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公开(公告)号：US20150041192A1
公开(公告)日：2015-02-12
申请号：US14140803
申请日：2013-12-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung HAN , Young Do Kweon , Seung Min Baek , Yoon Su Kim , Young Jae Lee
CPC classification number: H05K3/108 , H05K2201/098 , H05K2203/087 , H05K2203/092 , H05K2203/095 , H05K2203/1105 , H05K2203/111 , H05K2203/1184 , H05K2203/1383 , Y10T29/49155
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a representative preferred embodiment of the present invention, it is possible to protect a line width of a circuit pattern and suppress an undercut by providing the printed circuit board in which etched grooves are formed at both sides of a seed layer of the circuit pattern.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 详细地说，根据本发明的代表性的优选实施例，可以通过提供印刷电路板来保护电路图形的线宽并抑制底切，其中在其中形成蚀刻槽的印刷电路板的种子层的两侧 电路图案。
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12.发明申请公开(公告)号：US20140301002A1
公开(公告)日：2014-10-09
申请号：US14248041
申请日：2014-04-08
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hong Ryul LEE , Kang-Heon Hur , Sang Moon Lee , Young Do Kweon , Young Seuck Yoo
CPC classification number: H01B1/22
Abstract: Disclosed herein are an electrostatic discharge protection material for improving connectivity between conductive particles dispersed in a resin matrix and evenly distributing the conductive particles in the resin material, and an electrostatic discharge protection device using the same. The electrostatic discharge protection material includes a resin matrix; needle-shaped conductive particles dispersed in the resin matrix; and dispersion particles dispersed in the resin matrix, wherein the dispersion particles are located between the needle-shaped conductive particles.
Abstract translation: 这里公开了一种用于改善分散在树脂基体中的导电颗粒与树脂材料中的导电颗粒均匀分布的连接性的静电放电保护材料和使用其的静电放电保护装置。 静电放电保护材料包括树脂基体; 分散在树脂基体中的针状导电粒子; 分散在树脂基体中的分散粒子，其中分散粒子位于针状导电粒子之间。
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公开(公告)号：US20140062637A1
公开(公告)日：2014-03-06
申请号：US13831620
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
Inventor： Young Seuck Yoo , Kang Heon Hur , Jun Hee Bae , Yong Suk Kim , Sang Moon Lee , Won Chul Sim , Young Do Kweon , Sung Kwon Wi
IPC: H01F27/40
CPC classification number: H01F27/40 , H01F17/0013 , H01F2017/0026 , H01F2017/0066
Abstract: Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.
Abstract translation: 这里公开了内置ESD保护图案的共模滤波器。 共模滤波器包括由绝缘材料制成的基底基板，形成在基底基板上的第一绝缘层，形成在第一绝缘层上的线圈状内部电极，形成的第二绝缘层 在内部电极上，形成在第二绝缘层上的第一外部电极端子，形成在第二绝缘层上并接收第一外部电极端子的第一铁氧体树脂层，形成在第一绝缘层上的ESD保护图案 外部电极端子，形成在ESD保护图案上的第二外部电极端子和形成在第一铁氧体树脂层上并接收第二外部电极端子的第二铁氧体树脂层。
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公开(公告)号：US20140051212A1
公开(公告)日：2014-02-20
申请号：US14063672
申请日：2013-10-25
Applicant: SUNGKYUNKWAN UNIVERSITY Foundation for Corporate Collaboration , SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Wook Park , Young Do Kweon , Jang Hyun Kim , Tae Seok Park , Su Jeong Suh , Jae Gwon Jang , Nam Jung Kim , Seung Kyu Lim , Kwang Keun Lee
IPC: H01L21/50
CPC classification number: H01L21/50 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16146 , H01L2224/16235 , H01L2924/0001 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/19015 , H01L2924/19041 , Y10T436/170769 , H01L2224/13099
Abstract: A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.
Abstract translation: 一种制造封装基板的方法，包括在晶片的上表面的至少一个区域中形成空腔，所述空腔包括芯片安装区域，形成穿透晶片的通孔和填充通孔的通孔 形成与所述第一布线层间隔开的第一布线层和第二布线层，所述第一布线层和第二布线层延伸到所述空腔中，并将芯片安装在所述空腔中以与所述第一布线层和所述第二布线层连接。
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公开(公告)号：US20140003770A1
公开(公告)日：2014-01-02
申请号：US13708860
申请日：2012-12-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Wook Park , Christian Romero , Young Do Kweon , Chang Bae Lee
CPC classification number: G02B6/38 , G02B6/3608 , G02B6/4214
Abstract: Disclosed herein is an optical module including: an optical element mounted on a substrate; and an optical connector mounted corresponding to the optical element so as to change a path of an optical signal of the optical element and transfer the optical signal having the changed path. The optical module may provide various communication performances using an optical connector in which first and second connector parts are optically coupled stably to each other. Particularly, the optical module does not have a silicon optical bench (SiOB) as a medium, thereby making it possible to reduce a thickness of a product.
Abstract translation: 本文公开了一种光学模块，包括：安装在基板上的光学元件; 以及对应于光学元件安装的光学连接器，以便改变光学元件的光学信号的路径并传送具有改变路径的光学信号。 光学模块可以使用其中第一和第二连接器部件彼此稳定地光耦合的光学连接器来提供各种通信性能。 特别地，光学模块不具有硅光学台（SiOB）作为介质，从而可以减小产品的厚度。
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Patent Agency Ranking
公开(公告)号：US20130153266A1
公开(公告)日：2013-06-20
申请号：US13719036
申请日：2012-12-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Gul Hyun , Jin Gu Kim , Young Do Kweon , Hyung Jin Jeon
CPC classification number: H05K1/0296 , H05K1/0216 , H05K3/02 , H05K3/4673 , H05K2201/0391 , H05K2201/09781
Abstract: Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. D ≤ T 2 T 1 × 200 1.2 [ Equation 1 ] (Where D represents a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns, T1 represents a thickness of the circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the circuit pattern or the dummy pattern.)
Abstract translation: 本文公开了一种印刷电路板，包括：基底; 形成在所述基底基板上的至少一个电路图案; 形成在所述基底基板上的至少一个虚设图案; 以及形成在电路图案和虚设图案上的绝缘层，其中电路图案和虚设图案中的彼此之间的相邻图案之间的距离满足以下等式1. D <= T 2 2 T1×200 1.2 [等式1]（其中D表示电路图案和虚设图案中彼此相邻图案之间的距离，T1表示电路图案或虚设图案的厚度，T2表示绝缘体的最大厚度 层形成在电路图案或虚拟图案上。）
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公开(公告)号：US09629260B2
公开(公告)日：2017-04-18
申请号：US14169097
申请日：2014-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Wook Park , Young Do Kweon , Jin Gu Kim
CPC classification number: H05K3/426 , H05K1/036 , H05K3/108 , H05K3/285 , H05K2201/0959 , H05K2203/1476
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.
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公开(公告)号：US09345142B2
公开(公告)日：2016-05-17
申请号：US14538797
申请日：2014-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seon Hee Moon , Young Do Kweon , Jeong Ho Lee
CPC classification number: H05K1/185 , H01L22/34 , H01L23/14 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L2924/3511 , H01L2924/3512 , H05K3/4644 , H05K3/4697
Abstract: There are provided a chip embedded board and a method of manufacturing the same. The chip embedded board includes: a core substrate; a first build-up layer formed on one surface of the core substrate and having a cavity formed therein; a chip disposed in the cavity; and an insulating layer filled in the cavity in which the chip is disposed, wherein one surface of the chip is positioned in a circuit layer positioned at the outermost layer of the first build-up layer.
Abstract translation: 提供了一种芯片嵌入式电路板及其制造方法。 芯片嵌入式板包括：芯基板; 形成在所述芯基板的一个表面上并具有形成在其中的空腔的第一堆积层; 设置在空腔中的芯片; 以及填充在其中设置有芯片的空腔中的绝缘层，其中芯片的一个表面位于位于第一堆积层的最外层的电路层中。
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19.发明授权公开(公告)号：US09153957B2
公开(公告)日：2015-10-06
申请号：US13830978
申请日：2013-03-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Hyuck Yang , Young Seuck Yoo , Sung Kwon Wi , Geon Se Chang , Ju Hwan Yang , Young Do Kweon , Jong Yun Lee
CPC classification number: H02H9/044 , C23C18/52 , C25D3/30 , H01R13/6485 , H05K1/0259 , H05K9/0067
Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.
Abstract translation: 本发明涉及一种静电放电保护装置。 根据本发明实施例的静电放电保护装置包括基板，具有形成在基板上的镀膜的静电放电吸收层，设置在基板上的彼此间隔开预定间隔的电极， 插入其间的静电放电吸收层，以及用于覆盖基板和电极的绝缘层。
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20.发明授权公开(公告)号：US09136702B2
公开(公告)日：2015-09-15
申请号：US13843860
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Moon Lee , Sung Kwon Wi , Ju Hwan Yang , Won Chul Sim , Young Do Kweon
CPC classification number: H02H9/044 , H01C1/14 , H01C7/12 , H01T4/08 , H01T4/10 , H05K1/026 , H05K2201/09736 , H05K2201/09827
Abstract: Disclosed herein are an electrostatic discharge protection device including: a substrate; a pair of electrodes formed on the substrate so as to be spaced apart from each other; and an insulating layer formed on the electrodes, wherein each of the electrodes has a shape in which it protrudes from a cross section thereof toward a surface thereof, and a manufacturing method thereof, and a composite electronic component including the same.
Abstract translation: 这里公开了一种静电放电保护装置，包括：基板; 一对电极，形成在所述基板上以彼此间隔开; 以及形成在电极上的绝缘层，其中每个电极具有从其横截面向其表面突出的形状及其制造方法，以及包括该绝缘层的复合电子部件。
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