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公开(公告)号:US20210050498A1
公开(公告)日:2021-02-18
申请号:US16926161
申请日:2020-07-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk LEE , Eunhye KIM , Dongyeob LEE , Sangmoo PARK
IPC: H01L33/62 , H01L25/075 , H01L23/00
Abstract: A light emitting diode (LED) element is provided. The LED element includes: an active layer configured to generate light; a first semiconductor layer disposed on a first surface of the active layer and doped with an n-type dopant; a second semiconductor layer disposed on a second surface of the active layer opposite to the first surface, the second semiconductor layer being doped with a p-type dopant; a first electrode pad and a second electrode pad electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the first electrode pad comprising a first contact surface and the second electrode pad comprising a second contact surface; and a conductive filler disposed on at least one contact surface from among the first contact surface and the second contact surface to increase a contact area of the at least one contact surface.
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公开(公告)号:US20200313035A1
公开(公告)日:2020-10-01
申请号:US16832884
申请日:2020-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk LEE , Sangmoo PARK , Doyoung KWAG , Byungchul KIM , Eunhye KIM , Minsub OH , Dongyeob LEE
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号:US20240311507A1
公开(公告)日:2024-09-19
申请号:US18675728
申请日:2024-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngwook NAM , Eunhye KIM , Hyori PARK , Suyeon JUNG
IPC: G06F21/62 , G06F3/01 , G06F3/04845
CPC classification number: G06F21/6245 , G06F3/011 , G06F3/04845
Abstract: An electronic device is provided. The electronic device includes a microphone, a camera, communication circuitry, memory storing one or more computer programs, and one or more processors communicatively coupled to the microphone, the camera, the communication circuitry, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to receive input data from the microphone, the camera and/or at least one wearable device, modify at least some of the input data or determine at least some of input data as data that are not to be transmitted from an external server to an external device based on whether at least some of the input data satisfy a designated condition, and transmit the input data to the external server.
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公开(公告)号:US20240088329A1
公开(公告)日:2024-03-14
申请号:US17941695
申请日:2022-09-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhye KIM , Sangmoo Park , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/40 , H01L25/075 , H01L33/62
CPC classification number: H01L33/40 , H01L25/0753 , H01L33/62
Abstract: A display module includes a thin film transistor (TFT) substrate including a glass substrate, a TFT layer provided at a front surface of the glass substrate and comprising a TFT electrode pad, and a driving circuit provided at a rear surface of the glass substrate and configured to drive the TFT layer, at least one light-emitting diode (LED) comprising at least one LED electrode pad, and a junction structure provided between the at least one LED electrode pad and the TFT electrode pad. The junction structure is formed in a metallically bonded state.
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公开(公告)号:US20220181311A1
公开(公告)日:2022-06-09
申请号:US17677182
申请日:2022-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung KWAG , Byungchul KIM , Eunhye KIM , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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公开(公告)号:US20210358896A1
公开(公告)日:2021-11-18
申请号:US17244471
申请日:2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk LEE , Eunhye KIM , Sangmoo PARK , Dongyeob LEE
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.
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公开(公告)号:US20200243358A1
公开(公告)日:2020-07-30
申请号:US16731468
申请日:2019-12-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
IPC: H01L21/67 , H01L33/62 , H01L25/075 , H01L21/683
Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.
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公开(公告)号:US20220139889A1
公开(公告)日:2022-05-05
申请号:US17574104
申请日:2022-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.
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9.
公开(公告)号:US20200020740A1
公开(公告)日:2020-01-16
申请号:US16426846
申请日:2019-05-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.
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公开(公告)号:US20250096177A1
公开(公告)日:2025-03-20
申请号:US18962923
申请日:2024-11-27
Applicant: SAMSUNG ELECTRONICS CO, LTD
Inventor: Yoonsuk LEE , Eunhye KIM , Dongyeob LEE , Sangmoo PARK
IPC: H01L23/00 , H01L25/075 , H01L25/16 , H01L33/62
Abstract: A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes of the substrate may be bonded by eutectic bonding through the assembly during thermal compression bonding.
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