公开(公告)号：US20190339622A1

公开(公告)日：2019-11-07

申请号：US16509675

申请日：2019-07-12

Applicant: Applied Materials, Inc.

Inventor： Christopher Dennis BENCHER ,  Joseph R. JOHNSON ,  David MARKLE ,  Mehdi VAEZ-IRAVANI

IPC: G03F7/20 ,  G02B27/28

Abstract: Embodiments of the present disclosure provide methods for producing images on substrates. The method includes providing a p-polarization beam to a first mirror cube having a first digital micromirror device (DMD), providing an s-polarization beam to a second mirror cube having a second DMD, and reflecting the p-polarization beam off the first DMD and reflecting the s-polarization beam off the second DMD such that the p-polarization beam and the s-polarization beam are reflected towards a light altering device configured to produce a plurality of superimposed images on the substrate.

公开(公告)号：US20190212128A1

公开(公告)日：2019-07-11

申请号：US16356317

申请日：2019-03-18

Applicant: Applied Materials, Inc.

Inventor： Khokan C. PAUL ,  Edward BUDIARTO ,  Todd EGAN ,  Mehdi VAEZ-IRAVANI ,  Jeongmin LEE ,  Dale R. DU BOIS ,  Terrance Y. LEE

IPC: G01B11/06 ,  H01J37/32 ,  C23C16/52 ,  H01L21/66 ,  C23C16/509 ,  G01B7/06

CPC classification number: G01B11/0616 ,  C23C16/509 ,  C23C16/52 ,  G01B7/085 ,  H01J37/32082 ,  H01J37/32935 ,  H01L21/67253 ,  H01L22/12 ,  H01L22/30

Abstract: Embodiments of the present disclosure relate to apparatus and methods for forming films having uniformity of thickness on substrates. Embodiments of the present disclosure may be used to measure thickness or other properties of films being deposited on a substrate without knowing beforehand the surface properties of the substrate. Embodiments of the present disclosure may be used to measure thickness or other properties of a plurality of layers being formed. For example, embodiments of the present disclosure may be used in measuring thickness of vertical memory stacks.

公开(公告)号：US20180074311A1

公开(公告)日：2018-03-15

申请号：US15552064

申请日：2015-05-14

Applicant: Applied Materials, Inc.

Inventor： Edward BUDIARTO ,  Mehdi VAEZ-IRAVANI ,  Christopher BENCHER

IPC: G02B26/08 ,  G02B5/08 ,  G03F7/20

CPC classification number: G02B26/0833 ,  G02B5/0833 ,  G03F7/7015

Abstract: Embodiments described herein generally relate to a DMD. The DMD includes a base and a plurality of mirrors disposed on the base. Each mirror of the plurality of mirrors has a surface facing away from the base, and a structure is disposed on the surface of each mirror. The structure enhances the reflectance of the surface of each mirror, which enhances the efficiency of light manipulation and delivery.

公开(公告)号：US20170287752A1

公开(公告)日：2017-10-05

申请号：US15445303

申请日：2017-02-28

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Mangesh BANGAR ,  Concetta RICCOBENE ,  Abdul Aziz KHAJA ,  Srinivas D. NEMANI ,  Ellie Y. YIEH ,  Sean S. KANG

IPC: H01L21/67 ,  H01L21/265 ,  H01L21/66

CPC classification number: H01L21/67259 ,  H01L21/265 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67288 ,  H01L22/20

Abstract: Embodiments of the disclosure provide an integrated system for performing a measurement process and a lithographic overlay error correction process on a semiconductor substrate in a single processing system. In one embodiment, a processing system includes at least a load lock chamber, a transfer chamber coupled to the load lock chamber, an ion implantation processing chamber coupled to or in the transfer chamber, and a metrology tool coupled to the transfer chamber, wherein the metrology tool is adapted to obtain stress profile or an overlay error on a substrate disposed in the metrology tool.