Semiconductor processing tool and methods of operation

    公开(公告)号:US11906902B2

    公开(公告)日:2024-02-20

    申请号:US17655708

    申请日:2022-03-21

    CPC classification number: G03F7/70033 H05G2/008

    Abstract: Example implementations described herein include a laser source and associated methods of operation that can balance or reduce uneven beam profile problem and even improve plasma heating efficiency to enhance conversion efficiency and intensity for extreme ultraviolet radiation generation. The laser source described herein generates an auxiliary laser beam to augment a pre-pulse laser beam and/or a main-pulse laser beam, such that uneven beam profiles may be corrected and/or compensated. This may improve an intensity of the laser source and also improve an energy distribution from the laser source to a droplet of a target material, effective to increase an overall operating efficiency of the laser source.

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