-
公开(公告)号:US20240165745A1
公开(公告)日:2024-05-23
申请号:US18512166
申请日:2023-11-17
申请人: Robert Bosch GmbH
IPC分类号: B23K26/402 , B23K26/16 , G01L19/14
CPC分类号: B23K26/402 , B23K26/16 , G01L19/14
摘要: A method for processing a sensor, in particular a pressure sensor, wherein the sensor has a sensing element arranged in a housing, wherein the housing has a housing opening, wherein a gel covering the sensing element is arranged inside the housing. The method includes: applying laser radiation through the housing opening to a gel surface of the gel facing away from the sensing element, such that the gel surface is modified by the applied laser radiation. A sensor, in particular a pressure sensor, comprising: a sensing element arranged in a housing, wherein the housing has a housing opening, wherein a gel covering the sensing element is arranged inside the housing, wherein the gel has a gel surface facing away from the sensing element and modified by laser radiation.
-
公开(公告)号:US11953391B2
公开(公告)日:2024-04-09
申请号:US18048385
申请日:2022-10-20
CPC分类号: G01L13/025 , G01L9/0052 , G01L19/0627 , G01L19/147
摘要: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.
-
公开(公告)号:US11945422B2
公开(公告)日:2024-04-02
申请号:US16971087
申请日:2019-02-14
申请人: Robert Bosch GmbH
CPC分类号: B60T17/221 , B60T13/57 , B60T17/04 , G01L19/0038 , G01L19/14
摘要: A pressure sensor for a brake booster includes a housing that receives a pressure sensor element and which has a first fluid connection, via which the pressure sensor can be connected to the brake booster. The housing has a second fluid connection with a receiving opening which at least partly receives a flow valve and a connection socket for a vacuum pump, wherein the flow valve releases the flow of fluid in the direction of the vacuum pump and blocks the flow of fluid in the opposite direction. The flow valve is designed as a membrane insert and is inserted into the receiving opening.
-
公开(公告)号:US11931500B2
公开(公告)日:2024-03-19
申请号:US17093825
申请日:2020-11-10
发明人: Hiroyuki Kawajiri , Shingo Okamoto , Ryo Kato
CPC分类号: A61M1/3641 , A61M1/1605 , A61M1/36 , G01L7/08 , G01L11/00 , G01L19/00 , G01L19/0023 , G01L19/14 , A61M2205/3331 , A61M2205/7536
摘要: A pressure detector that includes a case connectable to a flow route for liquid, and a membrane member provided in the case and with which a liquid-phase portion to be supplied with the liquid in the flow route and a gas-phase portion to be supplied with gas are separated from each other, the membrane member being displaceable in accordance with a pressure of the liquid supplied to the liquid-phase portion, the pressure detector detecting the pressure of the liquid in the flow route by detecting a pressure in the gas-phase portion. The gas-phase portion has an opening through which the gas is allowed to be introduced or discharged in accordance with the displacement of the membrane member, and a secured portion secured for the introduction or discharge of the gas through the opening during the displacement of the membrane member toward a side of the gas-phase portion.
-
公开(公告)号:US20240077376A1
公开(公告)日:2024-03-07
申请号:US18270695
申请日:2022-01-05
申请人: EZMEMS LTD.
发明人: Nicola MOLINAZZI , Tsvi SHMILOVICH
CPC分类号: G01L19/0092 , G01L19/083 , G01L19/14
摘要: Modular sensor configurations utilize an embeddable sensor module configured for integration into a product or device, or a technical element thereof, for in situ sensing at least one property or condition associated with the product or device, or its technical element, or with a substance contained, processed or streamed therethrough. The embeddable sensor module includes one or more sensor elements that sense the at least one property or condition, and circuitry for generating measurement data/signals indicative of the at least one property or condition, and for transmitting the generated measurement data/signals to an external device. The embeddable sensor module can be powered and activated by signals received from an external device. Such sensing structures/arrays can utilize embeddable sensor modules integrated into a product or device and an external device configure to externally power and activate the embeddable sensor modules to cause them to generate and transmit the measurement data/signals.
-
公开(公告)号:US11895776B2
公开(公告)日:2024-02-06
申请号:US17278782
申请日:2019-09-20
申请人: Proterial, Ltd.
发明人: Takahiro Umeyama
CPC分类号: H05K1/189 , G01L9/0041 , G01L9/04 , G01L19/141 , G05D7/06 , H05K1/115 , H05K1/181 , H05K3/323 , H05K2201/09372 , H05K2201/09836 , H05K2201/10151
摘要: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.
-
17.
公开(公告)号:US20240035913A1
公开(公告)日:2024-02-01
申请号:US18256678
申请日:2021-11-26
发明人: Patrick Doria
CPC分类号: G01L19/142 , G01L19/0618 , G01L19/0645
摘要: A method for producing a differential pressure sensor includes steps of: introducing a rotationally-symmetrical electronics module into a cavity of a mechanical module until a contact face of the electronics module hits a stop face of the mechanical module; welding and/or gluing at least the contact face to the stop face; axial welding in an opening region of the cavity, such that the mechanical module is welded to the electronics module all around by means of the weld; filling at least two pressure transmission lines with a pressure transmission liquid, wherein the at least two pressure transmission lines are provided for the transmission of the first pressure and the second pressure from the first separating membrane and the second separating membrane, respectively, to two opposing faces of the differential pressure sensor element; and placing the housing onto the housing adapter.
-
公开(公告)号:US20240035911A1
公开(公告)日:2024-02-01
申请号:US18483731
申请日:2023-10-10
发明人: Alexander A. Ned , Scott Goodman
CPC分类号: G01L19/0084 , G01L19/0069 , G01L19/147
摘要: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.
-
公开(公告)号:US20240019329A1
公开(公告)日:2024-01-18
申请号:US18256528
申请日:2021-11-25
发明人: Andreas Roßberg , Nils Ponath
CPC分类号: G01L19/147 , G01L9/0075 , G01L19/0084 , G01L19/0069
摘要: An overload-resistant pressure measuring sensor includes a pressure sensor arranged in an interior of a sensor housing and can be exposed, through an opening in the sensor housing, to a medium under pressure of up to 1000 bar. The medium may be a hydrogen-containing medium and can be measured with high measurement accuracy. The pressure sensor is mounted on connection elements protruding into the interior and free-standing in the interior such that the pressure sensor is exposed to the pressure prevailing in the interior on all sides. The pressure sensor includes two ceramic measuring bodies connected to one another while enclosing a pressure chamber, and are each deformable by the pressure acting thereon, and further includes an electromechanical transducer which converts a mechanical variable that is dependent on a sum of the pressure-dependent deformations of both measuring bodies into a measurable electrical measurement variable.
-
公开(公告)号:US20240011860A1
公开(公告)日:2024-01-11
申请号:US18037485
申请日:2020-12-31
发明人: Yadong DONG
CPC分类号: G01L19/0038 , G01L19/142 , A61M5/16854
摘要: A pipeline pressure monitoring device includes a housing, a vent nozzle, a first circuit board, a pressure sensor, a sliding sleeve, an elastic member sleeved on the vent nozzle and sandwiched between the first stop block and the sliding sleeve, a magnetic block on the sliding sleeve, a second circuit board connected to the first circuit board, and a position sensor on the second circuit board and cooperating with the magnetic block. A first stop block is arranged on the vent nozzle. One end of the vent nozzle protrudes from the housing through a mounting hole of the housing. The pressure sensor is installed at the other end of the vent nozzle and on the first circuit board. The pressure sensor blocks the other end of the vent nozzle. The sliding sleeve is installed in the mounting hole in a sliding manner and sleeved on the vent nozzle.
-
-
-
-
-
-
-
-
-