公开(公告)号：US12148857B2

公开(公告)日：2024-11-19

申请号：US17477875

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Seogwoo Hong ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Junsik Hwang

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/62

Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

公开(公告)号：US20230402439A1

公开(公告)日：2023-12-14

申请号：US17985332

申请日：2022-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook Hwang ,  Jaewook Jeong ,  Junsik Hwang ,  Dongkyun Kim ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Sanghoon Song ,  Minchul Yu

IPC: H01L25/16 ,  H01L33/38 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L33/38 ,  H01L24/05 ,  H01L24/95 ,  H01L2224/05559 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/95001

Abstract: Provided is a microchip including a chip body having a first surface and a second surface facing the first surface, and an electrode layer on the second surface, wherein a surface roughness of the first surface is smaller than a surface roughness of an upper surface of the electrode layer such that van der Waals force between the first surface and an external contact surface are greater than van der Waals force between the electrode layer and the external contact surface.

公开(公告)号：US20220029046A1

公开(公告)日：2022-01-27

申请号：US17171636

申请日：2021-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US10228603B2

公开(公告)日：2019-03-12

申请号：US14633781

申请日：2015-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bonwon Koo ,  Deukseok Chung ,  Hyunjoon Kim ,  Shanghyeun Park ,  Changsoo Lee ,  Taewon Jeong

IPC: G02F1/163 ,  G06F3/041 ,  G09G3/38 ,  G02F1/1333 ,  G02F1/133

Abstract: An electro-chromic panel includes a detection layer, and an electro-chromic layer configured to switch an operational mode of a selected area according to a signal provided from the detection layer. A method of operating an electro-chromic panel includes detecting a first signal provided to a detection layer, and switching an operational mode of a first area of an electro-chromic layer according to the first signal provided from the detection layer.

公开(公告)号：US10114225B2

公开(公告)日：2018-10-30

申请号：US15269136

申请日：2016-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon Kim ,  Joonyong Park ,  Bongsu Shin ,  Dongouk Kim ,  Jihyun Bae ,  Dongsik Shim ,  SungHoon Lee ,  Jaeseung Chung ,  Seogwoo Hong

IPC: G02B27/22 ,  F21V8/00 ,  H04N13/31 ,  H04N13/366 ,  G03H1/22 ,  G06F17/14

Abstract: A directional backlight unit, a three-dimensional (3D) image display apparatus, and a 3D image displaying method are provided. The directional backlight unit includes a light guide plate having an emission surface on which a plurality of grating elements including first and second groups of grating elements are provided. The plurality of grating elements are arranged such that light beams emitted from the first and second groups of grating elements commonly propagate through a plurality of pixel points and respectively form first and second groups of view points of which corresponding regions do not overlap with each other.

公开(公告)号：US10025160B2

公开(公告)日：2018-07-17

申请号：US15213792

申请日：2016-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongouk Kim ,  Hyunjoon Kim ,  Jihyun Bae ,  Alexander V. Morozov ,  Bongsu Shin ,  Sunghoon Lee ,  Changsoo Lee ,  Jaeseung Chung

IPC: H04N13/00 ,  G02B27/22 ,  G02B3/12 ,  G02F1/136 ,  G02F1/1334 ,  F21V8/00 ,  G02F1/31 ,  G02F1/1335 ,  G02F1/29

Abstract: Provided are a lighting system, a backlight unit and a 3D image display apparatus including the backlight unit. The backlight unit includes: a lighting system configured to selectively output collimated light and diverging light, a diffraction device, and a light guide plate configured to guide the collimated light and the diverging light from the lighting system to the diffraction device. An exit direction of the collimated light from the diffraction device depends on at least one of an angle of incidence of the collimated light and the wavelength of the collimated light.

公开(公告)号：US20240387503A1

公开(公告)日：2024-11-21

申请号：US18788803

申请日：2024-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US11934853B2

公开(公告)日：2024-03-19

申请号：US17263591

申请日：2019-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungseok Lee ,  Jingu Kang ,  Kihun Heo ,  Hyojong Kim ,  Hakryoul Kim ,  Hyunjoon Kim ,  Donggyu Ahn ,  Haewook Lee ,  Kwanhee Jeong ,  Mooyoung Kim ,  Minjung Kim

IPC: G06F9/455

CPC classification number: G06F9/45504 ,  G06F9/45558 ,  G06F2009/45562 ,  G06F2009/45583 ,  G06F2009/45591

Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.

公开(公告)号：US11880700B2

公开(公告)日：2024-01-23

申请号：US17263591

申请日：2019-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungseok Lee ,  Jingu Kang ,  Kihun Heo ,  Hyojong Kim ,  Hakryoul Kim ,  Hyunjoon Kim ,  Donggyu Ahn ,  Haewook Lee ,  Kwanhee Jeong ,  Mooyoung Kim ,  Minjung Kim

IPC: G06F9/455

CPC classification number: G06F9/45504 ,  G06F9/45558 ,  G06F2009/45562 ,  G06F2009/45583 ,  G06F2009/45591

Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.

公开(公告)号：US11626530B2

公开(公告)日：2023-04-11

申请号：US17171636

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.