THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

    公开(公告)号:US20220352203A1

    公开(公告)日:2022-11-03

    申请号:US17859631

    申请日:2022-07-07

    Abstract: A three-dimensional semiconductor device including a conductive layer disposed on a substrate and including a first conductivity-type impurity; an insulating base layer disposed on the conductive layer; a stack structure including a lower insulating film disposed on the insulating base, layer, and a plurality of gate electrodes and a plurality of mold insulating layers alternately stacked on the lower insulating film, wherein the insulating base layer includes a high dielectric material; a vertical structure including a vertical channel layer penetrating through the stack structure arid a vertical insulating layer disposed between the vertical channel layer and the plurality of gate electrodes, the vertical structure having an extended area extending in a width direction in the insulating base layer; and an isolation structure penetrating through the stack structure, the insulating base layer and the conductive layer, and extending in a direction parallel to an upper surface of the substrate, wherein the conductive layer has an extension portion extending along a surface of the vertical channel layer in the extended area of the vertical structure.

    Electronic device and controlling method thereof

    公开(公告)号:US12205571B2

    公开(公告)日:2025-01-21

    申请号:US17970464

    申请日:2022-10-20

    Abstract: An electronic device may include at least one microphone, a speaker, and a processor operatively connected to the at least one microphone and the speaker, wherein the processor may be configured to configure an operation frequency of the microphone as a first frequency and receive an external audio signal from the outside of the electronic device through the microphone operating in the first frequency, generate a first audio signal using the received external audio signal, acquire noise signal information, based on the first audio signal, output a second audio signal generated based on the noise signal information through the speaker, determine a second frequency, based on the generated second audio signal, and change the operation frequency of the microphone to the second frequency and receive the external audio signal from the outside of the electronic device through the microphone operating at the second frequency.

    Three-dimensional semiconductor devices and methods of fabricating the same

    公开(公告)号:US11792993B2

    公开(公告)日:2023-10-17

    申请号:US17859631

    申请日:2022-07-07

    CPC classification number: H10B43/27 H01L29/105 H01L29/1037

    Abstract: A three-dimensional semiconductor device including a conductive layer disposed on a substrate and including a first conductivity-type impurity; an insulating base layer disposed on the conductive layer; a stack structure including a lower insulating film disposed on the insulating base layer, and a plurality of gate electrodes and a plurality of mold insulating layers alternately stacked on the lower insulating film, wherein the insulating base layer includes a high dielectric material; a vertical structure including a vertical channel layer penetrating through the stack structure and a vertical insulating layer disposed between the vertical channel layer and the plurality of gate electrodes, the vertical structure having an extended area extending in a width direction in the insulating base layer; and an isolation structure penetrating through the stack structure, the insulating base layer and the conductive layer, and extending in a direction parallel to an upper surface of the substrate, wherein the conductive layer has an extension portion extending along a surface of the vertical channel layer in the extended area of the vertical structure.

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