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    Electronic device assemblies
    23.
    发明授权
    Electronic device assemblies 有权
    电子设备组件

    公开(公告)号：US09137891B2

    公开(公告)日：2015-09-15

    申请号：US14258414

    申请日：2014-04-22

    Applicant: Apple Inc.

    Inventor： Kevin D. Gibbs ,  Carl R. Peterson ,  Erik A. Uttermann ,  Conor P. Lenahan ,  John P. Ternus ,  Justin R. Wodrich ,  Elvis M. Kibiti ,  Derek Wright

    IPC: G03B17/02 ,  H05K1/02 ,  H01Q9/42 ,  G06F1/16 ,  G03B1/00 ,  H05K5/02 ,  H04N5/225 ,  G03B19/04 ,  H04M1/02 ,  G03B17/22 ,  G03B17/30

    CPC classification number: H05K1/028 ,  G03B1/00 ,  G03B17/02 ,  G03B17/22 ,  G03B17/30 ,  G03B19/04 ,  G03B2217/002 ,  G06F1/1698 ,  H01Q9/42 ,  H04M1/0264 ,  H04M1/0277 ,  H04N5/2252 ,  H05K5/0217 ,  H05K2201/055

    Abstract: An electronic device may have a conductive housing. A dielectric structure may be mounted in the conductive housing to form an antenna window. An electrical component such as a camera, light sensor, or other device may press against a conductive foam structure. A printed circuit may have conductive traces that form an antenna ground and antenna resonating element. The printed circuit may be wrapped around a support structure. The electrical component, the conductive foam structure, and the printed circuit wrapped around the support structure may be compressed between a display cover layer and the antenna window. A camera window may be attached to a camera window trim using multiple adhesives. The trim may have a curved exterior surface that matches a curved housing surface. A flexible printed circuit cable may have a folded portion. A band structure may surround the folded portion to form a service loop.

    Abstract translation: 电子设备可以具有导电外壳。 电介质结构可以安装在导电外壳中以形成天线窗。 诸如相机，光传感器或其他装置的电气部件可以压靠导电泡沫结构。 印刷电路可以具有形成天线接地和天线谐振元件的导电迹线。 印刷电路可以缠绕在支撑结构上。 缠绕在支撑结构上的电气部件，导电泡沫结构和印刷电路可以在显示器覆盖层和天线窗口之间被压缩。 相机窗口可以使用多种粘合剂连接到相机窗饰。 装饰件可以具有与弯曲的壳体表面匹配的弯曲外表面。 柔性印刷电路电缆可以具有折叠部分。 带结构可围绕折叠部分以形成服务循环。

    Structures for securing printed circuit connectors
    24.
    发明授权
    Structures for securing printed circuit connectors 有权
    用于固定印刷电路连接器的结构

    公开(公告)号：US09048597B2

    公开(公告)日：2015-06-02

    申请号：US13655734

    申请日：2012-10-19

    Applicant: Apple Inc.

    Inventor： Carl R. Peterson ,  Alex C. Yeung ,  Stephen R. McClure ,  Derek W. Wright

    IPC: H01R12/78 ,  H01R12/73 ,  H01R13/6581

    CPC classification number: H01R12/78 ,  H01R12/73 ,  H01R13/6581

    Abstract: Printed circuit substrates may be formed from rigid printed circuit material or flexible sheets of polymer. Printed circuit substrates may have conductive traces. Integrated circuits, touch sensor electrode structure, sensors, and other components may be mounted to the conductive traces. Connectors such as board-to-board connectors may be used to couple printed circuit substrates together. To hold the connectors together and to provide electromagnetic shielding, printed circuits and connectors may be surrounded by printed circuit connector securing structures. The printed circuit connector securing structures may have one or more strips of conductive fabric tape wrapped around the connectors. Metal stiffening members may be attached to opposing ends of the strip of conductive tape to facilitate removal of the tape for rework or repair. An additional strip of tape may be used to help secure the wrapped conductive tape. The additional strip may have a tab to facilitate removal.

    Abstract translation: 印刷电路基板可以由刚性印刷电路材料或柔性聚合物片形成。 印刷电路基板可以具有导电迹线。 集成电路，触摸传感器电极结构，传感器和其他部件可以安装到导电迹线。 诸如板对板连接器的连接器可以用于将印刷电路基板连接在一起。 为了将连接器保持在一起并提供电磁屏蔽，印刷电路和连接器可以被印刷电路连接器固定结构包围。 印刷电路连接器固定结构可以具有缠绕在连接器上的导电织物带的一条或多条条带。 金属加强构件可以附接到导电带条的相对端部，以便于带子的移除以进行返修或修理。 可以使用附加的条带来帮助固定包裹的导电胶带。 附加条带可以具有便于移除的突片。

    Methods for Assembling Devices Using Pressure Indicator Adhesives
    25.
    发明申请
    Methods for Assembling Devices Using Pressure Indicator Adhesives 有权
    使用压力指示器粘合剂组装设备的方法

    公开(公告)号：US20140138011A1

    公开(公告)日：2014-05-22

    申请号：US13679699

    申请日：2012-11-16

    Applicant: APPLE INC.

    Inventor： Stephen R. McClure ,  Derek W. Wright ,  Carl R. Peterson ,  Kristina A. Babiarz

    IPC: B32B37/12 ,  G01D11/00

    CPC classification number: G01D11/00 ,  C08K9/10 ,  C09J5/00 ,  C09J7/38 ,  C09J11/02 ,  C09J2205/11 ,  C09J2400/143 ,  C09J2400/163

    Abstract: Pressure indicator pressure sensitive adhesive may contain microspheres that burst and release indicator when subjected to pressure and thereby produce a detectable indication of how much pressure has been applied when forming an adhesive joint between opposing structures. Electronic device structures can be assembled using the pressure indicator pressure sensitive adhesive. A camera or other sensor may monitor joint formation. The camera can gather infrared image data, visible light image data, or ultraviolet light image data. Sensor data such as magnetic or ultrasonic sensor data can also be collected on an adhesive joint. Joint inspection can be performed on test structures and production structures and corresponding adjustments made to the joint formation process. Positioners and other equipment that compresses the pressure indicator pressure sensitive adhesive can be adjusted in real time or calibrated using information about the condition of the pressure indicator pressure sensitive adhesive.

    Abstract translation: 压力指示器压敏粘合剂可能含有微球，当经受压力时，其突发和释放指示器，从而产生在形成相对结构之间的粘合剂接头时施加了多少压力的可检测指示。 可以使用压力指示器压敏粘合剂组装电子装置结构。 照相机或其他传感器可能会监视关节的形成。 相机可以收集红外图像数据，可见光图像数据或紫外光图像数据。 诸如磁性或超声波传感器数据的传感器数据也可以在粘合剂接头上收集。 可以对试验结构和生产结构进行联合检查，并对联合形成过程进行相应的调整。 压缩压力指示器压敏粘合剂的定位器和其他设备可以实时调整或使用关于压力指示器压敏粘合剂状况的信息进行校准。

    Structures for Securing Printed Circuit Connectors
    26.
    发明申请
    Structures for Securing Printed Circuit Connectors 有权
    用于固定印刷电路连接器的结构

    公开(公告)号：US20140113463A1

    公开(公告)日：2014-04-24

    申请号：US13655734

    申请日：2012-10-19

    Applicant: APPLE INC.

    Inventor： Carl R. Peterson ,  Alex C. Yeung ,  Stephen R. McClure ,  Derek W. Wright

    IPC: H01R12/78

    CPC classification number: H01R12/78 ,  H01R12/73 ,  H01R13/6581

    Abstract: Printed circuit substrates may be formed from rigid printed circuit material or flexible sheets of polymer. Printed circuit substrates may have conductive traces. Integrated circuits, touch sensor electrode structure, sensors, and other components may be mounted to the conductive traces. Connectors such as board-to-board connectors may be used to couple printed circuit substrates together. To hold the connectors together and to provide electromagnetic shielding, printed circuits and connectors may be surrounded by printed circuit connector securing structures. The printed circuit connector securing structures may have one or more strips of conductive fabric tape wrapped around the connectors. Metal stiffening members may be attached to opposing ends of the strip of conductive tape to facilitate removal of the tape for rework or repair. An additional strip of tape may be used to help secure the wrapped conductive tape. The additional strip of tapc may have a tab to facilitate removal.

    Abstract translation: 印刷电路基板可以由刚性印刷电路材料或柔性聚合物片形成。 印刷电路基板可以具有导电迹线。 集成电路，触摸传感器电极结构，传感器和其他部件可以安装到导电迹线。 诸如板对板连接器的连接器可以用于将印刷电路基板连接在一起。 为了将连接器保持在一起并提供电磁屏蔽，印刷电路和连接器可以被印刷电路连接器固定结构包围。 印刷电路连接器固定结构可以具有缠绕在连接器上的导电织物带的一条或多条条带。 金属加强构件可以附接到导电带条的相对端部，以便于带子的移除以进行返修或修理。 可以使用附加的条带来帮助固定包裹的导电胶带。 附加的tapc带可以具有用于促进移除的突片。

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