公开(公告)号：US08641271B2

公开(公告)日：2014-02-04

申请号：US12772540

申请日：2010-05-03

Applicant: Feng-Ku Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

Inventor： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

IPC: G01K1/16

CPC classification number: G01M99/002 ,  G01K17/00

Abstract: A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.

Abstract translation: 热管测试方法包括以下步骤。 提供了多个具有相同尺寸的棒状热管，并且热管变形。 变形的热管被放置在温度调节器中，使得热管的温度在第一温度和第二温度之间周期性地变化。 然后将热管从温度调节器中取出。 每个热管的一端通过恒温装置保持在第三温度，并且测量热管的两个相对端的热管温度差。 具有热管温度差大于热管中的标准温差的热管被标记。

公开(公告)号：US08482916B2

公开(公告)日：2013-07-09

申请号：US13176390

申请日：2011-07-05

Applicant: Feng-Ku Wang ,  Yi-Lun Cheng

Inventor： Feng-Ku Wang ,  Yi-Lun Cheng

IPC: H05K7/20

CPC classification number: G06F1/203

Abstract: A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.

Abstract translation: 移动计算装置包括外壳，电路板，第一散热模块，用于排气的离心式风扇和用于对流的离心式风扇。 壳有一个第一通孔。 电路板设置在外壳上，具有第一发热装置。 第一散热模块具有第一吸热端和第一散热端，第一吸热端与第一发热装置热接触。 用于排气的离心式风扇具有第一气体出口，第一散热端位于第一气体出口和第一通孔之间，使得用于排气的离心式风扇排出到壳体的外部。 用于对流的离心式风扇配置在外壳中，并排放到外壳的内部。 因此，在壳体中发生气体流动循环，使得移动计算装置具有期望的散热效果。

公开(公告)号：US20090016020A1

公开(公告)日：2009-01-15

申请号：US11850500

申请日：2007-09-05

Applicant: Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Lung Lin ,  Chih-Kai Yang ,  Cheng-Shi Liu

Inventor： Feng-Ku Wang ,  Yi-Lun Cheng ,  Chun-Lung Lin ,  Chih-Kai Yang ,  Cheng-Shi Liu

IPC: H05K7/20

CPC classification number: G06F1/203

Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.

Abstract translation: 提供了一种适用于散热由发热元件产生的热量的散热模块。 散热模块包括第一导热板，第一散热管和风扇。 第一导热板热耦合到发热元件。 第一散热管具有与第一开口相对的第一开口和第二开口。 第一导热板与第一散热管连接，位于第一散热管的外侧。 风扇与第一开口相邻并且对应于第一开口。 风扇适于产生在第一散热管中流动的气流。 散热模块可以在运行期间将由发热元件产生的热量传递到外部环境。

公开(公告)号：US20080130240A1

公开(公告)日：2008-06-05

申请号：US11606001

申请日：2006-11-30

Applicant: Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

Inventor： Feng-Ku Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

Abstract translation: 热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。 固定结构包括固定构件和弹性构件。 弹性构件的两端分别是紧固部和固定部。 弹性构件的中部是按压部。 此外，悬架臂从固定部分延伸。 当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个， 悬挂臂按压另一个发热电子部件上的另一个导热垫。

公开(公告)号：US20070237896A1

公开(公告)日：2007-10-11

申请号：US11401365

申请日：2006-04-11

Applicant: Frank Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

Inventor： Frank Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC: B05D5/00 ,  F28F7/00 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract translation: 提供了具有散热装置的导热介质的保护盖，其用于覆盖和保护放置在散热装置的底部的底表面处的导热介质。 它包括片状板，弹性壁和容纳室，其中片状板是凹形的并且位于保护罩的一侧，并具有导热介质; 弹性壁沿片状板的边缘延伸，以便提供用于与散热装置夹紧的夹持力; 并且容纳室由片状基板的凹部形成以遮盖和覆盖导热介质; 而板状板通过弹性壁被夹紧到散热装置，使得容纳室用于掩蔽和覆盖导热介质。

公开(公告)号：US07274572B2

公开(公告)日：2007-09-25

申请号：US11114374

申请日：2005-04-26

Applicant: Frank Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

Inventor： Frank Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

IPC: H05K7/20

CPC classification number: H05K7/20154

Abstract: A supporting plate includes a metal plate and is utilized to support a heat sink module in an electronic device. The heat sink module has a thermal pad, and the electronic device has a first heat generating element and a second heat generating element. In addition, the heat sink module is contacted to the first heat generating element for conducting heat generated by the first heat generating element to the thermal pad. Moreover, the metal plate has a first concave portion and a second concave portion. The first concave portion is contacted to the thermal pad, and the second concave portion is contacted to the second heat generating element for conducting heat generated by the second heat generating element to the heat sink.

Abstract translation: 支撑板包括金属板，并用于支撑电子设备中的散热器模块。 散热器模块具有热垫，电子设备具有第一发热元件和第二发热元件。 此外，散热模块与第一发热元件接触，用于将由第一发热元件产生的热量传导到热垫。 此外，金属板具有第一凹部和第二凹部。 第一凹部与热垫接触，第二凹部与第二发热体接触，将第二发热体产生的热量导向散热片。

公开(公告)号：US20070137565A1

公开(公告)日：2007-06-21

申请号：US11639162

申请日：2006-12-15

Applicant: Yi-Lun Cheng ,  Feng-Ku Wang ,  Chun-Lung Lin ,  Chih-Kai Yang

Inventor： Yi-Lun Cheng ,  Feng-Ku Wang ,  Chun-Lung Lin ,  Chih-Kai Yang

IPC: B05C5/00 ,  B05C11/11 ,  B05B13/02

CPC classification number: B05C5/0216 ,  B05C5/022 ,  B05C5/0254 ,  B05C11/028

Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.

Abstract translation: 自动涂布装置使用驱动电机和输送机来形成循环旋转模块。 填充有涂料的注射器设置在输送机的一侧。 当待涂覆的物体设置在移动输送机的另一侧时，涂料随后通过喷射器施加到物体上。 这可以提高涂层的速度和质量。

公开(公告)号：US20060232933A1

公开(公告)日：2006-10-19

申请号：US11108688

申请日：2005-04-19

Applicant: Frank Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

Inventor： Frank Wang ,  Yi-Lun Cheng ,  Chih-Kai Yang

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated heat sink device comprises a thermal module and a fan module; wherein the thermal module further comprises a first heat conduction module, a fin set, and a second heat conduction module; wherein the fan module, its vent connects with the fin set in an air-tight manner in order to form a heat-dissipating channel; and the first and second heat conduction modules are with different angles of heat connected surfaces so that the invention of the integrated heat sink device can dissipate the heat generated by heat-generating elements with different angles of radiation surface.

Abstract translation: 提供了一种集成散热装置，其用于散发由不同的辐射表面角度（例如，CPU和显示芯片）的发热元件产生的热量，其辐射面为180°和90°）。 集成散热器装置包括热模块和风扇模块; 其中所述热模块还包括第一热传导模块，散热片组和第二热传导模块; 其中所述风扇模块的通风口与所述翅片组以气密方式连接，以形成散热通道; 并且第一和第二热传导模块具有不同的热连接表面的角度，使得集成散热装置的发明可以以不同的辐射角度散发由发热元件产生的热量。

公开(公告)号：US20060082968A1

公开(公告)日：2006-04-20

申请号：US11140085

申请日：2005-05-27

Applicant: Yi-Lun Cheng ,  Chih-Kai Yang

Inventor： Yi-Lun Cheng ,  Chih-Kai Yang

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A fool-proof device on the heatsink thermal module for the notebook computer is provided. With an interference member installed on one side of the case of the heatsink thermal module, when installing the heatsink thermal module, the interference member and a predetermined recognition area on the printed circuit board (PCB) can provide a fool-proof function to avoid assembling error of two modules with different standard but similar in appearance in the assembling process.

Abstract translation: 提供了笔记本电脑散热器散热模块上的傻瓜装置。 在安装散热器散热模块壳体一侧的干扰构件的情况下，当安装散热器散热模块时，干扰构件和印刷电路板（PCB）上的预定识别区域可以提供愚蠢功能，以避免组装 在组装过程中两个不同标准但外观相似的模块的误差。

公开(公告)号：US20110122914A1

公开(公告)日：2011-05-26

申请号：US12748809

申请日：2010-03-29

Applicant: Feng Ku WANG ,  Yi Lun CHENG

Inventor： Feng Ku WANG ,  Yi Lun CHENG

IPC: G01N25/20

CPC classification number: H01L23/367 ,  G06F1/206 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source.

Abstract translation: 通过线性方程描述在不均匀热源下的第一散热模块的耐热值与均匀热源下的第一散热模块的耐热值之间的对应关系。 因此，在第二散热模块被测试之前，利用线性方程进行计算，使得布置在不均匀热源上的第一散热模块的目标耐热值对应于 第一个散热模块布置在均匀的热源上。 然后，通过使用通过测试布置在均匀热源上的第二散热模块而获得的测试耐热值来预测布置在不均匀热源上的第二散热模块是否满足测试标准。