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公开(公告)号：US20210057339A1
公开(公告)日：2021-02-25
申请号：US16809629
申请日：2020-03-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Choonghyun Lee , Joonyong Choe , Youngju Lee
IPC: H01L23/522 , H01L21/768 , H01L27/108
Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.
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公开(公告)号：US10789521B2
公开(公告)日：2020-09-29
申请号：US16092705
申请日：2017-05-10
Applicant: Samsung Electronics Co. Ltd.
Inventor： Junsig Kum , Nikolay Olyunin , Youngju Lee , Jungyub Lee , Dohyuk Ha
Abstract: The present invention relates to a device for transmitting data and, particularly, to a device for transmitting data by using a magnetic stripe method. According to one embodiment of the present invention, the magnetic stripe data transmission device comprises: a coil to which a current is supplied in a first direction and a second direction, which is opposite to the first direction; a core for inducing a magnetic field when the current is supplied to the coil; a power source for supplying the current to the coil; driving units for intermittently supplying, to the coil, in the first direction or the second direction, a burst pulse or pseudo-burst pulse current supplied from the power source; and a control unit for outputting, to the driving units, a control signal in order to perform control such that the current is supplied to the coil alternately in the first direction and the second direction, wherein the core can be made of a material having an aspect ratio value of at least 0.5, having a coercivity value of 1000-10,000 [A/m], and having pseudo-hard magnetic density of which the saturated magnetic flux density value is at least 1 [T].
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公开(公告)号：US10714825B2
公开(公告)日：2020-07-14
申请号：US16504920
申请日：2019-07-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjin Kim , Kwanghyun Baek , Byungchul Kim , Jungmin Park , Youngju Lee , Sungchul Park
Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.
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公开(公告)号：US10652375B2
公开(公告)日：2020-05-12
申请号：US16265014
申请日：2019-02-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjin Kim , Seungtae Ko , Junsig Kum , Yoongeon Kim , Youngju Lee
Abstract: The disclosure relates to a 5G or pre-5G communication system for supporting higher data transmission rates than 4G communication systems such as LTE systems. The disclosure relates to the structure of a housing with a dielectric. A housing of a terminal device using an antenna is provided. The at least one protrusion formed of a dielectric in the housing is configured to be positioned between a side surface of the housing and the antenna.
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15.发明授权公开(公告)号：US12183969B2
公开(公告)日：2024-12-31
申请号：US17786870
申请日：2020-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Juneseok Lee , Dohyuk Ha , Jinsu Heo , Youngju Lee
Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
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Patent Agency Ranking
公开(公告)号：US12176620B2
公开(公告)日：2024-12-24
申请号：US17496326
申请日：2021-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juneseok Lee , Jinsu Heo , Youngsub Kim , Jungho Park , Kwanghyun Baek , Youngju Lee , Kyoungho Jeong , Dohyuk Ha
Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
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17.发明授权公开(公告)号：US11764459B2
公开(公告)日：2023-09-19
申请号：US18147270
申请日：2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok Lee , Junsig Kum , Kwanghyun Baek , Dohyuk Ha , Jinsu Heo , Youngju Lee , Jungyub Lee
CPC classification number: H01Q1/2283 , H01Q1/243 , H01Q9/0435 , H01Q9/42 , H04B7/0617 , H05K1/189
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号：US11469499B2
公开(公告)日：2022-10-11
申请号：US17124926
申请日：2020-12-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoongeon Kim , Seungho Choi , Seungtae Ko , Youngsub Kim , Youngju Lee
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as long term evolution (LTE). According to various embodiments, an antenna apparatus may include: an array antenna including a sub-array, a power divider, and a reconfigurable phase shifter circuit, the reconfigurable phase shifter circuit may be configured to provide a first phase shift value based on a switch in a first state, and provide a second phase shift value different from the first phase shift value based on the switch in a second state.
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公开(公告)号：US11464109B2
公开(公告)日：2022-10-04
申请号：US16876501
申请日：2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Youngju Lee , Jinsu Heo
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.
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公开(公告)号：US11309621B2
公开(公告)日：2022-04-19
申请号：US16844706
申请日：2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Dohyuk Ha , Youngju Lee , Jungyub Lee , Juneseok Lee , Jinsu Heo
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
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