公开(公告)号：US11632849B2

公开(公告)日：2023-04-18

申请号：US17460144

申请日：2021-08-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chieh Hsieh ,  Tai-Yu Chen ,  Hung-Jung Hsu ,  Cho-Ying Lin ,  Shang-Chieh Chien ,  Li-Jui Chen ,  Heng-Hsin Liu

IPC: G03F7/20 ,  H05G2/00

Abstract: A shutter is provided near the immediate focus of a lithography apparatus in order to deflect tin debris generated by a source side of the apparatus away from a scanner side of the apparatus and towards a debris collection device. The activation of the shutter is synchronized with the generation of light pulses so as not to block light from entering the scanner side.

公开(公告)号：US12019378B2

公开(公告)日：2024-06-25

申请号：US17751570

申请日：2022-05-23

Applicant: Taiwan Semiconductor Manufacturing Company Ltd.

Inventor： Cho-Ying Lin ,  Tai-Yu Chen ,  Chieh Hsieh ,  Sheng-Kang Yu ,  Shang-Chieh Chien ,  Li-Jui Chen ,  Heng-Hsin Liu

IPC: G03F7/00

CPC classification number: G03F7/70916 ,  G03F7/70925

Abstract: A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner, the cleaner being at a temperature less than about 13 degrees Celsius; forming a cleaned collector by exhausting the removable debris from the collector; and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.