公开(公告)号：US08413907B2

公开(公告)日：2013-04-09

申请号：US13468058

申请日：2012-05-10

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

摘要翻译： 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US08326223B2

公开(公告)日：2012-12-04

申请号：US12714607

申请日：2010-03-01

申请人： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

发明人： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC分类号： H04B5/00 ,  H04B1/16

CPC分类号： H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US08191791B2

公开(公告)日：2012-06-05

申请号：US13022695

申请日：2011-02-08

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

摘要翻译： 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US07997501B2

公开(公告)日：2011-08-16

申请号：US12503188

申请日：2009-07-15

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

摘要翻译： 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US07905421B2

公开(公告)日：2011-03-15

申请号：US12503188

申请日：2009-07-15

申请人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

发明人： Nobuo Ikemoto ,  Satoshi Ishino ,  Yuya Dokai ,  Noboru Kato ,  Takeshi Kataya ,  Ikuhei Kimura ,  Mikiko Tanaka

IPC分类号： G06K19/06

摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

公开(公告)号：US07764928B2

公开(公告)日：2010-07-27

申请号：US11930818

申请日：2007-10-31

申请人： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

发明人： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC分类号： H04B7/00 ,  H04B1/16

CPC分类号： H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

摘要翻译： 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US09135550B2

公开(公告)日：2015-09-15

申请号：US12797824

申请日：2010-06-10

申请人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07758 ,  G06K19/07786

摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

摘要翻译： 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。

公开(公告)号：US08757500B2

公开(公告)日：2014-06-24

申请号：US12603608

申请日：2009-10-22

申请人： Noboru Kato ,  Yuya Dokai

发明人： Noboru Kato ,  Yuya Dokai

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

摘要： A wireless IC device has a structure such that the size of a radiation plate and a radiation characteristic may be determined irrespective of an impedance of a wireless IC chip. The wireless IC device includes a wireless IC chip that is arranged to process transmission and reception signals, a spiral matching inductance element and a plane electrode that are located on a surface of a feeder circuit substrate, and a coil-shaped radiation plate located on a radiation substrate. Plane electrodes connected to both ends of the radiation plate are electromagnetically coupled respectively to the inductance element and the plane electrode. The wireless IC chip is operated by a signal received by the radiation plate, and a response signal from the wireless IC chip is radiated outside from the radiation plate.

摘要翻译： 无线IC器件具有能够确定辐射板的尺寸和辐射特性而不考虑无线IC芯片的阻抗的结构。 无线IC器件包括布置成处理发送和接收信号的无线IC芯片，位于馈电电路基板的表面上的螺旋匹配电感元件和平面电极以及位于馈电电路基板的表面上的线圈形辐射板 辐射基板。 连接到辐射板两端的平面电极分别电磁耦合到电感元件和平面电极。 无线IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US08583043B2

公开(公告)日：2013-11-12

申请号：US13094928

申请日：2011-04-27

申请人： Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

发明人： Noboru Kato ,  Nobuo Ikemoto ,  Yuya Dokai ,  Koji Shiroki

IPC分类号： H04B7/00

CPC分类号： H01Q9/285 ,  G06K19/07718 ,  G06K19/07735 ,  G06K19/07749 ,  H01L23/60 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/24 ,  H01L2924/00

摘要： A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.

摘要翻译： 高频器件包括无线IC芯片和耦合到无线IC芯片并电连接到散热器板的板，并且在板中提供电感器和/或电容作为静电对抗元件。 电感器并联在无线IC芯片和散热板之间，其静电频率下的阻抗小于无线IC芯片的阻抗。

公开(公告)号：US08081541B2

公开(公告)日：2011-12-20

申请号：US12326916

申请日：2008-12-03

申请人： Yuya Dokai ,  Noboru Kato ,  Ikuhei Kimura

发明人： Yuya Dokai ,  Noboru Kato ,  Ikuhei Kimura

IPC分类号： G11B11/00

CPC分类号： G11B23/286 ,  G11B20/00086 ,  G11B20/00094 ,  G11B20/00173 ,  G11B20/0021 ,  G11B20/00253 ,  G11B20/00275 ,  G11B20/00492 ,  G11B20/00695 ,  G11B20/00876 ,  G11B23/30 ,  G11B2220/2537

摘要： An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.

摘要翻译： 光盘包括安装在其中的电磁耦合模块。 电磁耦合模块包括无线IC芯片和馈电电路基板，其中设置包括具有预定谐振频率的谐振电路的馈电电路。 电磁耦合模块电磁耦合到限定光盘的金属薄膜的反射膜，反射膜限定电磁耦合模块的天线或辐射图。