Abstract:
An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.
Abstract:
A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.
Abstract:
A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.
Abstract:
A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.
Abstract:
A temperature controller for controlling a thermal module that raises or lowers the temperature of a thermal control platform that includes a reading interface and a control unit. The reading interface is used for reading parameters of the thermal control platform that are stored in a memory module. The control unit is connected to the reading interface for receiving the parameters read by the reading interface and for sending a control signal to the thermal module according to the corresponding parameters. The thermal module then raises or lowers the temperature according to the control signal. Accordingly, the temperature controller automatically adjusts the temperature control to different thermal control platforms.
Abstract:
A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.
Abstract:
A light-emitting module and a driving method thereof are disclosed. In this method, P light-emitting units are selected as a target group, wherein each of the P light-emitting units has N different power parameters corresponding to N sub-bands. P evaluated current values corresponding to the P light-emitting units are computed according to a target spectrum and the N×P power parameters corresponding to the P light-emitting unit in the target group. An emission-spectrum error is computed according to the target spectrum, the N×P power parameters, and the P evaluated current values. It is determined whether the emission-spectrum error conforms with the determining criteria. When the emission-spectrum error conforms with determining criteria, the P evaluated current values are set to be P driving current values corresponding to the P light-emitting units.
Abstract:
A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.
Abstract:
The present invention relates to a total luminous flux measurement system and a method thereof for measuring a total luminous flux of a light emitting component. The total luminous flux measurement system includes a light receiving module, a first light detector and a processing module. The light receiving module is disposed on a central normal of the light emitting component and divides a projection light field to a forward light field and a side light field. The light receiving module receives a beam in the forward light field to obtain a forward luminous flux. The first light detector is disposed on a side of the light receiving module to receive a beam in the side light field to obtain a first side luminous flux. The processing module electrically connects the light receiving module and the first light detector to calculate the total luminous flux at the light emitting component.
Abstract:
The invention relates to an optical detection system for detecting the optical distribution of a display device having a light source and a predetermined display range divided into multiple virtual detection regions. The system includes a power module for supplying power to the light source, a monochromatic module for detecting luminous intensity of the light source at various wavelengths within a selected virtual detection region, multiple optical sensor modules, each corresponding to one of the virtual detection regions, a memory module saving wavelength correction parameters of the optical sensor modules, and a processor module receiving the wavelength distribution within the selected virtual detection region of the display device, and for calculating and compensating for expected detection values of the respective optical sensor modules based on the wavelength correction parameters and actual detection values of the optical sensor modules.