Abstract:
An antireflective coating composition includes a hydrolytic condensate (C1) of alkoxy silane (C11) and fluoric alkoxy silane (C12); a particle-type metal fluoride (C2) with a refractive index of 1.40 or less; and a liquid dispersion-enhancing chelating agent (C3). A coating film to which the above composition is applied controls refractive index, surface energy, film strength and so on, so it ensures excellent antireflective characteristic, excellent scratch resistance, good erasure of liquid stains such as fingerprints, and particularly excellent dust removal, so it may be usefully applied to an outermost layer of a front surface of a display regardless of kind of a display substrate or presence of an additional coating layer.
Abstract:
Methods of etching a semiconductor substrate may include providing a first gas that is chemically reactive with respect to the semiconductor substrate, and while providing the first gas, providing a second gas different than the first gas. More particularly, a molecule of the second gas may include a hydrogen atom, and the second gas may lower a temperature at which the first gas chemically reacts with the semiconductor substrate. The mixture of the first and second gases may be provided adjacent the semiconductor substrate to etch the semiconductor substrate.
Abstract:
A semiconductor device formed on a strained silicon layer and a method of manufacturing such a semiconductor device are disclosed. In accordance with this invention, a first silicon germanium layer is formed on a single crystalline silicon substrate; a second silicon germanium layer is formed on the first silicon germanium layer, the second silicon germanium layer having a concentration of germanium in a range of about 1 percent by weight to about 15 percent by weight based on the total weight of the second silicon germanium layer; a strained silicon layer is formed on the second silicon germanium layer; an isolation layer is formed at a first portion of the strained silicon layer; a gate structure is formed on the strained silicon layer; and, source/drain regions are formed at second portions of the strained silicon layer adjacent to the gate structure to form a transistor.
Abstract:
Methods of etching a semiconductor substrate may include providing a first gas that is chemically reactive with respect to the semiconductor substrate, and while providing the first gas, providing a second gas different than the first gas. More particularly, a molecule of the second gas may include a hydrogen atom, and the second gas may lower a temperature at which the first gas chemically reacts with the semiconductor substrate. The mixture of the first and second gases may be provided adjacent the semiconductor substrate to etch the semiconductor substrate.
Abstract:
A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer to contact the semiconductor substrate and a stress buffer spacer disposed between the node contact plug and the inorganic insulating layer. The device further includes a thin-film transistor (TFT) disposed on the inorganic insulating layer and having a source/drain region extending along the inorganic insulating layer to contact the contact plug. The device may further include an etch stop layer interposed between the inorganic insulating layer and the semiconductor substrate.
Abstract:
A coating composition for antireflection that includes a low refraction-thermosetting resin having a refractive index of 1.2 to 1.45, a high refraction-ultraviolet curable resin having a refractive index of 1.46 to 2, and an ultraviolet absorber; an antireflection film manufactured using the coating composition; and a method of manufacturing the antireflection film. The antireflection film has excellent abrasion resistance and antireflection characteristic. Further, since the antireflection film can be manufactured in one coating process, it is possible to reduce manufacturing cost.
Abstract:
A liquid crystal display device capable of reducing a time delay in lighting of the liquid crystal display device includes a liquid crystal panel, at least one fluorescent lamps disposed below the liquid crystal panel, formed as a cylindrical shape having a central axis and supplying light to the liquid crystal panel, and at least one auxiliary optical source disposed to face the liquid crystal panel while having the central axis therebetween and supplying light to the fluorescent lamps.
Abstract:
An antireflective coating composition includes a photopolymerizable acrylate monomer (C1); a particle-type metal fluoride (C2) with a refractive index of 1.40 or less; a photopolymerization initiator (C3); and at least one liquid dispersion-enhancing chelating agent (C4) selected from the group consisting of Mg(CF3COO)2, Na(CF3COO), K(CF3COO), Ca(CF3COO)2, Mg(CF2COCHCOCF3)2 and Na(CF2COCHCOCF3). This composition ensures good mechanical strength, excellent adhesion to a substrate, short curing time by UV curing, prevention of dust attachment, good erasure of stain, good dust removal and good scratch resistance, so it is usefully for making an antireflective coating film of a display.
Abstract:
A semiconductor device formed on a strained silicon layer and a method of manufacturing such a semiconductor device are disclosed. In accordance with this invention, a first silicon germanium layer is formed on a single crystalline silicon substrate; a second silicon germanium layer is formed on the first silicon germanium layer, the second silicon germanium layer having a concentration of germanium in a range of about 1 percent by weight to about 15 percent by weight based on the total weight of the second silicon germanium layer; a strained silicon layer is formed on the second silicon germanium layer; an isolation layer is formed at a first portion of the strained silicon layer; a gate structure is formed on the strained silicon layer; and, source/drain regions are formed at second portions of the strained silicon layer adjacent to the gate structure to form a transistor.