公开(公告)号：US10896313B2

公开(公告)日：2021-01-19

申请号：US16299364

申请日：2019-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon Kim ,  Jingu Heo

IPC: G06K9/00 ,  G06K9/46

Abstract: A method of recognizing a fingerprint includes generating, by using a fingerprint sensor, an input fingerprint image that is to be used when a fingerprint verification mode is executed; obtaining, from a memory, a registered fingerprint image that is generated from a finger image captured by a camera and stored in the memory prior to the generating the input fingerprint image; determining, from among partial regions of a registered fingerprint image that is obtained, a partial region of the registered fingerprint image, which is superimposed on the input fingerprint image, as a registered superimposed image; converting the registered superimposed image such that a first histogram of the registered superimposed image corresponds to a second histogram of the input fingerprint image; and determining, by comparing the registered superimposed image, which is converted, with the input fingerprint image, whether the input fingerprint image is verified.

公开(公告)号：US10191198B2

公开(公告)日：2019-01-29

申请号：US15351950

申请日：2016-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Dongsik Shim ,  Dongouk Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Sunghoon Lee ,  Jaeseung Chung

IPC: G02B26/08 ,  F21V8/00 ,  H04N13/39 ,  B29C65/48 ,  G02B27/22 ,  H04N13/32 ,  B29L31/34

Abstract: A display apparatus including a directional backlight unit and a method of assembling the display apparatus are disclosed. The display apparatus includes an auxiliary structure coupled to an input coupler and a switch panel module.

公开(公告)号：US20250125179A1

公开(公告)日：2025-04-17

申请号：US19002471

申请日：2024-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H10H20/01

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US11888085B2

公开(公告)日：2024-01-30

申请号：US18180602

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20230231072A1

公开(公告)日：2023-07-20

申请号：US18180602

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo HONG ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20230084493A1

公开(公告)日：2023-03-16

申请号：US17990953

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US20220246584A1

公开(公告)日：2022-08-04

申请号：US17506135

申请日：2021-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Seogwoo Hong ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Joonyong Park

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/68 ,  G09G3/32 ,  H01L21/683

Abstract: A display transferring structure includes a transferring substrate including a mold including a plurality of recesses, and a plurality of protrusions provided on an outer surface of the mold connected to the plurality of recesses; and micro semiconductor chips arranged in the recesses. When the micro semiconductor chips are wet aligned, by such protrusions, sliding of the micro semiconductor chips toward the inside of the recesses may be improved.

公开(公告)号：US11030432B2

公开(公告)日：2021-06-08

申请号：US16654156

申请日：2019-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon Kim ,  Jingu Heo ,  Dongkyun Kim ,  Seokwhan Chung

IPC: G06K9/20 ,  G06K9/00 ,  G06K9/03 ,  G01L1/14 ,  G01L1/16 ,  G01L1/20

Abstract: Provided are a deformable fingerprint recognition device and a fingerprint authentication method and an electronic apparatus using the deformable fingerprint recognition device. The deformable fingerprint recognition device may include a fingerprint sensor configured to be deformed in shape and a strain sensor provided on a surface of the fingerprint sensor to measure deformation distribution of the fingerprint sensor. The deformable fingerprint recognition device may recognize a fingerprint of a user by reflecting the deformation distribution of the fingerprint sensor measured by the strain sensor. The deformable fingerprint recognition device may include a plurality of first pixel regions to detect the fingerprint of the user, and the strain sensor may include a plurality of second pixel regions to measure the deformation distribution of the fingerprint sensor.

公开(公告)号：US10678359B2

公开(公告)日：2020-06-09

申请号：US16134471

申请日：2018-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhyoung Cho ,  Bonwon Koo ,  Hyunjoon Kim ,  Haesung Kim ,  Jungyun Won

IPC: G06F3/041 ,  H01L27/32 ,  G06K9/00 ,  G06F3/044

Abstract: Provided are a pattern structure for preventing a moiré pattern from becoming visible, and a display apparatus using the same. The pattern structure includes a first element pattern including a plurality of first elements arranged regularly at a first pitch; a second element pattern including a plurality of second elements arranged regularly at a second pitch, the second element pattern being provided on the first element pattern; and a filling layer configured to fill gaps among the plurality of second elements, between adjacent ones thereof. A difference between transmittances of the second element and the filling layer is about 5% or less and thus, a moiré pattern occurring due to the overlapping of the first element pattern and the second element pattern may be prevented from becoming visible.

公开(公告)号：US20250151474A1

公开(公告)日：2025-05-08

申请号：US19009427

申请日：2025-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H10H20/831 ,  H10H29/14

Abstract: Provided is a light-emitting device including a body including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode and a second electrode provided on a first surface of the body, the first electrode and the second electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively, and a third electrode and a fourth electrode provided on a second surface of the body, the third electrode and the fourth electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively.