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公开(公告)号：US20220037433A1
公开(公告)日：2022-02-03
申请号：US16755643
申请日：2019-05-20
Applicant: BOE Technology Group Co., Ltd.
Inventor： Feng Zhang , Zhijun Lv , Wenqu Liu , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Chuanxiang Xu
Abstract: An array substrate includes a flexible base substrate; a buffer layer on the flexible base substrate and continuously extending from a display area into a peripheral area, including a first portion substantially extending throughout the display area and a second portion in the peripheral area, the first portion and the second portion being parts of an integral layer, an organic insulating layer substantially extending throughout but limited in the display area and on a side of the buffer layer away from the flexible base substrate; an inorganic insulating layer limited in the peripheral area and on a side of the buffer layer away from the flexible base substrate; a planarization layer on a side of the organic insulating layer away from the buffer layer, and a plurality of light emitting elements on a side of the planarization layer away from the organic insulating layer.
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公开(公告)号：US12183987B2
公开(公告)日：2024-12-31
申请号：US18024022
申请日：2022-05-10
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhao Cui , Zhonglan Zhao , Feng Zhang , Liwen Dong , Dongfei Hou , Yuqiao Li , Wenqu Liu , Zhijun Lv , Detian Meng , Liuqing Li , Yong Ma , Mengya Song , Feng Qu
Abstract: Provided are a phase shifter, a method for manufacturing the same, and an electronic device. The phase shifter includes: a first substrate and a second substrate that are oppositely arranged, and heat conduction structures arranged between the first substrate and the second substrate. Orthographic projections of the heat conduction structures and orthographic projections of phase shifting units on the same substrate do not overlap each other.
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公开(公告)号：US11953779B2
公开(公告)日：2024-04-09
申请号：US17770205
申请日：2021-06-08
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao , Xue Dong
IPC: G02F1/00 , G02F1/1335 , G02F1/13357
CPC classification number: G02F1/133603 , G02F1/133605 , G02F1/133607 , G02F1/133612
Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.
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公开(公告)号：US11953680B2
公开(公告)日：2024-04-09
申请号：US17311477
申请日：2020-12-29
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liwen Dong , Feng Zhang , Wenqu Liu , Zhijun Lv , Zhao Cui , Detian Meng , Libo Wang , Xiaoxin Song
IPC: G02B27/01
CPC classification number: G02B27/0101 , G02B2027/0118
Abstract: This disclosure relates to a see-through display device, including: a collimated light source assembly, configured to form collimated light and control a light emitting direction; a first light extraction layer, configured to extract, in a collimated manner, the light ray transmitted inside the light guide plate through a light extraction outlet; an extinction layer and a second light extraction layer, wherein the extinction layer includes a light guide region and a light absorption region which are arranged alternately, and the second light extraction layer includes multiple light extraction inlets; a reflecting layer, arranged on a side, close to the light guide plate, of the second light extraction layer and configured to reflect the collimated light extracted from the light extraction outlet to the light guide plate; and a liquid crystal dimming layer. This disclosure further relates to a manufacturing method of the see-through display device.
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Patent Agency Ranking
公开(公告)号：US11736865B2
公开(公告)日：2023-08-22
申请号：US17288947
申请日：2020-05-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhao Cui , Feng Zhang , Wenqu Liu , Liwen Dong , Zhijun Lv , Xiaoxin Song , Detian Meng , Libo Wang , Qi Yao
CPC classification number: H04R17/005 , H04R3/00 , H04R31/006 , H10N30/857 , H10N30/872 , H04R2430/00
Abstract: A transducer, a method of manufacturing a transducer, and a transducing device are provided. The transducer includes a receiving unit and a transmitting unit. The receiving unit includes a first receiving electrode, a first piezoelectric film, and a second receiving electrode which are sequentially stacked, and the receiving unit is configured to convert a first acoustic wave signal into an electrical signal by using a piezoelectric effect of the first piezoelectric film. The transmitting unit is configured to receive a control signal, which is based on the electrical signal, to transmit a second acoustic wave signal.
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公开(公告)号：US11703478B2
公开(公告)日：2023-07-18
申请号：US16957614
申请日：2019-07-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Zhao Cui , Detian Meng , Libo Wang , Qi Yao
IPC: G01N29/02
CPC classification number: G01N29/022 , G01N2291/0228
Abstract: A micro total analysis system, operating method and manufacturing method thereof are provided. The micro total analysis system includes at least one micro total analysis unit each including: microfluidic device including first electrode and dielectric layer connected to each other, where the dielectric layer drives to-be-measured droplet to move based on voltage of the first electrode; and acoustic wave detection device including second electrode connected to the dielectric layer, where the dielectric layer is also used as transducer of the acoustic wave detection device, and configured to generate acoustic wave toward the droplet based on voltage of the second electrode, and generate a detection result corresponding to the droplet based on received acoustic wave. The micro total analysis system, the operating method and the manufacturing method thereof enables the microfluidic device and the acoustic wave detection device to be integrated in the same chip.
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公开(公告)号：US11678530B2
公开(公告)日：2023-06-13
申请号：US17359675
申请日：2021-06-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu Liu , Qi Yao , Detian Meng , Feng Zhang , Zhao Cui , Liwen Dong , Xiaoxin Song , Dongfei Hou , Libo Wang , Zhijun Lv
IPC: H01L29/32 , H10K59/126 , H01L29/786 , H10K71/00
CPC classification number: H10K59/126 , H01L29/7869 , H01L29/78672 , H10K71/00
Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an active structure layer disposed on the substrate, a first source-drain structure layer disposed on a side of the active structure layer away from the substrate, and a second source-drain structure layer disposed on a side of the first source-drain structure layer away from the substrate. The active structure layer includes a first active layer and a second active layer. The first source-drain structure layer includes a first active via and a first source-drain electrode, and the first source-drain electrode is connected to the first active layer through the first active via; and the second source-drain structure layer includes a second active via and a second source-drain electrode, and the second source-drain electrode is connected to the second active layer through the second active via.
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公开(公告)号：US11442583B2
公开(公告)日：2022-09-13
申请号：US16966394
申请日：2020-01-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wenqu Liu , Xiufeng Li , Qi Yao , Feng Zhang , Liwen Dong , Zhao Cui , Chuanxiang Xu , Detian Meng , Xiaoxin Song , Libo Wang , Yang Yue , Dongfei Hou , Zhijun Lv
IPC: G06F3/043 , H01L41/04 , H01L41/047 , H01L41/083 , H01L41/113 , H01L41/27 , G06F3/044 , G06F3/041 , G06V40/13 , G06V40/12
Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. In the fingerprint identification module, an auxiliary structure is at least partially located on a functional substrate, and a plurality of first driving electrodes are on a side, away from the functional substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer.
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公开(公告)号：US11296165B2
公开(公告)日：2022-04-05
申请号：US16755643
申请日：2019-05-20
Applicant: BOE Technology Group Co., Ltd.
Inventor： Feng Zhang , Zhijun Lv , Wenqu Liu , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Chuanxiang Xu
Abstract: An array substrate includes a flexible base substrate; a buffer layer on the flexible base substrate and continuously extending from a display area into a peripheral area, including a first portion substantially extending throughout the display area and a second portion in the peripheral area, the first portion and the second portion being parts of an integral layer, an organic insulating layer substantially extending throughout but limited in the display area and on a side of the buffer layer away from the flexible base substrate; an inorganic insulating layer limited in the peripheral area and on a side of the buffer layer away from the flexible base substrate; a planarization layer on a side of the organic insulating layer away from the buffer layer, and a plurality of light emitting elements on a side of the planarization layer away from the organic insulating layer.
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