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公开(公告)号：US10730273B2
公开(公告)日：2020-08-04
申请号：US16114569
申请日：2018-08-28
IPC分类号： B32B27/26 , C08K3/36 , C08L83/06 , H01L21/02 , C08K5/13 , B32B27/38 , C08L63/10 , C08G77/52 , C08L63/00 , C08G59/22 , C08G59/30 , C09D183/16 , C08G77/60 , C08G59/32 , C08G77/44 , C08L83/00 , C08G77/50 , C08K5/15 , H01L33/56
摘要： The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
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公开(公告)号：US10719015B2
公开(公告)日：2020-07-21
申请号：US15950630
申请日：2018-04-11
发明人： Yoshinori Hirano , Satoshi Asai , Kazunori Kondo
IPC分类号： G03F7/023 , G03C11/12 , G03F7/16 , G03F7/20 , C25D3/02 , G03F7/32 , C08G8/28 , C23C18/16 , G03F7/38 , G03F7/40 , G03F7/022
摘要： A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.
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公开(公告)号：US10538630B2
公开(公告)日：2020-01-21
申请号：US15886198
申请日：2018-02-01
IPC分类号： C08G81/02 , C08G77/442 , C08F226/06 , C08K5/5419 , C08F224/00 , C08G77/04 , C08G77/00
摘要： A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R1 to R4 are a C1-C8 monovalent hydrocarbon group, m and n are integers of 0-300, R5 is C1-C8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use.
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公开(公告)号：US10141272B2
公开(公告)日：2018-11-27
申请号：US15126116
申请日：2015-03-16
发明人： Katsuya Takemura , Kyoko Soga , Satoshi Asai , Kazunori Kondo , Michihiro Sugo , Hideto Kato
IPC分类号： H01L23/00 , C25D7/00 , H01L23/12 , H01L23/52 , H01L25/10 , H01L25/03 , H01L23/538 , C25D7/12 , C25D5/02 , C23C14/00 , C25D5/50 , C23C14/04 , C23C14/34 , G03F7/00 , G03F7/075 , H01L21/48 , H01L23/31 , H01L25/065 , H01L25/00 , H01L21/56 , H01L23/498 , H05K1/18
摘要： A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second insulating layer, wherein the metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second insulating layer, and the metal interconnect penetrates the second insulating layer from its upper surface and is electrically connected to the through electrode at an lower surface of the second insulating layer. This semiconductor apparatus can be easily placed on a circuit board and stacked, and can reduce its warpage even with dense metal interconnects.
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15.发明授权公开(公告)号：US10035912B2
公开(公告)日：2018-07-31
申请号：US15342479
申请日：2016-11-03
发明人： Kazunori Kondo , Yoichiro Ichioka
IPC分类号： C08L83/06 , C08L61/14 , C08G77/48 , H01L21/56 , H01L21/78 , H01L23/00 , C08G77/52 , C08G59/24 , C08K3/36 , C09D163/00 , C09D183/14 , C08G77/14 , C08L63/00 , C08L83/14 , H01L23/29
CPC分类号： C08L83/06 , C08G59/24 , C08G77/14 , C08G77/485 , C08G77/52 , C08K3/36 , C08L63/00 , C08L83/14 , C08L2201/02 , C08L2203/16 , C08L2203/206 , C08L2205/03 , C09D163/00 , C09D183/14 , H01L21/56 , H01L21/78 , H01L23/296 , H01L23/562 , C08L61/14
摘要： A flame retardant resin composition comprising (A) a silicone resin, (B) a triazine-modified phenol novolak compound, and (C) a filler can be formed in film form. The resin film possesses satisfactory covering or encapsulating performance to large size/thin wafers.
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公开(公告)号：US20180143535A1
公开(公告)日：2018-05-24
申请号：US15819532
申请日：2017-11-21
发明人： Yoshinori Hirano , Satoshi Asai , Kazunori Kondo
IPC分类号： G03F7/039
CPC分类号： G03F7/0392 , G03F7/0397 , G03F7/094 , G03F7/11 , G03F7/161 , G03F7/20 , G03F7/30 , G03F7/40
摘要： A laminate comprising a thermoplastic film and a chemically amplified positive resist film thereon is provided, the resist film comprising (A) a base polymer having a hydroxyphenyl group and a protective group, the polymer turning alkali soluble as a result of the protective group being eliminated under the action of acid, (B) a photoacid generator, (C) an organic solvent, and (D) a polymer having an ester bond in its backbone. The resist film may be transferred to a stepped support without forming voids.
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公开(公告)号：US10850482B2
公开(公告)日：2020-12-01
申请号：US16114527
申请日：2018-08-28
IPC分类号： B32B27/26 , B32B27/38 , C08L63/00 , C08K3/36 , C08L83/06 , C08K5/13 , C08G59/62 , C08G59/68 , C08L83/10 , C08G77/42
摘要： The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
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公开(公告)号：US10514601B2
公开(公告)日：2019-12-24
申请号：US15819532
申请日：2017-11-21
发明人： Yoshinori Hirano , Satoshi Asai , Kazunori Kondo
摘要： A laminate comprising a thermoplastic film and a chemically amplified positive resist film thereon is provided, the resist film comprising (A) a base polymer having a hydroxyphenyl group and a protective group, the polymer turning alkali soluble as a result of the protective group being eliminated under the action of acid, (B) a photoacid generator, (C) an organic solvent, and (D) a polymer having an ester bond in its backbone. The resist film may be transferred to a stepped support without forming voids.
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公开(公告)号：US10377923B2
公开(公告)日：2019-08-13
申请号：US15423948
申请日：2017-02-03
发明人： Yoichiro Ichioka , Kazunori Kondo
IPC分类号： C08G61/02 , C09J7/02 , C08G77/00 , C09J5/06 , B32B27/28 , B32B7/12 , H01L21/56 , C09J165/00 , C09J183/06 , C09J11/08
摘要： A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.
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20.发明申请公开(公告)号：US20190196331A1
公开(公告)日：2019-06-27
申请号：US16232377
申请日：2018-12-26
发明人： Hitoshi Maruyama , Kazunori Kondo
IPC分类号： G03F7/075 , C08G77/12 , C08G77/20 , H01L21/027
CPC分类号： G03F7/0757 , C08G59/306 , C08G77/12 , C08G77/20 , C08L63/00 , G03F7/038 , G03F7/0755 , G03F7/16 , G03F7/20 , G03F7/32 , H01L21/0274
摘要： A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R1 to R4 are a C1-C20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
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