公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC分类号： H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

摘要： Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.