Apparatus for testing package-on-package semiconductor device and method for testing the same
    221.
    发明授权
    Apparatus for testing package-on-package semiconductor device and method for testing the same 有权
    用于测试封装在封装半导体器件上的装置及其测试方法

    公开(公告)号:US09519024B2

    公开(公告)日:2016-12-13

    申请号:US14617892

    申请日:2015-02-09

    Inventor: Chien-Ming Chen

    Abstract: An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.

    Abstract translation: 一种用于测试封装封装半导体器件的装置,包括用于将第一芯片从测试插座加载到第一芯片或从其卸载的拾取和放置装置,以及用于移动芯片放置模块的提升和旋转臂,芯片放置模块接收第二芯片 到拾取和放置设备与测试插座之间的位置。 拾取和放置装置和芯片放置模块降低,然后进行测试处理。 测试过程完成后,拾取和放置设备和芯片放置模块被提起,提升和旋转臂将芯片放置模块移动到拾取和放置设备的一侧。 因此,可以自动进行半导体装置的测试方法,大大提高测试效率和精度,并显着降低成本。

    Test apparatus with dry environment
    222.
    发明授权
    Test apparatus with dry environment 有权
    测试仪器干燥环境

    公开(公告)号:US09470749B2

    公开(公告)日:2016-10-18

    申请号:US14108176

    申请日:2013-12-16

    CPC classification number: G01R31/2877 G01N1/42 G01R31/2865

    Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

    Abstract translation: 试验装置包括试验部位,缓冲载体装置,输送装置,搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置,保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧,沿运送方向前后移动,运送物体进出试验场地,并加热物体。 处理机构携带缓冲运送装置,试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所,缓冲装置,输送装置和处理机构,并产生干燥环境以防止结露。

    Testing apparatus for light emitting diodes
    223.
    发明授权
    Testing apparatus for light emitting diodes 有权
    发光二极管测试装置

    公开(公告)号:US09429617B2

    公开(公告)日:2016-08-30

    申请号:US13299443

    申请日:2011-11-18

    CPC classification number: G01R31/2635 G01R1/0408

    Abstract: A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.

    Abstract translation: 倒装芯片LED的测试装置包括透明衬底,间隔构件,柔性透明载体和真空发生器。 间隔部件构造在透明基板的第一面上。 柔性透明载体可移除地组装到间隔构件,使得由柔性透明载体,间隔构件和透明基底的第一表面形成封闭空间。 真空发生器连接到封闭空间,用于将空气排出封闭空间,然后一部分透明基板粘附到第一表面,形成用于装载倒装芯片LED的测试区域。

    Temperature control module for a socket
    224.
    发明授权
    Temperature control module for a socket 有权
    插座温度控制模块

    公开(公告)号:US09353995B2

    公开(公告)日:2016-05-31

    申请号:US14291573

    申请日:2014-05-30

    CPC classification number: F28D15/00 H01L23/473 H01L2924/0002 H01L2924/00

    Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

    Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通,另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板,下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室,用于将插座保持在特定温度。

    Temperature controller and thermal control platform
    225.
    发明授权
    Temperature controller and thermal control platform 有权
    温控器和热控平台

    公开(公告)号:US09274532B2

    公开(公告)日:2016-03-01

    申请号:US13926957

    申请日:2013-06-25

    CPC classification number: G05D23/1902

    Abstract: A temperature controller for controlling a thermal module that raises or lowers the temperature of a thermal control platform that includes a reading interface and a control unit. The reading interface is used for reading parameters of the thermal control platform that are stored in a memory module. The control unit is connected to the reading interface for receiving the parameters read by the reading interface and for sending a control signal to the thermal module according to the corresponding parameters. The thermal module then raises or lowers the temperature according to the control signal. Accordingly, the temperature controller automatically adjusts the temperature control to different thermal control platforms.

    Abstract translation: 一种用于控制升温或降低包括阅读界面和控制单元的热控平台的温度的热模块的温度控制器。 读取界面用于读取存储在存储器模块中的热控平台的参数。 控制单元连接到读取界面,用于接收由读取界面读取的参数,并根据相应的参数向控制模块发送控制信号。 然后,热模块根据控制信号升高或降低温度。 因此,温度控制器自动将温度控制调节到不同的热控平台。

    Solar cell testing system, solar cell testing method, and multifunctional testing light source
    226.
    发明授权
    Solar cell testing system, solar cell testing method, and multifunctional testing light source 有权
    太阳能电池测试系统,太阳能电池测试方法和多功能测试光源

    公开(公告)号:US09234933B2

    公开(公告)日:2016-01-12

    申请号:US13716100

    申请日:2012-12-15

    CPC classification number: G01R31/2607 F21S8/006 F21Y2115/10 H02S50/10

    Abstract: A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.

    Abstract translation: 太阳能电池测试系统包括多功能测试光源,测量单元和运算单元。 多功能测试光源被配置为切换以将模拟的太阳光输出到太阳能电池,或者将多个窄带光异步输出到太阳能电池。 测量单元耦合到太阳能电池并且测量太阳能电池对模拟的太阳光的响应以及对异步输出的窄带光的响应。 算术单元耦合到多功能测试光源和测量单元; 它基于太阳能电池对模拟的太阳光的响应和对异步输出的窄带光的响应来确定太阳能电池的转换效率和光谱响应。

    Light-emitting module and driving method thereof
    227.
    发明授权
    Light-emitting module and driving method thereof 有权
    发光模块及其驱动方法

    公开(公告)号:US09232600B2

    公开(公告)日:2016-01-05

    申请号:US14546323

    申请日:2014-11-18

    CPC classification number: H05B33/086

    Abstract: A light-emitting module and a driving method thereof are disclosed. In this method, P light-emitting units are selected as a target group, wherein each of the P light-emitting units has N different power parameters corresponding to N sub-bands. P evaluated current values corresponding to the P light-emitting units are computed according to a target spectrum and the N×P power parameters corresponding to the P light-emitting unit in the target group. An emission-spectrum error is computed according to the target spectrum, the N×P power parameters, and the P evaluated current values. It is determined whether the emission-spectrum error conforms with the determining criteria. When the emission-spectrum error conforms with determining criteria, the P evaluated current values are set to be P driving current values corresponding to the P light-emitting units.

    Abstract translation: 公开了一种发光模块及其驱动方法。 在该方法中,选择P个发光单元作为目标组,其中每个P个发光单元具有对应于N个子带的N个不同的功率参数。 根据目标光谱和对应于目标组中的P发光单元的N×P功率参数来计算对应于P个发光单元的P评估电流值。 根据目标光谱,N×P功率参数和P评估电流值计算发射光谱误差。 确定发射光谱误差是否符合确定标准。 当发射光谱误差符合确定标准时,P评估电流值被设置为对应于P个发光单元的P个驱动电流值。

    Temperature Control Module For A Socket
    228.
    发明申请
    Temperature Control Module For A Socket 有权
    套管温度控制模块

    公开(公告)号:US20140368999A1

    公开(公告)日:2014-12-18

    申请号:US14291573

    申请日:2014-05-30

    CPC classification number: F28D15/00 H01L23/473 H01L2924/0002 H01L2924/00

    Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

    Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通,另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板,下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室,用于将插座保持在特定温度。

    Total luminous flux measurement system and total luminous flux measuring method
    229.
    发明授权
    Total luminous flux measurement system and total luminous flux measuring method 有权
    总光通量测量系统和总光通量测量方法

    公开(公告)号:US08773655B2

    公开(公告)日:2014-07-08

    申请号:US13614140

    申请日:2012-09-13

    CPC classification number: G01J1/4257 G01J1/0422 G01J1/42 G01J2001/4252

    Abstract: The present invention relates to a total luminous flux measurement system and a method thereof for measuring a total luminous flux of a light emitting component. The total luminous flux measurement system includes a light receiving module, a first light detector and a processing module. The light receiving module is disposed on a central normal of the light emitting component and divides a projection light field to a forward light field and a side light field. The light receiving module receives a beam in the forward light field to obtain a forward luminous flux. The first light detector is disposed on a side of the light receiving module to receive a beam in the side light field to obtain a first side luminous flux. The processing module electrically connects the light receiving module and the first light detector to calculate the total luminous flux at the light emitting component.

    Abstract translation: 本发明涉及一种用于测量发光部件的总光通量的总光通量测量系统及其方法。 总光通量测量系统包括光接收模块,第一光检测器和处理模块。 光接收模块设置在发光元件的中心法线上,并将投影光场分为正光场和侧光场。 光接收模块在正射光场中接收光束以获得正向光通量。 第一光检测器设置在光接收模块的一侧以在侧光场中接收光束以获得第一侧光通量。 处理模块将光接收模块和第一光检测器电连接,以计算发光部件处的总光通量。

    OPTICAL DETECTION SYSTEM
    230.
    发明申请
    OPTICAL DETECTION SYSTEM 审中-公开
    光学检测系统

    公开(公告)号:US20140043310A1

    公开(公告)日:2014-02-13

    申请号:US13961856

    申请日:2013-08-07

    Abstract: The invention relates to an optical detection system for detecting the optical distribution of a display device having a light source and a predetermined display range divided into multiple virtual detection regions. The system includes a power module for supplying power to the light source, a monochromatic module for detecting luminous intensity of the light source at various wavelengths within a selected virtual detection region, multiple optical sensor modules, each corresponding to one of the virtual detection regions, a memory module saving wavelength correction parameters of the optical sensor modules, and a processor module receiving the wavelength distribution within the selected virtual detection region of the display device, and for calculating and compensating for expected detection values of the respective optical sensor modules based on the wavelength correction parameters and actual detection values of the optical sensor modules.

    Abstract translation: 本发明涉及一种用于检测具有光源和划分成多个虚拟检测区域的预定显示范围的显示装置的光学分布的光学检测系统。 该系统包括用于向光源供电的电源模块,用于检测所选择的虚拟检测区域内的各种波长的光源的发光强度的单色模块,每个对应于虚拟检测区域之一的多个光学传感器模块, 存储模块,其保存所述光学传感器模块的波长校正参数;以及处理器模块,其在所述显示装置的所选择的虚拟检测区域内接收所述波长分布,并且用于基于所述显示装置的各个光学传感器模块的预期检测值来计算和补偿 波长校正参数和光学传感器模块的实际检测值。

Patent Agency Ranking