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公开(公告)号：US20240252975A1
公开(公告)日：2024-08-01
申请号：US18633649
申请日：2024-04-12
发明人： Makoto IKEMIYA , Noritaka KAMEI , Hiroyuki NAKATANI , Keita KONDO
IPC分类号： B01D53/04 , B01D53/053
CPC分类号： B01D53/0446 , B01D53/053 , B01D2256/12 , B01D2257/102 , B01D2259/4566
摘要： A gas composition adjustment apparatus includes an adsorber, a supply pump, and a discharge pump. The gas composition adjustment apparatus performs a pressurization operation in which the supply pump supplies a gas to the adsorber; and a depressurization operation in which the discharge pump discharges a gas from the adsorber. Each of the supply pump and the discharge pump is a positive displacement pump and includes a sealing member. The sealing member of the discharge pump contains a fluororesin and a fibrous carbon material as main components.
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公开(公告)号：US20240251502A1
公开(公告)日：2024-07-25
申请号：US18622921
申请日：2024-03-30
发明人： Kazuma TANIMUKAI , Masaki KONO , Hirotaka DOI , Reiji KAWASHIMA , Yuki NAKAJIMA
CPC分类号： H05K1/0277 , H05K1/144 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/2009
摘要： A substrate structure includes a first substrate with a plurality of chip parts including a first chip part mounted, and a second substrate connected to the first substrate. The first chip part has a strain equal to or more than a predetermined value, which is from 500 μST to 4000 μST, in a non-connected state in which the second substrate is not connected to the first substrate and the first substrate is supported at two predetermined points. The strain of the first chip part is equal to or less than the predetermined value in a connected state in which the second substrate is connected to the first substrate and the first substrate is supported at the two predetermined points.
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公开(公告)号：US20240247875A1
公开(公告)日：2024-07-25
申请号：US18622274
申请日：2024-03-29
发明人： Ken Sato , Mitsuharu Numata , Ko Terai , Shinya Tabata , Tomoki Hirokawa
IPC分类号： F28D9/00
CPC分类号： F28D9/0075
摘要： A heat exchanger configured to cause a refrigerant to exchange heat with a heat medium, includes: plates stacked on top of one another. A first flow path and a second flow path are formed between the plates. The refrigerant in a two phase state flows through the first flow path and the heat medium flows through the second flow path. Each of the plates includes: a first inlet from which the refrigerant flows into the first flow path; and a first outlet from which the refrigerant flows out of the first flow path. In each of the plates, when viewed in a direction in which the plates are stacked, the first inlet has line symmetry with respect to a center line in a width direction of the each of the plates, and the first outlet has line symmetry with respect to the center line.
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公开(公告)号：US12043606B2
公开(公告)日：2024-07-23
申请号：US17521155
申请日：2021-11-08
发明人： Moe Hosokawa , Koutarou Hayashi , Yoshihiro Yamamoto , Akiyoshi Yamauchi , Makoto Matsuura , Yosuke Kishikawa
IPC分类号： C07D319/12
CPC分类号： C07D319/12
摘要： The present disclosure provides, for example, a method that can produce a fluorolactone compound from hexafluoropropylene oxide or the like in a single step. The present disclosure relates to a method for producing a compound represented by formula (1):
wherein two R1 are the same and each is a fluorine atom or a fluoroalkyl group,
the method comprising step A of reacting a compound represented by formula (2):
wherein R1 is as defined above, with a compound represented by formula (3):
wherein R31, R32, and R33 are the same or different and each is a hydrogen atom or an alkyl group, or two of them are optionally linked to each other to form a ring optionally having one or more substituents, and
a compound represented by formula (4-1) or the like:
wherein R41, R42, R43, and R44 are the same or different and each is a hydrogen atom ox an alkyl group, or two of them are optionally linked to each other to form a ring optionally having one or more substituents.-
25.发明公开公开(公告)号：US20240243292A1
公开(公告)日：2024-07-18
申请号：US18617776
申请日：2024-03-27
发明人： Taketo KATO , Takaya YAMADA , Kohei YASUDA , Taku YAMANAKA , Junpei TERADA , Masayoshi MIYAMOTO
CPC分类号： H01M4/623 , H01M2004/021
摘要： The disclosure aims to provide a polytetrafluoroethylene powder for an electrode binder with excellent handleability, an electrode binder and an electrode mixture containing the electrode binder, an electrode, and a secondary battery. Provided is a polytetrafluoroethylene powder for use as an electrode binder, the polytetrafluoroethylene powder having an apparent density of 0.40 g/mL or higher and a powder particle size of 400 μm or greater.
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公开(公告)号：US20240242787A1
公开(公告)日：2024-07-18
申请号：US18622044
申请日：2024-03-29
发明人： Shohei TACHIKAWA
摘要： A method executed by a computer, the method including acquiring a chemical structure of a plurality of low molecular weight compounds; calculating an estimate value of a physical property value of each of the low molecular weight compounds and a variation of the estimate values, from the acquired chemical structure of each of the low molecular weight compounds, by using a regression model; and calculating an acquisition function from the estimate values of the physical property value and the variation of the estimate values.
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公开(公告)号：US20240241489A1
公开(公告)日：2024-07-18
申请号：US18559933
申请日：2022-06-08
发明人： Kentaro TAKAKI , Nao OKADA
IPC分类号： G05B15/02
CPC分类号： G05B15/02
摘要： Functions of two or more devices are caused to effectively collaborate with each other. A method executed by a control unit of a collaboration control apparatus, the method including a step of selecting two or more devices from among a plurality of devices; and a step of giving an instruction to the selected devices to implement collaboration control relating to functions of the devices.
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公开(公告)号：US20240240869A1
公开(公告)日：2024-07-18
申请号：US18618303
申请日：2024-03-27
发明人： Hiroyuki Nakano , Atsushi Yamamoto
IPC分类号： F28D7/16
CPC分类号： F28D7/163
摘要： A heat exchanger includes: a fin group including plate-shaped fins; heat transfer tubes penetrating the plate-shaped fins; and a support plate at an end of the fin group. The heat transfer tubes penetrate the support plate. The heat exchanger is configured to cause a heat medium flowing through the heat transfer tubes to exchange heat with air. End portions of the heat transfer tubes form protrusions protruding from the support plate. The protrusions include: a first protrusion connected to one of the protrusions adjacent to the first protrusion; and a second protrusion connected to a flow path pipe different from one of the protrusions adjacent to the second protrusion. A distance from a tip end of the second protrusion to the support plate is shorter than a distance from a tip end of the first protrusion to the support plate.
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公开(公告)号：US20240240804A1
公开(公告)日：2024-07-18
申请号：US18621298
申请日：2024-03-29
发明人： Hiroyuki Nakano , Shota Ago , Atsushi Yamamoto
IPC分类号： F24F1/0068 , F24F1/0067 , F28F19/02
CPC分类号： F24F1/0068 , F24F1/0067 , F28F19/02 , F28F2245/00
摘要： A connection pipe of a heat exchange unit includes a second refrigerant pipe made of a second metal higher in potential than a first metal of a first refrigerant pipe. The second refrigerant pipe includes a first section that is bent to protrude upward. The first section includes a first curved section disposed on a first refrigerant pipe side relative to an apex of the first section and a second curved section disposed on a side opposite to the first refrigerant pipe side relative to the apex of the first section. A covering member or a coating film is provided in intimate contact with the second refrigerant pipe to cover a first refrigerant pipe side edge of the second refrigerant pipe and the first curved section.
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公开(公告)号：US20240240803A1
公开(公告)日：2024-07-18
申请号：US18619959
申请日：2024-03-28
发明人： Hiroyuki Nakano , Shota Ago , Atsushi Yamamoto
IPC分类号： F24F1/0068
CPC分类号： F24F1/0068
摘要： An indoor unit includes a heat exchanger and a connection pipe, connected to the heat exchanger, through which a refrigerant flows. The connection pipe includes a first refrigerant pipe made of a first metal and a second refrigerant pipe made of a second metal higher in potential than the first metal. One end of the first refrigerant pipe is connected to the heat exchanger, and the other end of the first refrigerant pipe is connected to one end of the second refrigerant pipe. The first refrigerant pipe includes a vertical straight section, a bent section that is continuous with to a one end of the vertical straight section, and a horizontal straight section that is continuous with one end of the bent section. A covering member adheres to and covers the first refrigerant pipe from one end of the horizontal straight section to the bent section.
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