Adhesive tape and its use
    15.
    发明授权
    Adhesive tape and its use 有权
    胶带及其用途

    公开(公告)号:US08268442B2

    公开(公告)日:2012-09-18

    申请号:US11559991

    申请日:2006-11-15

    IPC分类号: C09J7/02 B65H69/02

    摘要: Adhesive tape suitable for flying splice of flat web material having non-polar surfaces which has been wound to form rolls, the adhesive tape comprising an upper self-adhesive composition (1, 11), a splittable carrier (2, 12) and a lower self-adhesive composition (3, 13) on the bottom face of the splittable carrier (2, 12), wherein as upper self-adhesive composition (1, 11) a silicone-free self-adhesive composition is used which has a bond strength to a polyethylene substrate of 1.5 N/cm or more (measurement method tesa test A) and an initial tack corresponding to a rolling distance of 200 mm or less (measurement method tesa test D), and as lower self-adhesive composition (3, 13) a self-adhesive composition is used which has a bond strength to a polyethylene substrate of 1.5 N/cm or more (measurement method tesa test A) and a complex viscosity of 10,000 Pa·s or more at 1 rad/s and 40° C. (measurement method tesa test F).

    摘要翻译: 适用于具有非卷曲形成辊的非极性表面的扁平网状材料的拼接的胶带,所述胶带包括上部自粘合剂组合物(1,11),可分离载体(2,12)和下部 在可分离载体(2,12)的底面上的自粘组合物(3,13),其中作为上部自粘合组合物(1,11),使用无硅氧烷自粘组合物,其具有粘合强度 和1.5N / cm以上的聚乙烯基板(测定方法tesa试验A)和对应于200mm以下的滚动距离的测定方法(测定方法试验D)的初始粘性,作为较低的自粘合剂组合物(3, 13)使用对聚乙烯基材的粘合强度为1.5N / cm以上(测定方法试验A)和10,000Pa·s以上的复数粘度为1rad / s和40的自粘组合物 °C(测量方法tesa测试F)。

    Pressure-sensitive adhesive and detachable strip formed from it

    公开(公告)号:US08128781B2

    公开(公告)日:2012-03-06

    申请号:US12113983

    申请日:2008-05-02

    摘要: Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.