K1/02 ,  G06F30/367 ,  G06F30/392 ,  G01R31/28

Abstract: A printed circuit board (PCB) includes a plurality of layers disposed at different depths of the PCB, circuit components disposed at different layers of the PCB, and a plurality of temperature measurement sensors located at one or more layers of the PCB, where each temperature measurement sensor is associated with a corresponding circuit component. A measured temperature is obtained at an embedded temperature measurement sensor located at an embedded layer within the PCB, and the measured temperature is correlated with an electrical property of an embedded circuit component located at the same embedded layer within the PCB as the embedded temperature measurement sensor. A plurality of moisture measurement sensors can also be located at one or more layers of the PCB to facilitate a measured moisture with an electrical property of an embedded circuit component.

公开(公告)号：US20220217837A1

公开(公告)日：2022-07-07

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US20220039257A1

公开(公告)日：2022-02-03

申请号：US17503690

申请日：2021-10-18

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US11202368B2

公开(公告)日：2021-12-14

申请号：US17006016

申请日：2020-08-28

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.

公开(公告)号：US20210059055A1

公开(公告)日：2021-02-25

申请号：US16547639

申请日：2019-08-22

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  Mike Sapozhnikov ,  David Nozadze ,  Joel Goergen

IPC: H05K3/00 ,  H05K1/18 ,  H05K1/02 ,  G06F17/50 ,  G01R31/28

Abstract: A printed circuit board (PCB) includes a plurality of layers disposed at different depths of the PCB, circuit components disposed at different layers of the PCB, and a plurality of temperature measurement sensors located at one or more layers of the PCB, where each temperature measurement sensor is associated with a corresponding circuit component. A measured temperature is obtained at an embedded temperature measurement sensor located at an embedded layer within the PCB, and the measured temperature is correlated with an electrical property of an embedded circuit component located at the same embedded layer within the PCB as the embedded temperature measurement sensor. A plurality of moisture measurement sensors can also be located at one or more layers of the PCB to facilitate a measured moisture with an electrical property of an embedded circuit component.

公开(公告)号：US20250140447A1

公开(公告)日：2025-05-01

申请号：US18418694

申请日：2024-01-22

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Amendra Koul ,  David Nozadze ,  Joel Richard Goergen ,  Sayed Ashraf Mamun ,  Upen Reddy Kareti

IPC: H01B11/20 ,  H01B7/08 ,  H01B11/04 ,  H01P3/08 ,  H05K1/02

Abstract: Techniques are provided to mitigate serializer-deserializer performance limiting positive/negative (P/N) skew issues in high-speed cable channels. This may be achieved by adding stripes with low/high dielectric constant (dk) material compared to the main dielectric surrounding cable wires. By adding strips/stripes in the main dielectric, a non-homogeneous dielectric structure is created, and this results in greater coupling between the signal conductors in the cable, which in turn reduces skew impact. This may be useful in twinaxial cables as well as stripline printed circuit boards.