Abstract:
A power divider having metal capacitors is disclosed to detect and divide a frequency signal. The divide includes a first capacitor including first and second electrodes formed at a first portion of a substrate, a second capacitor including first and second electrodes formed at a second portion of the substrate, a first metal line connected to the second electrode of the first capacitor, a second metal line connected to the second electrode of the second capacitor, a poly resistor connected to a contact area of the first capacitor and to a contact area of the second capacitor, and a third metal line connected to the first and second metal lines to divide a signal flown through the first and second metal lines.
Abstract:
According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.
Abstract:
A semiconductor device for reinforcing a substructure of a bond pad and a method for fabricating the same are provided. According to an embodiment, a semiconductor device for reinforcing a substructure of a bond pad comprises a semiconductor substrate and a substructure formed on the semiconductor substrate. The semiconductor device further includes an interlevel dielectric layer formed on the substructure. The interlevel dielectric layer includes a contact opening formed therein. The contact opening comprises a plurality of separate dots connected to each other. A contact plug is formed in the contact opening.
Abstract:
A complex authentication system that uses personal variable biometric information which changes according to times and environments, and a complex authentication method using the same are disclosed. The variable biometric information-based complex authentication system includes: a mobile terminal configured to collect variable biometric information; a variable biometric information management server configured to store the variable biometric information received from the mobile terminal; and an agent server configured to, when the mobile terminal requests a login command regarding the ID, verify validity of the login command regarding the ID based on the variable biometric information. Accordingly, even if biometric information used in an authentication procedure is leaked, a damage resulting therefrom can be inhibited, and security of the authentication procedure can be enhanced by combining different types of variable biometric information or by combining variable biometric information of a plurality of users.
Abstract:
Provided herein is a variable social network service method and apparatus. The variable social network service method includes receiving, by a variable social network service apparatus, information on whether or not a user serves as a bridge from a user apparatus of the user, and determining, by the variable social network service apparatus, whether or not to expand a social network based on the user based on the information on whether or not the user serves as the bridge, wherein the variable social network service apparatus determines whether or not social networking is possible between a first network subject of the user and a second network subject of the user depending on whether or not the user serves as the bridge.
Abstract:
A complex authentication system that uses personal variable biometric information which changes according to times and environments, and a complex authentication method using the same are disclosed. The variable biometric information-based complex authentication system includes: a mobile terminal configured to collect variable biometric information; a variable biometric information management server configured to store the variable biometric information received from the mobile terminal; and an agent server configured to, when the mobile terminal requests a login command regarding the ID, verify validity of the login command regarding the ID based on the variable biometric information. Accordingly, even if biometric information used in an authentication procedure is leaked, a damage resulting therefrom can be inhibited, and security of the authentication procedure can be enhanced by combining different types of variable biometric information or by combining variable biometric information of a plurality of users.
Abstract:
The present invention relates to a composition for preparing ceramic fiber and a biosoluble ceramic fiber prepared therefrom for heat insulating material at high temperature, more specifically, a composition for preparing ceramic fiber comprising SiO2 as a network-forming oxide, CaO and MgO as modifier oxides, and ZrO2, Al2O3 and B2O3 as intermediate oxides with appropriate ratios, which improves the solubility of the ceramic fiber in artificial body fluid; shows good thermal/mechanical properties such as heat resistance, high-temperature viscosity, compressive strength and restoration when used at a high temperature of 1260° C.; and provides an economic effect that a ceramic fiber can be prepared easily by using the existing facilities, and a biosoluble ceramic fiber prepared therefrom for heat insulating material at high temperature.
Abstract translation:本发明涉及一种用于制备陶瓷纤维的组合物和由其制备的用于隔热材料的高温下的生物可溶陶瓷纤维,更具体地说,涉及一种用于制备包含SiO 2作为网络形成氧化物的陶瓷纤维的组合物,CaO和MgO作为调整剂氧化物 ,ZrO 2,Al 2 O 3和B 2 O 3作为适当比例的中间氧化物,改善了陶瓷纤维在人造体液中的溶解度; 在1260℃的高温下使用时,耐热性,高温粘度,抗压强度和恢复性能良好的热/机械性能。 并且提供通过使用现有设施容易地制备陶瓷纤维的经济效果,以及由其制备的用于隔热材料的高温度的生物可溶性陶瓷纤维。
Abstract:
The present invention relates to a glass substrate composition comprising SiO2 55˜70 wt %, Al2O3 0˜1 wt %, ZrO2 0.1˜5 wt %, Na2O 0.1˜5 wt %, K2O 7˜13 wt %, MgO 7˜14 wt %, CaO 0˜4 wt %, SrO 7˜12 wt % and SO3 0.01˜0.5 wt %. The glass substrate prepared by using the above composition shows less thermal deformation at a baking process under a high temperature since the strain point of the glass is at least 570° C., does not have such disadvantages as increase of fuel cost and short life cycle of refractories resulted from less than 1460° C. of melting point, and has 80˜95×10−7/° C. of thermal expansion coefficient in the temperature range of 50˜350° C. Therefore, the glass according to the present invention is suitable as a substrate.
Abstract translation:本发明涉及包含SiO 2 55〜70重量%,Al 2 O 3 0〜1重量%,ZrO 2 0.1〜5重量%,Na 2 O 0.1〜5重量%,K 2 O 7〜13重量%,MgO 7〜14重量% %,CaO 0〜4重量%,SrO 7〜12重量%,SO 3 0.01〜0.5重量%。 使用上述组合物制备的玻璃基板在高温下的烘烤过程中显示较少的热变形,因为玻璃的应变点至少为570℃,不具有燃料成本增加和寿命周期短的缺点 的耐火材料由低于1460℃的熔点导致,并且在50〜350℃的温度范围内具有80〜95×10 -7 /℃的热膨胀系数。因此,根据本发明的玻璃 本发明适合作为基材。
Abstract:
The present invention relates to acid tolerant Leuconostoc mesenteroides with excellent mannitol productivity and the use thereof. The inventive lactic acid bacteria is useful as a food additive composition and a Kimchi starter. Kimchi prepared with the addition of the inventive lactic acid bacteria is maintained at a suitable ripening degree over an extended period of time than to the prior Kimchis, and has excellent sensory properties, including excellent refreshing taste, weak sour odor and a very soft quality of sour taste.
Abstract:
A semiconductor wafer with semiconductor chips having chip pads and a passivation layer is provided. First and second dielectric layers are sequentially formed on the passivation layer. The first and second dielectric layers form a ball pad area that includes an embossed portion, i.e., having a non-planar surface. A metal wiring layer is formed on the resulting structure including the embossed portion. A third dielectric layer is formed on the metal wiring layer. A portion of the third dielectric layer located on the embossed portion is removed to form a ball pad. A solder ball is formed on the embossed ball pad. With the embossed ball pad, the contact area between the solder balls and the metal wiring layer is increased, thereby improving the connection reliability.