公开(公告)号：US11565351B2

公开(公告)日：2023-01-31

申请号：US16375582

申请日：2019-04-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Toshinaru Suzuki ,  Dokyun Kwon ,  Jaebum Pahk ,  Jinwon Baek ,  Jeongho Yi ,  Jinpyung Lee ,  Kyongho Hong

IPC: B23K26/36 ,  B23K26/38 ,  H01L21/687 ,  B23K26/70

Abstract: A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

公开(公告)号：US20220241906A1

公开(公告)日：2022-08-04

申请号：US17545982

申请日：2021-12-08

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Bum Kim ,  Jaeseok Park ,  Jungseob Lee ,  Kyongho Hong ,  Inho Lee ,  Bosuck Jeon

IPC: B23K37/04 ,  B23K26/02 ,  B23K26/362

Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic. chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.