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公开(公告)号：US20170001857A1
公开(公告)日：2017-01-05
申请号：US15059803
申请日：2016-03-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Hun JEONG , Chang Hyun LIM , Tae Hun LEE
CPC classification number: B81B3/0072 , B81B7/0029 , B81B7/0048 , B81B2201/0264 , B81B2203/0109 , B81B2203/0118 , B81B2203/033 , B81C1/00404 , B81C2201/0132
Abstract: Provided are sensor elements and a method of manufacturing the same. The sensor element includes a die, an active part including a frame surrounded by the die, a first trench disposed between the die and the active part, and a bridge connecting the die and the frame and a second trench being formed in the bridge, whereby electrical connection from the active part to an electrode pad may be secured and transfer of external stress to the active part may be significantly reduced through the second trench.
Abstract translation: 提供传感器元件及其制造方法。 传感器元件包括管芯，包括由管芯包围的框架的有源部件，设置在管芯和有源部件之间的第一沟槽，以及连接管芯和框架的桥和在桥中形成的第二沟槽，由此 可以确保从有源部分到电极焊盘的电连接，并且可以通过第二沟槽显着地减少对有源部分的外部应力的传递。
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公开(公告)号：US20210075396A1
公开(公告)日：2021-03-11
申请号：US16939344
申请日：2020-07-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chang Hyun LIM , Tae Hun LEE , Yong Suk KIM , Moon Chul LEE , Sang Kee YOON
Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; and an insertion layer disposed below a partial region of the piezoelectric layer. A thickness of the first electrode in an active region in which the first electrode, the piezoelectric layer, and the second electrode overlap one another is less than a thickness of a region outside the active region. An angle of inclination of an internal side surface of the insertion layer is different from an angle of inclination of an external side surface of the insertion layer.
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公开(公告)号：US20200169246A1
公开(公告)日：2020-05-28
申请号：US16435621
申请日：2019-06-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Yoon KIM , Tae Kyung LEE , Sang Kee YOON , Sung Jun LEE , Chang Hyun LIM , Nam Jung LEE , Tae Hun LEE , Moon Chul LEE
Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.
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公开(公告)号：US20200091888A1
公开(公告)日：2020-03-19
申请号：US16356164
申请日：2019-03-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hun LEE , Tae Yoon KIM , Moon Chul LEE , Chang Hyun LIM , Nam Jung LEE , Il Han LEE
Abstract: A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.
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公开(公告)号：US20180294792A1
公开(公告)日：2018-10-11
申请号：US15876791
申请日：2018-01-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Moon Chul LEE , Tah Joon PARK , Jae Chang LEE , Tae Yoon KIM , Chang Hyun LIM , Hwa Sun LEE , Tae Hun LEE , Hyun Min HWANG , Tae Kyung LEE
Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.
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Patent Agency Ranking
公开(公告)号：US20170237409A1
公开(公告)日：2017-08-17
申请号：US15274359
申请日：2016-09-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won HAN , Moon Chul LEE , Jae Chang LEE , Sang Uk SON , Tae Hun LEE
IPC: H03H9/17 , H01L41/047 , H01L41/053 , H03H9/54
CPC classification number: H03H9/17 , H01L41/047 , H01L41/053 , H03H9/13 , H03H9/173 , H03H9/54
Abstract: An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.
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公开(公告)号：US20160313201A1
公开(公告)日：2016-10-27
申请号：US14990317
申请日：2016-01-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hun LEE , Chang Hyun LIM , Dae Hun JEONG
IPC: G01L9/02
CPC classification number: G01L19/147
Abstract: A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.
Abstract translation: 压力传感器封装包括衬底，压力传感器和半导体电路。 半导体电路设置在基板的一个表面上，并且具有向基板的一个表面开放的接收空间。 压力传感器连接到基板并设置在接收空间中。
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公开(公告)号：US20210359662A1
公开(公告)日：2021-11-18
申请号：US16953431
申请日：2020-11-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Kyung LEE , Yong Suk KIM , Sang Kee YOON , Chang Hyun LIM , Tae Hun LEE , Jin Woo YI
Abstract: A bulk-acoustic wave resonator includes a resonator, including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate; and an insertion layer disposed below the piezoelectric layer, and configured to partially elevate the piezoelectric layer and the second electrode, wherein the insertion layer may be formed of a material containing silicon (Si), oxygen (O), and nitrogen (N).
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公开(公告)号：US20200087141A1
公开(公告)日：2020-03-19
申请号：US16357588
申请日：2019-03-19
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hun LEE , Kwang Su KIM , Tae Yoon KIM
Abstract: A MEMS device includes a substrate, a MEMS element portion disposed on a surface of the substrate, a cap having a cavity formed to oppose the MEMS element portion, and a diffusion prevention layer formed on at least a portion of the cap, wherein at least one of the cap and the substrate includes a bonding layer disposed outside of the cavity, and wherein the cap includes a spreading prevention portion disposed between the bonding layer and the cavity and having a V-shape in cross-section.
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公开(公告)号：US20180337656A1
公开(公告)日：2018-11-22
申请号：US15814869
申请日：2017-11-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hun LEE , Chang Hyun LIM , Tae Yoon KIM , Moon Chul LEE
Abstract: A bulk acoustic wave resonator includes a substrate including a first via and a second via, a lower electrode connection member, a lower electrode, a piezoelectric layer, an upper electrode, and an upper electrode connection member spaced apart from the lower electrode connection member. The lower electrode, the piezoelectric layer, and the upper electrode constitute a resonant portion. The lower electrode connection member electrically connects the lower electrode to the first via and supports a first edge portion of the resonant portion. The upper electrode connection member electrically connects the upper electrode to the second via and supports a second edge portion of the resonant portion. Either one or both of the upper electrode connection member and the lower electrode connection member includes a respective extension portion connected to a respective one of the first via and the second via that is disposed below the resonant portion.
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