公开(公告)号：US20240128193A1

公开(公告)日：2024-04-18

申请号：US17966698

申请日：2022-10-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Pao-Nan LEE ,  Chang Chi LEE ,  Jung Jui KANG

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16

CPC分类号： H01L23/5386 ,  H01L23/3677 ,  H01L23/49866 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/14252 ,  H01L2924/1427 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/3025

摘要： An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.

公开(公告)号：US20240038679A1

公开(公告)日：2024-02-01

申请号：US17877799

申请日：2022-07-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/16 ,  H01L2924/3025 ,  H01L2924/15311

摘要： The present disclosure provides an electronic device. The electronic device includes a first electronic component, a first conductive element, and a voltage regulator. The voltage regulator is disposed adjacent to the first electronic component. The voltage regulator is configured to regulate a first voltage from the first EMI shielding layer and to provide the first electronic component with a second voltage.

公开(公告)号：US20230163077A1

公开(公告)日：2023-05-25

申请号：US17535400

申请日：2021-11-24

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chang Chi LEE ,  Chiu-Wen LEE ,  Jung Jui KANG

IPC分类号： H01L23/538 ,  H01L25/065

CPC分类号： H01L23/5384 ,  H01L25/0655 ,  H01L23/5386

摘要： An electronic package is provided. The electronic package includes a semiconductor substrate. The semiconductor substrate includes a first active region and a first passive region separated from the first active region. The first active region is configured to regulate a power signal. The first passive region is configured to transmit a data signal.

公开(公告)号：US20210265231A1

公开(公告)日：2021-08-26

申请号：US16799751

申请日：2020-02-24

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chien Lin CHANG CHIEN ,  Chiu-Wen LEE ,  Hung-Jung TU ,  Chang Chi LEE ,  Chin-Li KAO

IPC分类号： H01L23/367 ,  H01L23/48 ,  H01L23/00 ,  H01L21/48

摘要： The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

公开(公告)号：US20170263589A1

公开(公告)日：2017-09-14

申请号：US15416907

申请日：2017-01-26

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chien Lin CHANG CHIEN ,  Chang Chi LEE ,  Chin-Li KAO ,  Dao-Long CHEN ,  Ta-Chien CHENG

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/367

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3672 ,  H01L24/33 ,  H01L25/50 ,  H01L2225/06541 ,  H01L2225/06589

摘要： A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. The first electronic device is positioned over and electrically connected to the package substrate through the first surface. The second electronic device is positioned over and electrically connected to the first electronic device. The first molding layer is positioned over the package substrate, and the first molding layer encapsulates a portion of the first surface and the edge of the package substrate.