公开(公告)号：US07915696B2

公开(公告)日：2011-03-29

申请号：US11877786

申请日：2007-10-24

Applicant: David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

Inventor： David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

IPC: H01L29/82

CPC classification number: B81B7/007 ,  B81B2207/07 ,  B81B2207/096 ,  H01H1/0036

Abstract: An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.

Abstract translation: 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。

公开(公告)号：US07609136B2

公开(公告)日：2009-10-27

申请号：US11961767

申请日：2007-12-20

Applicant: Xuefeng Wang ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Marco Francesco Aimi ,  Kuna Venkat Satya Rama Kishore ,  Glenn Scott Claydon ,  Oliver Charles Boomhower ,  Parag Thakre

Inventor： Xuefeng Wang ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Marco Francesco Aimi ,  Kuna Venkat Satya Rama Kishore ,  Glenn Scott Claydon ,  Oliver Charles Boomhower ,  Parag Thakre

IPC: H01H51/22

CPC classification number: H01H59/0009 ,  H01H2059/0072

Abstract: A MEMS switch includes a substrate, a movable actuator coupled to the substrate, a substrate contact, a substrate electrode, and a conductive stopper electrically coupled to the movable actuator and structured to prevent the movable actuator from contacting the substrate electrode while allowing the movable actuator to make contact with the substrate contact.

Abstract translation: MEMS开关包括衬底，耦合到衬底的可移动致动器，衬底接触件，衬底电极和电耦合到可移动致动器的导电阻塞件，并被构造成防止可动致动器接触衬底电极，同时允许可动致动器 与基板接触。

公开(公告)号：US07605466B2

公开(公告)日：2009-10-20

申请号：US11872562

申请日：2007-10-15

Applicant: Marco Francesco Aimi ,  Christopher James Kapusta ,  Arun Virupaksha Gowda ,  David Cecil Hays ,  Oliver Charles Boomhower ,  Glenn Scott Claydon ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel

Inventor： Marco Francesco Aimi ,  Christopher James Kapusta ,  Arun Virupaksha Gowda ,  David Cecil Hays ,  Oliver Charles Boomhower ,  Glenn Scott Claydon ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel

IPC: H01L23/34

CPC classification number: B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/032 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

Abstract translation: 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。

公开(公告)号：US20090107812A1

公开(公告)日：2009-04-30

申请号：US11877786

申请日：2007-10-24

Applicant: David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

Inventor： David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

IPC: H01H57/00

CPC classification number: B81B7/007 ,  B81B2207/07 ,  B81B2207/096 ,  H01H1/0036

Abstract: An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.

Abstract translation: 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。

公开(公告)号：US07505128B2

公开(公告)日：2009-03-17

申请号：US11400948

申请日：2006-04-10

Applicant: Anis Zribi ,  Stacey Joy Kennerly ,  Glenn Scott Claydon ,  Long Que ,  Ayan Banerjee ,  Shankar Chandrasekaran ,  Shivappa Ningappa Goravar ,  David Cecil Hays

Inventor： Anis Zribi ,  Stacey Joy Kennerly ,  Glenn Scott Claydon ,  Long Que ,  Ayan Banerjee ,  Shankar Chandrasekaran ,  Shivappa Ningappa Goravar ,  David Cecil Hays

IPC: G01J3/44

CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0256 ,  G01J3/0272 ,  G01J3/0291 ,  G01J3/26 ,  G01J3/44 ,  G01N21/65 ,  G01N21/658 ,  G01N2201/0221

Abstract: An integrated spectrometer instrument, including an optical source formed on a chip, the optical source configured to generate an incident optical beam upon a sample to be measured. Collection optics formed on the chip are configured to receive a scattered optical beam from the sample, and filtering optics formed on the chip are configured to remove elastically scattered light from the scattered optical beam at a wavelength corresponding to the optical source. A tunable filter formed on the chip is configured to pass selected wavelengths of the scattered optical beam, and a photo detector device formed on the chip is configured to generate an output signal corresponding to the intensity of photons passed through the tunable filter.

Abstract translation: 一种集成光谱仪器，包括形成在芯片上的光源，所述光源被配置为在待测样品上产生入射光束。 形成在芯片上的采集光学元件被配置为接收来自样品的散射光束，并且形成在芯片上的滤光光学元件被配置为以对应于光源的波长去除来自散射光束的弹性散射光。 形成在芯片上的可调滤波器被配置为通过散射光束的选定波长，并且形成在芯片上的光检测器装置被配置为产生对应于通过可调谐滤波器的光子的强度的输出信号。

公开(公告)号：US20080239306A1

公开(公告)日：2008-10-02

申请号：US11693277

申请日：2007-03-29

Applicant: William Scott Sutherland ,  Anis Zribi ,  Long Que ,  Glenn Scott Claydon ,  Stacey Joy Kennerly ,  Ayan Banerjee ,  Shivappa Ningappa Goravar ,  Shankar Chandrasekaran ,  David Cecil Hays ,  Victor Samper ,  Dirk Lange ,  Marko Baller ,  Min-Yi Shih ,  Sandip Maity

Inventor： William Scott Sutherland ,  Anis Zribi ,  Long Que ,  Glenn Scott Claydon ,  Stacey Joy Kennerly ,  Ayan Banerjee ,  Shivappa Ningappa Goravar ,  Shankar Chandrasekaran ,  David Cecil Hays ,  Victor Samper ,  Dirk Lange ,  Marko Baller ,  Min-Yi Shih ,  Sandip Maity

IPC: G01J3/44 ,  G01N21/55 ,  G02B26/08

CPC classification number: G01N21/65 ,  G01J3/02 ,  G01J3/0208 ,  G01J3/021 ,  G01J3/0218 ,  G01J3/0232 ,  G01J3/0237 ,  G01J3/027 ,  G01J3/0289 ,  G01J3/10 ,  G01J3/1895 ,  G01J3/44 ,  G02B26/02 ,  G02B26/0808 ,  G02B26/0816

Abstract: A system and method for managing optical power for controlling thermal alteration of a sample undergoing spectroscopic analysis is provided. The system includes a moveable laser beam generator for irradiating the sample and a beam shaping device for moving and shaping the laser beam to prevent thermal overload or build up in the sample. The moveable laser beam generator includes at least one beam shaping device selected from the group consisting of at least one optical lens, at least one optical diffractor, at least one optical path difference modulator, at least one moveable mirror, at least one Micro-Electro-Mechanical Systems (MEMS) integrated circuit (IC), and/or a liquid droplet. The system also includes an at least two degree of freedom (2 DOF) moveable substrate platform and a controller for controlling the laser beam generator and the substrate platform, and for analyzing light reflected from the sample.

Abstract translation: 提供了一种用于管理用于控制进行光谱分析的样品的热变化的光功率的系统和方法。 该系统包括用于照射样品的可移动激光束发生器和用于移动和成形激光束的光束整形装置，以防止样品中的热过载或积聚。 可移动激光束发生器包括至少一个光束成形装置，其选自由至少一个光学透镜，至少一个光学衍射器，至少一个光程差调制器，至少一个可动反射镜，至少一个微电极 机电系统（MEMS）集成电路（IC）和/或液滴。 该系统还包括至少两个自由度（2自由度）可移动基板平台和用于控制激光束发生器和基板平台的控制器，并用于分析从样品反射的光。

公开(公告)号：US07315161B2

公开(公告)日：2008-01-01

申请号：US11129682

申请日：2005-05-13

Applicant: Anis Zribi ,  Glenn Scott Claydon ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Ertugrul Berkcan ,  Wei-Cheng Tian

Inventor： Anis Zribi ,  Glenn Scott Claydon ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Ertugrul Berkcan ,  Wei-Cheng Tian

IPC: G01R33/00

CPC classification number: G01R33/0283 ,  G01R15/148 ,  G01R33/0286

Abstract: A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component having a capacitive magneto-MEMS component, a compensator and an output component for sensing magnetic fields and for providing, in response thereto, an indication of the current present in a respective conductor to be measured. In one embodiment, first and second mechanical sense components are electrically conductive and operate to sense a change in a capacitance between the mechanical sense components in response to a mechanical indicator from a magnetic-to-mechanical converter.

Abstract translation: 基于微机电系统（MEMS）的电流和磁场传感器包括具有电容式磁MEMS组件的基于MEMS的磁场感测部件，补偿器和用于感测磁场的输出部件，并且响应于此而提供 当前存在于待测量的导体中的指示。 在一个实施例中，第一和第二机械感测部件是导电的并且用于响应于来自磁 - 机械转换器的机械指示器感测机械感测部件之间的电容的变化。

公开(公告)号：US07221144B2

公开(公告)日：2007-05-22

申请号：US11289910

申请日：2005-11-30

Applicant: Ertugrul Berkcan ,  Shankar Chandrasekaran ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Glenn Scott Claydon ,  Debbie Gahaton Jones ,  Anis Zribi

Inventor： Ertugrul Berkcan ,  Shankar Chandrasekaran ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Glenn Scott Claydon ,  Debbie Gahaton Jones ,  Anis Zribi

IPC: G01R31/00

CPC classification number: G01R15/207 ,  G01R15/148 ,  G01R33/0283 ,  G01R33/0286 ,  G01R35/005 ,  Y10T29/49002

Abstract: A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component a structural component comprising a silicon substrate and a compliant layer comprising a material selected from the group consisting of silicon dioxide and silicon nitride, a magnetic-to-mechanical converter coupled to the structural component to provide a mechanical indication of the magnetic field, and a strain responsive component coupled to the structural component to sense the mechanical indication and to provide an indication of the current in the current carrying conductor in response thereto.

Abstract translation: 基于微机电系统（MEMS）的电流和磁场传感器包括基于MEMS的磁场感测部件，包括硅衬底的结构部件和包括选自二氧化硅和氮化硅的材料的柔性层， 耦合到所述结构部件以提供所述磁场的机械指示的磁 - 机械转换器，以及耦合到所述结构部件以感测所述机械指示并且提供所述载流导体中的电流的指示的应变响应部件 回应。