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公开(公告)号:US11538805B2
公开(公告)日:2022-12-27
申请号:US17089291
申请日:2020-11-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuan-Chang Chiu , Chia-Ching Lee , Chien-Hao Chen , Hung-Chin Chung , Hsien-Ming Lee , Chi On Chui , Hsuan-Yu Tung , Chung-Chiang Wu
IPC: H01L27/088 , H01L21/8234 , H01L29/417 , H01L29/423 , H01L29/66 , H01L29/78
Abstract: A structure includes a semiconductor substrate including a first semiconductor region and a second semiconductor region, a first transistor in the first semiconductor region, and a second transistor in the second semiconductor region. The first transistor includes a first gate dielectric over the first semiconductor region, a first work function layer over and contacting the first gate dielectric, and a first conductive region over the first work function layer. The second transistor includes a second gate dielectric over the second semiconductor region, a second work function layer over and contacting the second gate dielectric, wherein the first work function layer and the second work function layer have different work functions, and a second conductive region over the second work function layer.
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公开(公告)号:US20210407995A1
公开(公告)日:2021-12-30
申请号:US17089291
申请日:2020-11-04
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuan-Chang Chiu , Chia-Ching Lee , Chien-Hao Chen , Hung-Chin Chung , Hsien-Ming Lee , Chi On Chui , Hsuan-Yu Tung , Chung-Chiang Wu
IPC: H01L27/088 , H01L29/417 , H01L29/66 , H01L29/78 , H01L21/8234 , H01L29/423
Abstract: A structure includes a semiconductor substrate including a first semiconductor region and a second semiconductor region, a first transistor in the first semiconductor region, and a second transistor in the second semiconductor region. The first transistor includes a first gate dielectric over the first semiconductor region, a first work function layer over and contacting the first gate dielectric, and a first conductive region over the first work function layer. The second transistor includes a second gate dielectric over the second semiconductor region, a second work function layer over and contacting the second gate dielectric, wherein the first work function layer and the second work function layer have different work functions, and a second conductive region over the second work function layer.
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公开(公告)号:US20220359193A1
公开(公告)日:2022-11-10
申请号:US17814716
申请日:2022-07-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Ching Lee , Chung-Chiang Wu , Shih-Hang Chiu , Hsuan-Yu Tung , Da-Yuan Lee
IPC: H01L21/02 , H01L21/768 , H01L27/088 , H01L29/66
Abstract: A method includes depositing a first work-function layer and a second work-function layer in a first device region and a second device region, respectively, and depositing a first fluorine-blocking layer and a second fluorine-blocking layer in the first device region and the second device region, respectively. The first fluorine-blocking layer is over the first work-function layer, and the second fluorine-blocking layer is over the second work-function layer. The method further includes removing the second fluorine-blocking layer, and forming a first metal-filling layer over the first fluorine-blocking layer, and a second metal-filling layer over the second work-function layer.
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公开(公告)号:US11387344B2
公开(公告)日:2022-07-12
申请号:US16889217
申请日:2020-06-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Ching Lee , Hung-Chin Chung , Chung-Chiang Wu , Hsuan-Yu Tung , Kuan-Chang Chiu , Chien-Hao Chen , Chi On Chui
IPC: H01L29/66 , H01L21/8238 , H01L21/28 , H01L21/8234 , H01L29/49 , H01L29/40 , H01L29/78
Abstract: A semiconductor device and method of manufacture are provided. In some embodiments a treatment process is utilized to treat a work function layer. The treatment prevents excessive oxidation of the work function layer during subsequent processing steps, such as application of a subsequent photoresist material, thereby allowing the work function layer to be thinner than otherwise.
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