公开(公告)号：US20240194840A1

公开(公告)日：2024-06-13

申请号：US18410670

申请日：2024-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhye KIM ,  Mingyu LEE ,  Yoonsuk LEE ,  Seungryong HAN

IPC: H01L33/58 ,  H01L25/16

CPC classification number: H01L33/58 ,  H01L25/167

Abstract: A display module includes a display substrate, a plurality of light emitting diodes (LEDs) provided on the substrate, an adhesive layer provided on a first surface of the substrate on which the plurality of LEDs are provided, and an optical film connected to the substrate by the adhesive layer and configured to increase luminous intensity by scattering light emitted by the plurality of LEDs.

公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.

公开(公告)号：US20230232106A1

公开(公告)日：2023-07-20

申请号：US18188139

申请日：2023-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Miseon HWANG ,  Eunhye KIM ,  Kangmin LEE

IPC: H04N23/69 ,  H04N23/63 ,  H04N23/667 ,  H04W4/02

CPC classification number: H04N23/69 ,  H04N23/632 ,  H04N23/633 ,  H04N23/667 ,  H04W4/027

Abstract: An electronic device is provided. The electronic device includes a communication circuit, a memory, at least one camera, and a processor operatively connected to the communication circuit, the memory, and the at least one camera and is configured to obtain information related to the location of at least one external electronic device on the basis of a signal received from the at least one external electronic device via the communication circuit, receive information of a subject related to the at least one external electronic device from the at least one external electronic device via the communication circuit, and configure image capturing information of the at least one camera on the basis of the information related to the location of the external electronic device and the information of the subject.

公开(公告)号：US20210288209A1

公开(公告)日：2021-09-16

申请号：US17258061

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Minsub OH ,  Sangmoo PARK ,  Eunhye KIM ,  Yoonsuk LEE

IPC: H01L33/00 ,  H01L27/15

Abstract: An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

公开(公告)号：US20200312822A1

公开(公告)日：2020-10-01

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.

公开(公告)号：US20250081688A1

公开(公告)日：2025-03-06

申请号：US18951127

申请日：2024-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingyu LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Yoonsuk LEE ,  Changkyu CHUNG

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62

Abstract: A display module includes a plurality of inorganic light-emitting elements, a substrate including a mounting surface on which the plurality of inorganic light-emitting elements are mounted, and a non-conductive film (NCF) disposed on the substrate and configured to bond the plurality of inorganic light-emitting elements to the substrate. The NCF may have a black-based color.

公开(公告)号：US20220069061A1

公开(公告)日：2022-03-03

申请号：US17523281

申请日：2021-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

公开(公告)号：US20200161405A1

公开(公告)日：2020-05-21

申请号：US16681290

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

公开(公告)号：US20190200113A1

公开(公告)日：2019-06-27

申请号：US16222902

申请日：2018-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhye KIM ,  Norio OKADA ,  Masato SUZUKI ,  Jonghyuk CHO ,  Donghun HEO

IPC: H04R1/10

CPC classification number: H04R1/1025 ,  H02J7/0014 ,  H02J7/0021 ,  H02J7/0024 ,  H02J7/0054 ,  H02J2007/0062 ,  H04M1/6058 ,  H04M1/6066 ,  H04R2420/07 ,  H04R2420/09 ,  H04R2460/03

Abstract: An electronic device according to various embodiments of the present disclosure may include a communication interface and a processor, wherein the processor may be configured to receive first battery level information of a first earpiece and second battery level information of a second earpiece, via the communication interface, to identify a charging method corresponding to the first battery level and the second battery level, among a plurality of charging methods for charging at least one of the first earpiece or the second earpiece, and to control to supply charging power to at least one of the first earpiece or the second earpiece, via a cable which connects the electronic device with at least one of the first earpiece or the second earpiece, using the charging method.