公开(公告)号：US11923292B2

公开(公告)日：2024-03-05

申请号：US17307212

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkuk Bae ,  Hyunsoo Chung ,  Inyoung Lee ,  Donghyeon Jang

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5226 ,  H01L21/76873 ,  H01L23/3128 ,  H01L24/09 ,  H01L24/17

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad disposed on the semiconductor substrate, and a pillar pattern disposed on the conductive pad. The semiconductor device further includes a solder seed pattern disposed on the pillar pattern, and a solder portion disposed on the pillar pattern and the solder seed pattern. A first width of the solder seed pattern is less than a second width of a top surface of the pillar pattern.

公开(公告)号：US11024575B2

公开(公告)日：2021-06-01

申请号：US16415469

申请日：2019-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkuk Bae ,  Hyunsoo Chung ,  Inyoung Lee ,  Donghyeon Jang

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L21/768

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad disposed on the semiconductor substrate, and a pillar pattern disposed on the conductive pad. The semiconductor device further includes a solder seed pattern disposed on the pillar pattern, and a solder portion disposed on the pillar pattern and the solder seed pattern. A first width of the solder seed pattern is less than a second width of a top surface of the pillar pattern.