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公开(公告)号：US10386889B2
公开(公告)日：2019-08-20
申请号：US16138929
申请日：2018-09-21
Applicant: Apple Inc.
Inventor： Kelvin Kwong , Lee E. Hooton , David G. Havskjold , Anthony S. Montevirgen , Emery A. Sanford
Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.
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公开(公告)号：US10015297B2
公开(公告)日：2018-07-03
申请号：US15260222
申请日：2016-09-08
Applicant: Apple Inc.
Inventor： Lee E. Hooton , Daniel W. Jarvis , Marwan Rammah , Ian A. Spraggs , Nicholas G. Merz
CPC classification number: H04M1/0266 , G06F1/1613 , G06F1/1626 , G06F1/1637 , H04M1/0249
Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.
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公开(公告)号：US09793070B2
公开(公告)日：2017-10-17
申请号：US13788040
申请日：2013-03-07
Applicant: Apple Inc.
Inventor： Richard Hung Minh Dinh , Lee E. Hooton
IPC: H01H13/88 , H01H13/06 , H01H13/86 , H03K17/96 , H03K17/955
CPC classification number: H01H13/06 , H01H13/86 , H01H13/88 , H01H2215/006 , H01H2223/002 , H01H2229/036 , H01H2239/006 , H01H2239/074 , H03K17/955 , H03K17/962 , H03K2217/96054 , Y10T29/49105 , Y10T307/826
Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.
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公开(公告)号：US09179055B2
公开(公告)日：2015-11-03
申请号：US14255893
申请日：2014-04-17
Applicant: Apple Inc.
Inventor： Lee E. Hooton , Douglas S. Brodie , Matthew D. Hill , Nicholas G. Merz , Scott A. Myers , Terence N. Tam
CPC classification number: H04N5/2254 , H04M1/026 , H04M1/0264 , H04N5/2251 , H04N5/2252 , H04N5/2257
Abstract: This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features.
Abstract translation: 本申请主要涉及用于在设备外壳内固定和保护相机模块的各种装置和方法。 固定和保护元件被配置成占据设备壳体内的最小空间，使得相机模块的可用空间最大化。 在一些实施例中，固定元件还可以包括接地特征。
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公开(公告)号：US12003657B2
公开(公告)日：2024-06-04
申请号：US17472097
申请日：2021-09-10
Applicant: Apple Inc.
Inventor： Richard H. Koch , Jonathan M. Lee , Laura M. Burke , Ekaterina Pease , Nicholas Merz , Daniel Jarvis , Ian A. Spraggs , Lee E. Hooton , Kodiak D. Burke , David A. Pakula , Marwan Rammah
CPC classification number: H04M1/0266 , G06F1/1637
Abstract: A portable electronic device may include a housing member, a rear cover coupled to the housing member, and a top module coupled to the housing member and including a front cover defining an exterior surface and an interior surface opposite to the exterior surface, a display stack attached to the interior surface of the front cover and comprising a flexible circuit element extending from a side of the display stack, a frame member attached to the interior surface of the front cover and extending at least partially around a periphery of the display stack, and an encapsulating structure positioned between the frame member and the display stack and at least partially encapsulating a portion of a peripheral side of the display stack and the flexible circuit element. The encapsulating structure may cover at least a portion of a bottom side of the display stack.
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Patent Agency Ranking
公开(公告)号：US10942412B2
公开(公告)日：2021-03-09
申请号：US16808911
申请日：2020-03-04
Applicant: Apple Inc.
Inventor： Michael W. Firka , Ashley E. Fletcher , Benjamin J. Pope , Lee E. Hooton , Scott A. Myers , Benjamin Shane Bustle , Garam Young , Blake M. Coughenour
Abstract: An electronic device has an electrically adjustable shutter. The shutter may be placed in a transparent state or a nontransparent state. The shutter may overlap a portion of a display, may overlap a liquid contact indictor or a structure with text in a device, or may overlap an optical component such as an optical proximity sensor, ambient light sensor, visible light-emitting diode or laser, infrared light-emitting diode or laser, visible light image sensor, or infrared light image sensor. Control circuitry in the electronic device may place the shutter in an opaque state to hide an overlapped component from view or may place the shutter in a transparent state to allow the overlapped component to transmit or receive light. The adjustable shutter may exhibit changes in its transmission spectrum in different modes of operation and may be used as a camera filter or neutral density filter.
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公开(公告)号：US10787014B2
公开(公告)日：2020-09-29
申请号：US16127043
申请日：2018-09-10
Applicant: Apple Inc.
Inventor： Lee E. Hooton , Marwan Rammah , James A. Bertin , Stoyan P. Hristov , William A. Counts
IPC: H05K7/20 , H05K5/00 , H05K5/02 , F28F21/08 , B41M5/24 , G06F1/16 , H04M1/02 , H01P3/08 , H05K1/02 , H05K1/18 , H05K5/03 , H05K5/06 , H05K9/00 , H01R12/79 , H05K1/14 , H02J50/10 , H02J7/02
Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
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公开(公告)号：USD849010S1
公开(公告)日：2019-05-21
申请号：US29655032
申请日：2018-06-29
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US10244659B2
公开(公告)日：2019-03-26
申请号：US15712069
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David A. Pakula , David J. Dunsmoor , Ian A. Spraggs , Lee E. Hooton , Marwan Rammah , Matthew D. Hill , Robert F. Meyer , James A. Bertin , Eric M. Bennett , Simon C. Helmore , Melissa A. Wah , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H05K7/20 , H05K1/02 , G06F3/041 , H01M2/10 , H05K1/14 , G06F1/16 , H01M2/08 , H02J7/00 , G06F3/044
Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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公开(公告)号：US20170303048A1
公开(公告)日：2017-10-19
申请号：US15132136
申请日：2016-04-18
Applicant: APPLE INC.
Inventor： Lee E. Hooton , Robert F. Meyer
CPC classification number: H04R17/005 , H04R1/227 , H04R7/04 , H04R7/045 , H04R7/18 , H04R7/20 , H04R2307/201 , H04R2499/11 , H04R2499/15
Abstract: An electronic device has an exterior housing with a piezoelectric speaker disposed in an opening formed within the housing. The piezoelectric speaker includes a speaker diaphragm that is secured within the opening with a vibration isolator. The vibration isolator allows the diaphragm to vibrate independently from the housing.
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