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公开(公告)号：US11860815B2
公开(公告)日：2024-01-02
申请号：US17281731
申请日：2019-10-04
发明人： Shaochun Tang , Michael Begel , Hucheng Chen , Helio Takai , Francesco Lanni
CPC分类号： G06F15/7867 , G06F1/12 , G06F1/189 , G06F1/26 , H05K1/0251 , H05K2201/10121
摘要： A reconfigurable computing platform includes a reconfigurable computing device, electro-optical transceiver, and first voltage converter disposed on a multilayer board. The electro-optical transceiver converts an optical signal at least one of to and from an electrical signal, and the electrical signal is operatively coupled to the reconfigurable computing device. The electro-optical transceiver is disposed in proximity to the reconfigurable computing device, and the first voltage converter is operatively coupled to a common voltage distributed around a periphery of the multilayer board. The first voltage converter converts the common voltage to a first operating voltage, and the first voltage converter is disposed in proximity to the reconfigurable computing device. The first operating voltage is provided to the reconfigurable computing device as a first power source. A reconfigurable computing system includes a plurality of reconfigurable computing platforms operatively coupled together using an optical signal. A corresponding method of providing a reconfigurable computing platform is also disclosed.
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12.发明公开公开(公告)号：US20230396066A1
公开(公告)日：2023-12-07
申请号：US18032871
申请日：2022-03-18
申请人： Google LLC
摘要： Current imbalance may be detected and components reactively moved to correct the current imbalance. The components, such as rectifiers, machines, etc., may be moved from the most loaded phase to the least loaded phase. The imbalance may be detected at one or more power distribution units. Rebalancing may be performed using a model which preserves the number of components per rack, while limiting per-rack phase imbalance and minimizing imbalance among phases. Once the rebalancing has been computed, instructions for moving components according to the rebalancing may be generated.
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公开(公告)号：US20230393635A1
公开(公告)日：2023-12-07
申请号：US17833784
申请日：2022-06-06
申请人： Apple Inc.
CPC分类号： G06F1/1683 , G06F1/163 , G06F1/1698 , G06F1/189
摘要： A modular light assembly is designed for integration with wearable devices. For example, the modular light assembly can connect with a wearable device, such as a smartwatch, including both a device housing and a band of the wearable device. Additionally, the modular light assembly can receive communication from the wearable device through various means, including inductive energy transfer. As a result, the modular light assembly can receive communication from the wearable device to activate (turn on) or deactivate (turn off) one or more light sources of the modular light assembly. Additionally, or alternatively, the modular light assembly device may include a button coupled to a switch that can activate or deactivate the light source(s).
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公开(公告)号：US11829212B2
公开(公告)日：2023-11-28
申请号：US17448988
申请日：2021-09-27
申请人： Dell Products L.P.
IPC分类号： G06F1/26 , G06F1/18 , H05K1/11 , G06F1/20 , G06F1/3203
CPC分类号： G06F1/189 , G06F1/20 , H05K1/118 , G06F1/3203
摘要： In one embodiment, a method for distributing power using a power distribution system includes: receiving, by a first power distribution end of a power conductor of the power distribution system, power from a power supply unit via a first cable coupled to the power supply unit, the first power distribution end coupled to a first connector, the first connector including a first power interface coupling the first power distribution end to the first cable, the power conductor contoured to removably couple to a heatsink of the information handling system; and providing, by a second power distribution end of the power conductor, the power to a component of the information handling system via a second cable coupled to the component, the second power distribution end coupled to a second connector, the second connector including a second power interface coupling the second power distribution end to the second cable.
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公开(公告)号：US11829210B2
公开(公告)日：2023-11-28
申请号：US17454512
申请日：2021-11-11
发明人： Hyoseok Yun , Taegon Kim , Myoungseop Song , Jongmin Shim , Jang-Mi Lee , Kihyun Pyun
CPC分类号： G06F1/183 , G06F1/189 , G09G3/20 , G09G2310/0275
摘要： A circuit board assembly includes a main board and a connection board attached to the main board. The connection board includes a base board including a connecting pad area and a mounting area, wherein the connection board is attached to the main board in the connecting pad area, and wherein the mounting area is spaced apart from the connecting pad area in a first direction and includes a driving chip mounted thereon. The connection board further includes first connection pads disposed on the connecting pad area of the base board, and second connection pads disposed on the connecting pad area of the base board. The main board includes first main pads connected to the first connection pads in a one-to-one connection and a second main pad connected to the second connection pads in a many-to-one connection.
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公开(公告)号：US11815964B2
公开(公告)日：2023-11-14
申请号：US17154266
申请日：2021-01-21
发明人： Jong Min Kim , Han Sub Ryu , Dong Pil Park
CPC分类号： G06F1/1698 , G06F1/1626 , G06F1/189 , H01Q1/22 , H01Q1/364 , H01Q1/38 , H01Q1/46 , H01Q9/045 , H01Q9/0485
摘要： An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting a length of the bonding region.
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公开(公告)号：US20230350470A1
公开(公告)日：2023-11-02
申请号：US18347030
申请日：2023-07-05
申请人： Japan Display Inc.
发明人： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
CPC分类号： G06F1/189 , G06F1/1605 , G06F1/1652 , G09F9/301
摘要： An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20230315170A1
公开(公告)日：2023-10-05
申请号：US18208422
申请日：2023-06-12
申请人： Google LLC
发明人： Drazena Brocilo , Selver Corhodzic
CPC分类号： G06F1/189 , G06F1/263 , G06F1/266 , H05K7/1492
摘要： A system including a power bus configured to supply power to a plurality of server racks arranged within a space of a building, a first power source connection positioned at a first side of the building and configured to supply power from a first power source to the power bus, a second power source positioned at a second side of the building different from the first side and configured to supply power from a second power source to the power bus, and a plurality of diverter switches arranged within the power bus. Each diverter switch may be configured to receive a respective control signal and, responsive to the respective control signal, redirect power within the power bus.
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公开(公告)号：US20230280802A1
公开(公告)日：2023-09-07
申请号：US18005340
申请日：2021-07-12
发明人： Shaohua ZHANG , Nangeng ZHANG
IPC分类号： G06F1/18
摘要： Disclosed is a frame, comprising a frame body and a control module. The frame body comprises a bottom plate, a top plate and a side plate, wherein the side plate is supported between the bottom plate and the top plate; a power source module accommodation area and a computing module accommodation area are defined between the bottom plate and the top plate; the bottom plate is provided with a frame slideway; and a power source module and a computing module respectively enter and exit by means of the frame slideway, and are fixed in the power source module accommodation area and the computing module accommodation area. The control module is connected to the top plate. The aim of the present invention is to provide a frame, which is used for an integrated computing unit, and which has a small and lightweight structure, a rational layout and is low cost.
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公开(公告)号：US20230269871A1
公开(公告)日：2023-08-24
申请号：US18140741
申请日：2023-04-28
发明人： Zhifeng ZHAN , Peng HUANG , Yanxin WANG , Shuquan YANG , Wei WANG
CPC分类号： H05K1/0296 , G06F1/1652 , G06F1/189 , G09F9/301 , H01B7/04 , H05K1/0346
摘要： The present disclosure provides a wiring structure, a display substrate and a display device, and belongs to the field of display technology. The wiring structure of the present disclosure comprises a body portion provided with hollow patterns; the body portion has a first side and a second side which are provided opposite to each other along an extending direction of the wiring structure, and both the first and second sides are wavy; the body portion comprises a plurality of conductive elements sequentially connected along the extending direction of the wiring structure; and in each conductive element, a length of a protruding portion on the first side in the extending direction of the wiring structure is different from that of a protruding portion on the second side in the extending direction of the wiring structure.
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