Integrated circuit device and method of manufacturing the same

    公开(公告)号:US11784122B2

    公开(公告)日:2023-10-10

    申请号:US17739574

    申请日:2022-05-09

    CPC classification number: H01L23/5228 H01L21/76805 H01L23/5226 H10B12/482

    Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.

    Antenna module comprising reflector, and electronic device comprising same

    公开(公告)号:US11322854B2

    公开(公告)日:2022-05-03

    申请号:US16965424

    申请日:2019-01-31

    Abstract: The present invention relates to: a communication technique for merging, with IoT technology, a 5G communication system for supporting a data transmission rate higher than that of a 4G system; and a system therefor. The present invention provides an antenna module comprising: an antenna array for radiating beams through a top surface thereof; a dielectric disposed to be spaced apart from the top surface of the antenna array by a first preset length; a first reflector comprising a metallic material, and disposed to be spaced apart from the bottom surface of the dielectric by a second preset length; and a second reflector comprising a metallic material and disposed in the partial region of the bottom surface, of the dielectric, which faces the top surface of the antenna array.

    Antenna module including compensator for compensating electrical path difference and electronic device including the same

    公开(公告)号:US11283188B2

    公开(公告)日:2022-03-22

    申请号:US16840018

    申请日:2020-04-03

    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a printed circuit board on which at least one layer is stacked and including a feed port formed at a portion of the upper surface thereof; a first antenna array disposed on the upper surface of the printed circuit board; a second antenna array disposed on the upper surface of the printed circuit board and spaced apart from the first antenna array; a first feed line to electrically connect the feed port and the first antenna array, the first feed line including a compensator to adjust the length of the first feed line; and a second feed line to electrically connect the feed port and the second antenna array.

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