公开(公告)号：US20170287527A1

公开(公告)日：2017-10-05

申请号：US15458556

申请日：2017-03-14

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14

CPC classification number: G11B33/142 ,  G06F1/1616 ,  G06F1/181 ,  G06F1/184 ,  G06F1/188 ,  G06F1/20 ,  H01L23/467 ,  H05K7/1422 ,  H05K7/20136

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, attached to the frame, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US20180350408A1

公开(公告)日：2018-12-06

申请号：US16058040

申请日：2018-08-08

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14 ,  H05K7/20 ,  H05K7/14 ,  G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  H01L23/467

CPC classification number: G11B33/142 ,  G06F1/1616 ,  G06F1/181 ,  G06F1/184 ,  G06F1/188 ,  G06F1/20 ,  H01L23/467 ,  H05K7/1422 ,  H05K7/20136

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US10090021B2

公开(公告)日：2018-10-02

申请号：US15827046

申请日：2017-11-30

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Kazuto Nakagawa ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: G11B33/14 ,  H05K7/20 ,  G06F1/16 ,  H05K7/14 ,  G06F1/18

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

公开(公告)号：US20180247881A1

公开(公告)日：2018-08-30

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/40 ,  H05K9/00 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  A63F13/90

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.