摘要:
Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.
摘要:
Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.
摘要:
Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxide compound.
摘要:
An adhesive comprising at least a) polyisobutylene and b) at least one tackifying resin, c) the molecular weight distribution of the polyisobutylene having two relative maxima, specifically d) one between 50,000 and 200,000 g/mol and e) a second between 1.0×106 and 3.5×106 g/mol.
摘要翻译:一种至少包含a)聚异丁烯和b)至少一种增粘树脂的粘合剂,c)具有两个相对最大值的聚异丁烯的分子量分布,特别是d)一个在50,000和200,000g / mol之间,e)在1.0×10 6和5×10 6 g / mol。
摘要:
Adhesive tape suitable for flying splice of flat web material having non-polar surfaces which has been wound to form rolls, the adhesive tape comprising an upper self-adhesive composition (1, 11), a splittable carrier (2, 12) and a lower self-adhesive composition (3, 13) on the bottom face of the splittable carrier (2, 12), wherein as upper self-adhesive composition (1, 11) a silicone-free self-adhesive composition is used which has a bond strength to a polyethylene substrate of 1.5 N/cm or more (measurement method tesa test A) and an initial tack corresponding to a rolling distance of 200 mm or less (measurement method tesa test D), and as lower self-adhesive composition (3, 13) a self-adhesive composition is used which has a bond strength to a polyethylene substrate of 1.5 N/cm or more (measurement method tesa test A) and a complex viscosity of 10,000 Pa·s or more at 1 rad/s and 40° C. (measurement method tesa test F).
摘要:
Solution for pretreating a hydrophilic surface to impart water repellency, comprising a silane of the formula and a component which causes the pH range of the hydrophilic surface to deviate by at least two units from neutral.
摘要:
Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate
摘要:
A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer blocks which contain more than 30% by weight of 1,2-linked diene in their block structure, or both, and which is crosslinkable by exposure to UV-light or electron beams, and b) one or more block copolymers composed of vinylaromatic blocks and elastomer blocks, the block polyvinylaromatic content being greater than 20%, and c) one or more tackifier resins.
摘要翻译:一种由以下混合物组成的压敏粘合剂,该混合物包含:a)具有大于300,000g / mol的星形结构和分子量M w s的苯乙烯嵌段共聚物,或具有含有多于 30重量%的它们的嵌段结构中的1,2-连接二烯或两者,并且其可通过暴露于UV光或电子束而交联,和b)一种或多种由乙烯基芳族嵌段和弹性体嵌段组成的嵌段共聚物, 嵌段聚乙烯基芳族化合物含量大于20%,和c)一种或多种增粘树脂。
摘要:
Adhesive tape strip for a rereleasable adhesive bond, which can be removed from a bonded joint by pulling in the direction of the bond plane, characterized in that the bonding area decreases in the region of the grip tab or in the pressure-sensitive adhesive region directly bordering the grip tab.
摘要:
Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.