公开(公告)号：US11024575B2

公开(公告)日：2021-06-01

申请号：US16415469

申请日：2019-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkuk Bae ,  Hyunsoo Chung ,  Inyoung Lee ,  Donghyeon Jang

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L21/768

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad disposed on the semiconductor substrate, and a pillar pattern disposed on the conductive pad. The semiconductor device further includes a solder seed pattern disposed on the pillar pattern, and a solder portion disposed on the pillar pattern and the solder seed pattern. A first width of the solder seed pattern is less than a second width of a top surface of the pillar pattern.

公开(公告)号：US10699915B2

公开(公告)日：2020-06-30

申请号：US16234815

申请日：2018-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chanho Lee ,  Hyunsoo Chung ,  Hansung Ryu ,  Inyoung Lee

IPC: H01L21/50 ,  H01L23/48 ,  H01L23/00 ,  H01L23/58 ,  H01L23/373 ,  H01L21/48 ,  H01L21/02 ,  H01L23/544 ,  H01L25/065 ,  H01L21/768 ,  H01L23/31

Abstract: A semiconductor device including a substrate, an insulating layer on the substrate and including a trench, at least one via structure penetrating the substrate and protruding above a bottom surface of the trench, and a conductive structure surrounding the at least one via structure in the trench may be provided.

公开(公告)号：US11791242B2

公开(公告)日：2023-10-17

申请号：US17371602

申请日：2021-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangwuk Park ,  Youngmin Lee ,  Hyoungyol Mun ,  Inyoung Lee ,  Seokhwan Jeong ,  Sungdong Cho

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/528 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/5283 ,  H01L23/5286 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06586

Abstract: A semiconductor device, includes: a substrate having a first surface on which a plurality of devices are disposed and a second surface, opposite to the first surface; an interlayer insulating film on the first surface of the substrate; an etching delay layer disposed in a region between the substrate and the interlayer insulating film; first and second landing pads on the interlayer insulating film; a first through electrode penetrating through the substrate and the interlayer insulating film; and a second through electrode penetrating the substrate, the etching delay layer, and the interlayer insulating film, the second through electrode having a width, greater than that of the first through electrode, wherein each of the first and second through electrodes includes first and second tapered end portions in the interlayer insulating film, each of first and second tapered end portions having a cross-sectional shape narrowing closer to the landing pads.

公开(公告)号：US11570407B2

公开(公告)日：2023-01-31

申请号：US16697738

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjoo Shin ,  Sohyeon Kim ,  Inyoung Lee ,  Yuri Sin ,  Jiwoo Lee ,  Jaebong Chun

IPC: H01Q21/06 ,  H04N7/18 ,  H04N5/225

Abstract: Various embodiments relate to an electronic device that supports millimeter wave communication. The electronic device may include: a housing; an antenna structure including at least one antenna comprising a portion of the housing or positioned in the housing, and including an annular conductive structure comprising a conductive material, the annular conductive structure having a first surface facing an outside of the housing, a second surface facing a direction opposite the first surface, an internal space defined by the first surface and the second surface, and a plurality of slots having a repeating pattern and formed through the first surface to the internal space; a conductive member comprising a conductive material disposed in the internal space; a wireless communication circuit electrically connected with the conductive member and configured to form a directional beam using the antenna structure; and a ground electrically connected to the annular conductive structure.

公开(公告)号：US20220278079A1

公开(公告)日：2022-09-01

申请号：US17748164

申请日：2022-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongwon Choi ,  Wonkeun Kim ,  Inyoung Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor chip including a semiconductor substrate having a first surface and a second surface and having an active layer in a region adjacent to the first surface, a first through electrode penetrating at least a portion of the semiconductor substrate and connected to the active layer, a second through electrode located at a greater radial location from the center of the semiconductor substrate than the first through electrode, penetrating at least a portion of the semiconductor substrate, and connected to the active layer. The semiconductor chip also including a first chip connection pad having a first height and a first width, located on the second surface of the semiconductor substrate, and connected to the first through electrode, and a second chip connection pad having a second height greater than the first height and a second width greater than the first width, located on the second surface of the semiconductor substrate, and connected to the second through electrode.

公开(公告)号：US11271304B2

公开(公告)日：2022-03-08

申请号：US16965904

申请日：2019-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaeup Yoo ,  Woosuk Kang ,  Youngjae Ko ,  Sewoong Kim ,  Sangbong Sung ,  Sanggon Shin ,  Inyoung Lee ,  Jinwoo Jung ,  Suk Hyun

IPC: H01Q1/27 ,  H01Q5/35 ,  H01Q1/38 ,  H01Q1/48 ,  H04M1/02 ,  H01Q1/24

Abstract: According to various embodiments, an electronic device includes a front plate, a rear plate facing away from the front plate, and a side member surrounding the space between the front plate and the rear plate. The side member comprises: a housing including a conductive annular member; at least one mounting member connected to the side member and detachably mounted to a portion of the human body such that the rear plate is configured to be oriented toward a portion of the human body; a substrate (PCB) disposed in parallel with the front plate in the space and including a ground plane; at least one wireless communication circuit disposed on the substrate; a first electrical path connected between the wireless communication circuit and a first point of the conductive annular member; and a second electrical path connected between the ground plane and a second point of the conductive annular member, wherein a first region of the conductive annular member defined between the first point and the second point has a first length, and a second region of the conductive annular member defined between the first point and the second point has a second length that is shorter than the first length, wherein the side member includes an extension part disposed in the space and extending along a first region of the annular member or a portion of the second region and may include a conductive pattern electrically connected to the wireless communication circuit. Various other embodiments may be possible. Various embodiments may be possible.

公开(公告)号：US10608329B2

公开(公告)日：2020-03-31

申请号：US15845703

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo Jung ,  Taeyoung Kim ,  Inyoung Lee ,  Wonseok Jeong ,  Jae-Bong Chun

IPC: H01Q1/32 ,  H01Q1/27 ,  H01Q1/48 ,  H04B5/00 ,  H01Q1/38 ,  H04W4/80 ,  H01Q9/42

Abstract: A device is provided. The device includes a housing forming at least one portion of a surface of the device, wherein the at least one portion of the surface includes first and second surfaces facing opposite to each other; a display at least partially housed in the housing and including a display area visible via at least one portion of the first surface; a substantially circular radiating element at least partially forming the first surface; a ground element between the first and second surfaces; a conductive element below the ground element; wireless communication circuitry electrically connected with the radiating element and establishing communication with an external electronic device; and a processor electrically connecting the conductive element with the ground element if a radiation characteristic relative to the radiating element satisfies a condition; and disconnecting the conductive element with the ground element if the radiation characteristic does not satisfy the condition.